scholarly journals Strategies for single-point diamond machining a large format germanium blazed immersion grating

2016 ◽  
Author(s):  
R. C. Montesanti ◽  
S. L. Little ◽  
P. J. Kuzmenko ◽  
J. V. Bixler ◽  
J. L. Jackson ◽  
...  
Keyword(s):  
Single Point ◽  
Large Format ◽  
Diamond Machining

Ultra-Precision Machining: Cutting With Diamond Tools

2020 ◽  
Vol 142 (11) ◽  
Author(s):  
D. A. Lucca ◽  
M. J. Klopfstein ◽  
O. Riemer
Keyword(s):  
Functional Performance ◽  
Single Point ◽  
Workpiece Material ◽  
Initial Development ◽  
Diamond Machining ◽  
Diamond Tools ◽  
Geometrical Form ◽  
The Creation ◽  
Commercial Applications ◽  
Machined Surfaces

Abstract This article is written as a tribute to Professor Frederick Fongsun Ling 1927–2014. Single-point diamond machining, a subset of a broader class of processes characterized as ultraprecision machining, is used for the creation of surfaces and components with nanometer scale surface roughnesses, and submicrometer scale geometrical form accuracies. Its initial development centered mainly on the machining of optics for energy and defense related needs. Today, diamond machining has broad applications that include the manufacture of precision freeform optics for defense and commercial applications, the structuring of surfaces for functional performance, and the creation of molds used for the replication of a broad range of components in plastic or glass. The present work focuses on a brief review of the technology. First addressed is the state of current understanding of the mechanics that govern the process including the resulting forces, energies and the size effect, forces when cutting single crystals, and resulting cutting temperatures. Efforts to model the process are then described. The workpiece material response when cutting ductile and brittle materials is also included. Then the present state of the art in machine tools, diamond tools and tool development, various cutting configurations used, and some examples of diamond machined surfaces and components are presented. A discussion on the measurement of surface topography, geometrical form, and subsurface damage of diamond machined surfaces is also included.

scholarly journals Shoulder Damage Model and Its Application for Single Point Diamond Machining of ZnSe Crystal

Materials ◽  
2021 ◽  
Vol 15 (1) ◽  
pp. 233
Author(s):  
Shenxin Yin ◽  
Huapan Xiao ◽  
Wenjun Kang ◽  
Heng Wu ◽  
Rongguang Liang
Keyword(s):  
Single Point ◽  
Orthogonal Cutting ◽  
Damage Model ◽  
Chip Thickness ◽  
Processing Parameters ◽  
Znse Crystal ◽  
Spring Back ◽  
Diamond Machining ◽  
Brittle Ductile Transition ◽  
Damage Depth

The damaging of ZnSe crystal has a significant impact on its service performance and life. Based on the specific cutting energies for brittle and ductile mode machining, a model is proposed to evaluate the damage depth in the shoulder region of ZnSe crystal during single point diamond machining. The model considers the brittle-ductile transition and spring back of ZnSe crystal. To verify the model, the elastic modulus, hardness, spring back, and friction coefficient of ZnSe crystal are measured by nanoindentation and nanoscratch tests, and its critical undeformed chip thickness is obtained by spiral scratching. Meanwhile, orthogonal cutting experiments are conducted to obtain the different shoulder regions and cutting surfaces. The shoulder damage depth is analyzed, indicating that the effect of the feed on the damage depth at a high cutting depth is stronger than that at a low one. The model is verified to be effective with an average relative error of less than 7%. Then, the model is used to calculate the critical processing parameters and achieve a smooth ZnSe surface with a roughness Sa = 1.0 nm. The model is also extended to efficiently predict the bound of the subsurface damage depth of a cutting surface. The research would be useful for the evaluation of surface and subsurface damages during the ultra-precision machining of ZnSe crystal.

Single-point diamond machining of glasses

1989 ◽  
Vol 426 (1870) ◽  
pp. 19-30 ◽  
Keyword(s):  
Single Point ◽  
Soda Lime ◽  
Depth Of Cut ◽  
Soda Lime Glass ◽  
Free Surfaces ◽  
Diamond Machining ◽  
Order Of Magnitude ◽  
Critical Depth Of Cut ◽  
Crucial Part ◽  
Very High

A machine tool of very high stiffness has been constructed and used for single-point diamond grooving of blanks of soda-lime glass and optical glassy quartz. Results show that below a critical depth of cut predicted in order of magnitude by a fracture mechanics analysis, material is removed by the action of plastic flow, leaving crack-free surfaces. Subsequent observations by scanning electron microscopy indicate that a crucial part in the detachment of ribbons of swarf is played by the operation of residual stresses after the passage of the tool, particularly in the case of the amorphous ceramic.

Production of kinoforms by single point diamond machining

Optics News ◽  
1989 ◽  
Vol 15 (12) ◽  
pp. 39_1
Author(s):  
P. P. Clark ◽  
C. Londoño
Keyword(s):  
Single Point ◽  
Diamond Machining

High resolution studies of crystalline damage induced by lapping and single-point diamond machining of Si(100)

1996 ◽  
Vol 11 (5) ◽  
pp. 1228-1237 ◽  
Author(s):  
R. R. Kunz ◽  
H. R. Clark ◽  
P. M. Nitishin ◽  
M. Rothschild ◽  
B. S. Ahern
Keyword(s):  
Single Point ◽  
Subsurface Damage ◽  
Diamond Turning ◽  
Root Mean Square Roughness ◽  
Yield Zone ◽  
Diamond Machining ◽  
Plastic Yield ◽  
Ductile Regime Machining ◽  
Slip Planes ◽  
Free Material

Si(100) wafers were prepared by both diamond turning and standard lapping and polishing techniques. For single-point diamond machining, characterization of subsurface damage resulting from ductile-regime machining identified a plastic-yield zone consisting of slip planes and dislocation networks extending 1 to 3 μm deep despite surface root-mean-square roughness values as low as 5 nm. For conventional lapping and polishing using alumina grit, a transition from brittle to ductile yield was observed for grit sizes less than 300 nm. Subsurface damage depth correlated to surface roughness in a more straightforward manner than for the diamond point machining. Completely damage-free material removal was obtained only when a chemical component to the polishing was present.

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