Time-resolved infrared radiometry (TRIR) using a focal-plane array for characterization of hidden corrosion

1993 ◽  
Author(s):  
Jane W. Maclachlan Spicer ◽  
W. D. Kerns ◽  
Leonard C. Aamodt ◽  
Robert Osiander ◽  
John C. Murphy
Keyword(s):  
Focal Plane ◽  
Focal Plane Array ◽  
Time Resolved ◽  
Infrared Radiometry ◽  
Hidden Corrosion

Surface micromachining and characterization of pyroelectric infrared ray focal plane array utilizing Pb(Zr 0.3 Ti 0.7 )O 3 thin films

2003 ◽  
Author(s):  
Sang-Ouk Ryu ◽  
Seong-Mok Cho ◽  
In-Kyu You ◽  
Sung-Min Yoon ◽  
Kwi-Dong Kim ◽  
...  
Keyword(s):  
Thin Films ◽  
Focal Plane ◽  
Focal Plane Array ◽  
Surface Micromachining

Thermal Characterization of Heat Sink Adhesive Systems for Spacecraft Electronics by Time-Resolved Infrared Radiometry

1993 ◽  
Vol 115 (1) ◽  
pp. 101-105 ◽  
Author(s):  
J. W. M. Spicer ◽  
M. G. Bevan ◽  
W. D. Kerns ◽  
H. S. Feldmesser
Keyword(s):  
Thermal Cycling ◽  
Heat Sink ◽  
Imaging Techniques ◽  
Thermal Characterization ◽  
Adhesive Systems ◽  
Time Resolved ◽  
X Ray Imaging ◽  
Destructive Analysis ◽  
Infrared Radiometry

A new thermal characterization technique, time-resolved infrared radiometry (TRIR), is used to investigate three different heat sink adhesive systems used in spacecraft electronics - a filled epoxy, a filled silicone and a tape adhesive. Measurements of heat sink efficiency are presented as a function of thermal cycling and the TRIR results are compared with ultrasonic and X-ray imaging techniques and with destructive analysis. The TRIR technique is shown to provide a measure of the relative heat sink capabilities of the different systems and can detect subsurface delamination in the filled epoxy system resulting from the development of cracks due to thermal cycling.

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