Thermal Characterization of Heat Sink Adhesive Systems for Spacecraft Electronics by Time-Resolved Infrared Radiometry

1993 ◽  
Vol 115 (1) ◽  
pp. 101-105 ◽  
Author(s):  
J. W. M. Spicer ◽  
M. G. Bevan ◽  
W. D. Kerns ◽  
H. S. Feldmesser
Keyword(s):  
Thermal Cycling ◽  
Heat Sink ◽  
Imaging Techniques ◽  
Thermal Characterization ◽  
Adhesive Systems ◽  
Time Resolved ◽  
X Ray Imaging ◽  
Destructive Analysis ◽  
Infrared Radiometry

A new thermal characterization technique, time-resolved infrared radiometry (TRIR), is used to investigate three different heat sink adhesive systems used in spacecraft electronics - a filled epoxy, a filled silicone and a tape adhesive. Measurements of heat sink efficiency are presented as a function of thermal cycling and the TRIR results are compared with ultrasonic and X-ray imaging techniques and with destructive analysis. The TRIR technique is shown to provide a measure of the relative heat sink capabilities of the different systems and can detect subsurface delamination in the filled epoxy system resulting from the development of cracks due to thermal cycling.

Time-resolved infrared radiometry (TRIR) using a focal-plane array for characterization of hidden corrosion

1993 ◽  
Author(s):  
Jane W. Maclachlan Spicer ◽  
W. D. Kerns ◽  
Leonard C. Aamodt ◽  
Robert Osiander ◽  
John C. Murphy
Keyword(s):  
Focal Plane ◽  
Focal Plane Array ◽  
Time Resolved ◽  
Infrared Radiometry ◽  
Hidden Corrosion

Micro-structural characterization of materials using synchrotron hard X-ray imaging techniques

2015 ◽  
Author(s):  
Ashish Agrawal ◽  
Balwant Singh ◽  
Yogesh Kashyap ◽  
P. S. Sarkar ◽  
Mayank Shukla ◽  
...  
Keyword(s):  
Structural Characterization ◽  
Imaging Techniques ◽  
X Ray ◽  
X Ray Imaging ◽  
Characterization Of Materials

Experimental and Computational Characterization of a Heat Sink Tester

2007 ◽  
Author(s):  
Aalok Trivedi ◽  
Nikhil Lakhkar ◽  
Madhusudhan Iyengar ◽  
Michael Ellsworth ◽  
Roger Schmidt ◽  
...  
Keyword(s):  
Heat Sink ◽  
Accurate Determination ◽  
Thermal Characterization ◽  
High Heat ◽  
Heat Fluxes ◽  
Thermal Design ◽  
Heat Sinks ◽  
Junction Temperature ◽  
Air Cooling

With the continuing industry trends towards smaller, faster and higher power devices, thermal management continues to be extremely important in the development of electronics. In this era of high heat fluxes, air cooling still remains the primary cooling solution in desktops mainly due to its cost. The primary goal of a good thermal design is to ensure that the chip can function at its rated frequency or speed while maintaining the junction temperature within the specified limit. The first and foremost step in measurement of thermal resistance and hence thermal characterization is accurate determination of junction temperature. Use of heat sinks as a thermal solution is well documented in the literature. Previously, the liquid cooled cold plate tester was studied using a different approach and it was concluded that the uncertainty in heat transfer coefficient was within 8% with errors in appropriate parameters, this result was supported by detailed uncertainty analysis based on Monte-Carlo simulations. However, in that study the tester was tested computationally. In this paper, testing and characterization of a heat sink tester is presented. Heat sinks were tested according to JEDEC JESD 16.1 standard for forced convection. It was observed that the error between computational and experimental values of thermal resistances was 10% for the cases considered.

Thermal Characterization of Copper Microchannel Heat Sink for Power Electronics Cooling

2009 ◽  
Vol 23 (2) ◽  
pp. 371-380 ◽  
Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Masataka Mochizuki ◽  
Thang Nguyen ◽  
Tien Nguyen
Keyword(s):  
Power Electronics ◽  
Heat Sink ◽  
Electronics Cooling ◽  
Thermal Characterization ◽  
Microchannel Heat Sink
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