Analysis of diffraction intensities in the Fresnel region for the x-ray lithography process optimization (Poster Paper)

1992 ◽  
Author(s):  
Hyung Joun Yoo
Keyword(s):  
Process Optimization ◽  
X Ray ◽  
Lithography Process ◽  
Fresnel Region ◽  
Poster Paper

Comparative study of x-ray lithography process optimization using theoretical and empirical tools

1994 ◽  
Author(s):  
Whitson G. Waldo ◽  
Cristiano Capasso ◽  
Azalia A. Krasnoperova ◽  
Mumit Khan ◽  
James W. Taylor ◽  
...  
Keyword(s):  
Comparative Study ◽  
Process Optimization ◽  
X Ray ◽  
Lithography Process

Image formation in x-ray lithography: Process optimization

1992 ◽  
Vol 17 (1-4) ◽  
pp. 135-139 ◽  
Author(s):  
F. Cerrina ◽  
J.Z.Y. Guo ◽  
S. Turner ◽  
L. Ocola ◽  
M. Khan ◽  
...  
Keyword(s):  
Process Optimization ◽  
Image Formation ◽  
X Ray ◽  
Lithography Process

Lithography Process Challenges for 3D and 2.5D Applications

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 000398-000424
Author(s):  
Doug Shelton ◽  
Tomii Kume
Keyword(s):  
High Resolution ◽  
Process Optimization ◽  
Mass Production ◽  
Low Cost ◽  
High Density ◽  
Through Silicon Via ◽  
Key Technology ◽  
Lithography Process ◽  
Advanced Packaging

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon will continue its discussion of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications.

Lithography Process Optimization for 3D and 2.5D Applications

2013 ◽  
Vol 2013 (1) ◽  
pp. 000790-000793 ◽  
Author(s):  
Doug Shelton ◽  
Tomii Kume
Keyword(s):  
High Resolution ◽  
Process Optimization ◽  
Preliminary Data ◽  
Mass Production ◽  
Low Cost ◽  
High Density ◽  
Through Silicon Via ◽  
Key Technology ◽  
Lithography Process ◽  
Advanced Packaging

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon continues its investigation of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications also preliminary data illustrating 450 mm wafer process challenges.

Fabrication of X-Ray Masks Using the Silicon Direct Write Electron-Beam Lithography Process and Complementary Electron-Sensitive Resists

2002 ◽  
Vol 41 (Part 1, No. 6B) ◽  
pp. 4122-4126
Author(s):  
Eric Lavallée ◽  
Jacques Beauvais ◽  
Dominique Drouin ◽  
Mélanie Cloutier ◽  
Pan Yang ◽  
...  
Keyword(s):  
Electron Beam ◽  
Electron Beam Lithography ◽  
Direct Write ◽  
X Ray ◽  
Lithography Process

Performances of the CXrL x-ray beamlines (Poster Paper)

1992 ◽  
Author(s):  
Richard K. Cole III ◽  
Paul D. Anderson ◽  
Gregory M. Wells ◽  
Eric Brodsky ◽  
Kuniaki Yamazaki ◽  
...  
Keyword(s):  
X Ray ◽  
Poster Paper

UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale

2009 ◽  
Vol 86 (4-6) ◽  
pp. 636-638 ◽  
Author(s):  
H. Schmitt ◽  
B. Amon ◽  
S. Beuer ◽  
S. Petersen ◽  
M. Rommel ◽  
...  
Keyword(s):  
Process Optimization ◽  
Nanoimprint Lithography ◽  
Electron Device ◽  
Lithography Process
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