Mechanically reliable hybrid organosilicate glasses for advanced interconnects

2020 ◽  
Vol 38 (6) ◽  
pp. 060601
Author(s):  
Karsu Ipek Kilic ◽  
Reinhold H. Dauskardt
Keyword(s):  
Organosilicate Glasses

Optimized Materials Properties for Organosilicate Glasses Produced by Plasma-Enhanced Chemical Vapor Deposition

2003 ◽  
Vol 766 ◽  
Author(s):  
M.L. O'Neill ◽  
R.N. Vrtis ◽  
J.L. Vincent ◽  
A.S. Lukas ◽  
E.J. Karwacki ◽  
...  
Keyword(s):  
Vapor Deposition ◽  
Material Properties ◽  
Chemical Vapor ◽  
Film Structure ◽  
Structure And Properties ◽  
Materials Properties ◽  
Precursor Structure ◽  
Processing Platform ◽  
The Relationship ◽  
Organosilicate Glasses

AbstractIn this paper we examine the relationship between precursor structure and material properties for films produced from several leading organosilicon precursors on a common processing platform. Results from our study indicate that for the precursors tested the nature of the precursor has little effect upon film composition but significant impact on film structure and properties.

The effect of the pore topology on the elastic modulus of organosilicate glasses

2013 ◽  
Vol 28 (9) ◽  
pp. 1262-1268 ◽  
Author(s):  
Kong-Boon Yeap ◽  
Malgorzata Kopycinska-Mueller ◽  
Lei Chen ◽  
Yu Chen ◽  
Marco Jungmann ◽  
...  
Keyword(s):  
Elastic Modulus ◽  
Image Position ◽  
Organosilicate Glasses

Abstract

Interfacial strengths of organosilicate glasses deposited on silicon wafers

2008 ◽  
Vol 108 (1) ◽  
pp. 115-119
Author(s):  
T.C. Liu ◽  
Sanboh Lee ◽  
B.T. Chen ◽  
S.M. Jang
Keyword(s):  
Silicon Wafers ◽  
Organosilicate Glasses

High-Modulus Spin-On Organosilicate Glasses for Nanoporous Applications

2007 ◽  
Vol 19 (5) ◽  
pp. 705-710 ◽  
Author(s):  
H. W. Ro ◽  
K. Char ◽  
E.-c. Jeon ◽  
H.-J. Kim ◽  
D. Kwon ◽  
...  
Keyword(s):  
High Modulus ◽  
Organosilicate Glasses

Understanding the Impact of Porosity and Pore Structure in Ultra Low Dielectric Constant Organosilicate Glasses

2012 ◽  
Vol 1428 ◽  
Author(s):  
Irene J. Hsu ◽  
Raymond N. Vrtis ◽  
Jennifer E. Al-Rashid ◽  
Anupama Mallikarjunan ◽  
Kathleen E. Theodorou ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Mechanical Strength ◽  
Pore Structure ◽  
Pore Size Distribution ◽  
Low Dielectric Constant ◽  
Film Properties ◽  
Low Dielectric ◽  
The Impact ◽  
Organosilicate Glasses ◽  
Highly Porous

ABSTRACTRecently there have been a number of reports indicating concern relating to the effect of porosity, pore size distribution, and pore interconnectivity on the integration of highly porous ultra low-k organosilicate glasses (OSGs) as back-end-of-line (BEOL) interconnect dielectrics. In an effort to address these concerns a number of options to control the skeleton and pore structure of OSGs have been proposed, from adding alternative OSG precursors to alternative porogen precursors. In all these options there is a need to balance pore structure modification with critical film properties such as dielectric constant and mechanical strength. In this context, this paper examines porosity and its impact on film properties for highly porous ultra low dielectric constant films. A series of PDEMS® porous OSG films were deposited by plasma enchanced chemical vapor deposition (PECVD) from DEMS® precursor (diethoxymethylsilane) and porogen ATRP (alpha-terpenine). The percent porosity and pore interconnectivity of these films relative to the dielectric constant were measured by ellipsometric porosimetry (EP) and positron annihilation spectroscopy (PALS) respectively. Porosity and pore-size distribution for films deposited using several different species (structure former or porogen precursors) were examined using EP in an effort to understand the impact of the chemical nature of the precursor on pore morphology. Results from these depositions show that it is possible to deposit films with smaller pores using alternative structure formers (ASFs) with bulky organic groups, although there are tradeoffs with respect to other film characteristics. The addition of a separate porogen (ATRP) to the ASF lowered the dielectric constant and the addition of DEMS® precursor to the ASF/ATRP mix gave the films added structural integrity and mechanical strength. Such a fundamental understanding of structure-property relationships will help support successful integration of these porous OSG films.

Bottom-up Modeling of the Elastic Properties of Organosilicate Glasses and their Relation to Composition and Network Defects

2011 ◽  
Vol 1297 ◽  
Author(s):  
Jan M. Knaup ◽  
Han Li ◽  
Joost J. Vlassak ◽  
Efthimios Kaxiras
Keyword(s):  
Integrated Circuits ◽  
Density Functional ◽  
Amorphous Materials ◽  
Tight Binding ◽  
Topological Defects ◽  
Low Density ◽  
Carbon Doped ◽  
Mechanical And Electrical Properties ◽  
Organosilicate Glasses ◽  
Large Model

ABSTRACTOrganosilicate glasses (OSG), also known as SiCOH or carbon-doped oxide are used as low-k inter-metal dielectrics for integrated circuits. The material must fulfill two conflicting requirements: It has to have low density to reduce the dielectric constant and be mechanically stable enough to withstand mechanical stress during subsequent production steps. Experimental advances in improving their mechanical and electrical properties have not yet been theoretically examined at the ab initio level, due to the relatively large model sizes necessary for amorphous materials. We employ the density-functional based tight-binding (DFTB) method to achieve an accurate description of OSG properties at different compositions. We analyze the influence of composition and topological defects on the density and bulk modulus of non-porous OSG. We find that the dependence of density and stiffness on chemical composition is of different nature. This difference is traced to a transition between different mechanisms of elastic deformation in silica glass and in silicon hydrocarbide, which is also the reason for different sensitivity to topological defects in the two materials.

CMP of Organosilicate Glasses

2002 ◽  
pp. 97-118
Author(s):  
Christopher L. Borst ◽  
William N. Gill ◽  
Ronald J. Gutmann
Keyword(s):  
Organosilicate Glasses
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