Silicon surface cleaning by oxidation with electron cyclotron resonance oxygen plasma after contact hole dry etching

1995 ◽  
Vol 13 (3) ◽  
pp. 902 ◽  
Author(s):  
K. Sakuma
Keyword(s):  
Cyclotron Resonance ◽  
Silicon Surface ◽  
Oxygen Plasma ◽  
Electron Cyclotron Resonance ◽  
Dry Etching ◽  
Surface Cleaning ◽  
Electron Cyclotron

Insituinvestigation of silicon surface cleaning and damage by argon electron cyclotron resonance plasmas

1994 ◽  
Vol 64 (10) ◽  
pp. 1233-1235 ◽  
Author(s):  
Y. Z. Hu ◽  
P. P. Buaud ◽  
Y. Wang ◽  
L. Spanos ◽  
E. A. Irene
Keyword(s):  
Cyclotron Resonance ◽  
Silicon Surface ◽  
Electron Cyclotron Resonance ◽  
Surface Cleaning ◽  
Electron Cyclotron

Low Temperature Silicon Oxidation With Electron Cyclotron Resonance Oxygen Plasma

1991 ◽  
Vol 235 ◽  
Author(s):  
K. T. Sung ◽  
S. W. Pang
Keyword(s):  
Low Temperature ◽  
Microwave Power ◽  
Cyclotron Resonance ◽  
Oxygen Plasma ◽  
Permanent Magnets ◽  
Electron Cyclotron Resonance ◽  
Electron Cyclotron ◽  
Rf Power ◽  
Source Distance ◽  
Ecr Source

ABSTRACTSilicon was oxidized at low temperature with an oxygen plasma generated by an electron cyclotron resonance (ECR) source. The ECR source utilized a multicusp magnetic field formed by permanent magnets. Microwave power at 2.45 GHz was applied to the source and if power at 13.56 MHz was applied to the sample stage. Si oxidation was studied as a function of source distance, pressure, microwave power, and rf power. The oxide thickness increases with microwave and rf power but decreases with source distance. The oxidation rate increases with pressure up to 12 mTorr, men decreases at higher pressure. The relative emission intensities in the plasma monitored using optical emission spectroscopy showed similar dependence on the source distance and microwave power. Oxidation temperature was estimated to be <100°C. Using ellipsometry and X-ray photoelectron spectroscopy, the oxidized films were found to be close to that of thermal oxide with refractive index at 1.45 and oxygen to silicon ratio of 2. From the current-voltage and capacitance-voltage measurements, the breakdown fields of these oxide films were 6.3 MV/cm and the fixed charge densities were 7×1010 cm−2.

Patterning of LiGaO2 and LiAlO2 by Wet and Dry Etching

1996 ◽  
Vol 449 ◽  
Author(s):  
J. W. Lee ◽  
S. J. Pearton ◽  
C. R. Abernathy ◽  
R. G. Wilson ◽  
B. L. Chai ◽  
...  
Keyword(s):  
Cyclotron Resonance ◽  
High Selectivity ◽  
Electron Cyclotron Resonance ◽  
Dry Etching ◽  
Electron Cyclotron ◽  
Acid Solutions ◽  
Lattice Constants ◽  
Etch Rates ◽  
Dry Etch

ABSTRACTLiGaO2 and LiAlO2 have similar lattice constants to GaN, and may prove useful as substrates for III-nitride epitaxy. We have found that these materials may be wet chemically etched in a number of acid solutions, including HF, at rates between 150–40,000 Å/min. Dry etching with SF6/Ar plasmas provides faster rates than Cl2/Ar or CH4/H2/Ar under Electron Cyclotron Resonance conditions, indicating the fluoride etch products are more volatile that their chloride or metalorganic/hydride counterparts. Dry etch rates are low ( < 2, 000 Å/min), providing high selectivity (>5) over the nitrides. The incorporation of hydrogen in these materials is also of interest because this could provide a reservoir of hydrogen that may passivate dopants in overlying nitride films. In 2H implanted samples, 50 % of the deuterium is lost by evolution from the surface by annealing at 400 °C for 20 min and all of the deuterium is gone at 700°C. The diffusivity of 2H is ∼10-13 cm2/s at 250°C in LiA1O2, approximately two orders of magnitude higher than in LiGaO2.

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