Erratum: ‘‘GaSb-oxide removal and surface passivation using an electron cyclotron resonance hydrogen source’’ [J. Vac. Sci. Technol. B 10, 1856 (1992)]

Author(s):  
Z. Lu
1991 ◽  
Vol 58 (11) ◽  
pp. 1143-1145 ◽  
Author(s):  
Z. Lu ◽  
M. T. Schmidt ◽  
D. Chen ◽  
R. M. Osgood ◽  
W. M. Holber ◽  
...  

1992 ◽  
Vol 61 (5) ◽  
pp. 616-616
Author(s):  
Z. Lu ◽  
M. T. Schmidt ◽  
D. Chen ◽  
R. M. Osgood ◽  
W. M. Holber ◽  
...  

2000 ◽  
Vol 622 ◽  
Author(s):  
J. T. Hsieh ◽  
O. Breitschädel ◽  
M. Rittner ◽  
L. W. Fu ◽  
H. Schweizer

ABSTRACTElectron cyclotron resonance (ECR) excited N2 plasma exposure were performed to explore a possibility of a robust surface passivation on Ar+ ion beam etched GaN. We adopted Taguchi orthogonal design to optimize the ECR operating parameters with respect to reverse breakdown voltage (VB) and then used the results to determine the VB dependence on the parameters close to the optimum operating point. Rather consistent results were obtained by Taguchi and normal experimental methods. It is clearly indicated that the radio frequency (rf) chuck power play the most important role on the plasma passivation. After N2 plasma treatment, the diode reverse breakdown voltage is drastically restored from 15V to 95V. With the aid of N2 plasma exposure, the Schottky characteristics of ion beam etched GaN can be thus effectively improved.


1994 ◽  
Vol 30 (1) ◽  
pp. 84-85 ◽  
Author(s):  
R.J. Shul ◽  
D.J. Rieger ◽  
C. Constantine ◽  
A.G. Baca ◽  
C. Barratt

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