Study of substrate bias effect on corrosion susceptibility of thin film magnetic disks by accelerated chemical tests

1998 ◽  
Vol 16 (3) ◽  
pp. 1745-1749 ◽  
Author(s):  
Charles C. Wang ◽  
Ray W. J. Chia ◽  
Jerry K. Lee ◽  
Wing T. Tang
2008 ◽  
Vol 516 (23) ◽  
pp. 8315-8318 ◽  
Author(s):  
Ryoko Horie ◽  
Nobuhiro Yasui ◽  
Yoshihiro Ohashi ◽  
Tohru Den

2007 ◽  
Vol 46 (7A) ◽  
pp. 4042-4045 ◽  
Author(s):  
Chang-Wook Han ◽  
Min-Koo Han ◽  
Nack-Bong Choi ◽  
Chang-Dong Kim ◽  
Ki-Yong Kim ◽  
...  

Author(s):  
M. Park ◽  
S.J. Krause ◽  
S.R. Wilson

Cu alloying in Al interconnection lines on semiconductor chips improves their resistance to electromigration and hillock growth. Excess Cu in Al can result in the formation of Cu-rich Al2Cu (θ) precipitates. These precipitates can significantly increase corrosion susceptibility due to the galvanic action between the θ-phase and the adjacent Cu-depleted matrix. The size and distribution of the θ-phase are also closely related to the film susceptibility to electromigration voiding. Thus, an important issue is the precipitation phenomena which occur during thermal device processing steps. In bulk alloys, it was found that the θ precipitates can grow via the grain boundary “collector plate mechanism” at rates far greater than allowed by volume diffusion. In a thin film, however, one might expect that the growth rate of a θ precipitate might be altered by interfacial diffusion. In this work, we report on the growth (lengthening) kinetics of the θ-phase in Al-Cu thin films as examined by in-situ isothermal aging in transmission electron microscopy (TEM).


1996 ◽  
Vol 451 ◽  
Author(s):  
Gerald S. Frankel

ABSTRACTCorrosion of thin film structures commonly used in electronic and magnetic devices is discussed. Typical failure modes are presented, and galvanic corrosion is discussed in some detail since it is one common problem with such devices. A graphical explanation for the determination of the ohmic potential drop during galvanic corrosion is presented. The corrosion problem of thin film disks is shown to have changed during the past ten years owing to changes in disk structure. The corrosion susceptibility of two antiferromagnetic alloys used for exchange coupling to soft magnetic layers is discussed.


2017 ◽  
Vol 178 ◽  
pp. 17-20 ◽  
Author(s):  
Rodrigo Trevisoli Doria ◽  
Renan Trevisoli ◽  
Michelly de Souza ◽  
Sylvain Barraud ◽  
Maud Vinet ◽  
...  

1996 ◽  
Vol 32 (5) ◽  
pp. 3699-3701 ◽  
Author(s):  
C. Gao ◽  
Y.C. Lee ◽  
J. Chao ◽  
M. Russak
Keyword(s):  

Vacuum ◽  
2007 ◽  
Vol 82 (2) ◽  
pp. 154-157 ◽  
Author(s):  
M. Marton ◽  
T. Ižák ◽  
M. Veselý ◽  
M. Vojs ◽  
M. Michalka ◽  
...  

2020 ◽  
Vol 116 (2) ◽  
pp. 022412
Author(s):  
K. Liu ◽  
S. C. Ma ◽  
Z. S. Zhang ◽  
X. W. Zhao ◽  
B. Yang ◽  
...  

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