High quality semicontinuous deep reactive ion etching of silicon for the creation of x-ray lenses

2017 ◽  
Vol 35 (3) ◽  
pp. 031206 ◽  
Author(s):  
Karola Richter ◽  
André Mocker ◽  
Johann-Wolfgang Bartha
Keyword(s):  
Reactive Ion Etching ◽  
High Quality ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
X Ray ◽  
The Creation

Use of deep reactive ion etching in the fabrication of high-efficiency high-resolution crystal x-ray analyzers

2002 ◽  
Author(s):  
Bor-Yuan Shew ◽  
Ruey-Shing Huang ◽  
Duan-Jen Wang ◽  
Shen-Yaw Perng ◽  
Chien-Kuang Kuan ◽  
...  
Keyword(s):  
High Resolution ◽  
High Efficiency ◽  
Reactive Ion Etching ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
X Ray

Magnetic field-assisted finishing for micropore X-ray focusing mirrors fabricated by deep reactive ion etching

CIRP Annals ◽  
2010 ◽  
Vol 59 (1) ◽  
pp. 351-354 ◽  
Author(s):  
H. Yamaguchi ◽  
R.E. Riveros ◽  
I. Mitsuishi ◽  
U. Takagi ◽  
Y. Ezoe ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Reactive Ion Etching ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
X Ray

Deep reactive ion etching of silicon and diamond for the fabrication of planar refractive hard X-ray lenses

2003 ◽  
Vol 67-68 ◽  
pp. 453-460 ◽  
Author(s):  
B. Nöhammer ◽  
C. David ◽  
H. Rothuizen ◽  
J. Hoszowska ◽  
A. Simionovici
Keyword(s):  
Reactive Ion Etching ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
X Ray

scholarly journals Towards the Fabrication of High-Aspect-Ratio Silicon Gratings by Deep Reactive Ion Etching

Micromachines ◽  
2020 ◽  
Vol 11 (9) ◽  
pp. 864 ◽  
Author(s):  
Zhitian Shi ◽  
Konstantins Jefimovs ◽  
Lucia Romano ◽  
Marco Stampanoni
Keyword(s):  
Aspect Ratio ◽  
Etching Rate ◽  
Critical Role ◽  
Reactive Ion Etching ◽  
Chamber Pressure ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
X Ray ◽  
Aspect Ratios ◽  
Profile Control

The key optical components of X-ray grating interferometry are gratings, whose profile requirements play the most critical role in acquiring high quality images. The difficulty of etching grating lines with high aspect ratios when the pitch is in the range of a few micrometers has greatly limited imaging applications based on X-ray grating interferometry. A high etching rate with low aspect ratio dependence is crucial for higher X-ray energy applications and good profile control by deep reactive ion etching of grating patterns. To achieve this goal, a modified Coburn–Winters model was applied in order to study the influence of key etching parameters, such as chamber pressure and etching power. The recipe for deep reactive ion etching was carefully fine-tuned based on the experimental results. Silicon gratings with an area of 70 × 70 mm2, pitch size of 1.2 and 2 μm were fabricated using the optimized process with aspect ratio α of ~67 and 77, respectively.

scholarly journals Deep reactive ion etching of silicon moulds for the fabrication of diamond x-ray focusing lenses

2013 ◽  
Vol 23 (12) ◽  
pp. 125018 ◽  
Author(s):  
A M Malik ◽  
O J L Fox ◽  
L Alianelli ◽  
A M Korsunsky ◽  
R Stevens ◽  
...  
Keyword(s):  
Reactive Ion Etching ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
X Ray

X-ray optics fabricated by deep reactive ion etching (invited)

2002 ◽  
Vol 73 (3) ◽  
pp. 1464-1468 ◽  
Author(s):  
K. D. Finkelstein ◽  
Sami Rosenblatt ◽  
Paul Cottle
Keyword(s):  
Reactive Ion Etching ◽  
Ion Etching ◽  
Ray Optics ◽  
Deep Reactive Ion Etching ◽  
X Ray
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