Fabrication and characterization of a tungsten microneedle array based on deep reactive ion etching technology

2016 ◽  
Vol 34 (5) ◽  
pp. 052002 ◽  
Author(s):  
Shenglin Ma ◽  
Yanming Xia ◽  
Yaohua Wang ◽  
Kuili Ren ◽  
Rongfeng Luo ◽  
...  
Keyword(s):  
Reactive Ion Etching ◽  
Microneedle Array ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
Fabrication And Characterization

DEEP REACTIVE ION ETCHING FOR PILLAR TYPE NANOPHOTONIC CRYSTAL

2005 ◽  
Vol 04 (04) ◽  
pp. 567-574 ◽  
Author(s):  
SELIN H. G. TEO ◽  
A. Q. LIU ◽  
G. L. SIA ◽  
C. LU ◽  
J. SINGH ◽  
...  
Keyword(s):  
Silicon Oxide ◽  
Reactive Ion Etching ◽  
Gas Flows ◽  
Two Dimensional ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
Deep Uv ◽  
The Many ◽  
Two Dimensional Photonic Crystal

Experimental results and techniques developed for time multiplexed deep reactive ion etching of nano-photonic crystals are presented. Specifically, the high aspect ratio pillar type two-dimensional photonic crystal (PhC) structure on silicon is fabricated and studied for its high potential in application to lightwave circuits and also for discussion of the many unique challenges involved in its fabrication process as opposed to standard larger scale devices. In the experiments, patterns of nano-dots were first obtained using deep UV lithography and transferred to a silicon oxide hardmask prior to DRIE processing. The iteration of DRIE experiments with varying process parameters then allowed for a characterization of the varying impact of each etching parameter such as coil/ platen/ etch power, multiplexing cycling gas flows and timing patterns etc. After much optimization of sidewall etch angle and also reduction of the scalloping effect, the latest result obtained for such nano-pillar type PhC designed for application in communication is derived to have a high AR of 33.

On the Fabrication Parameters of Buried Microchannels Integrated in In-Plane Silicon Microprobes

2012 ◽  
Vol 729 ◽  
pp. 210-215 ◽  
Author(s):  
Z. Fekete ◽  
A. Pongrácz ◽  
G. Márton ◽  
P. Fürjes
Keyword(s):  
Reactive Ion Etching ◽  
Dry Etching ◽  
Ion Etching ◽  
Deep Reactive Ion Etching ◽  
Functional Aspects ◽  
Etching Parameters ◽  
Fabrication Parameters ◽  
Insight Into

This paper aims the characterization of buried microchannels in silicon realized by deep reactive ion etching. The effects of dry etching parameters on the integrability into hollow microprobes are thoroughly investigated from both technological and functional aspects. Results are supposed to give physiology related probe designers a deeper insight into microfabrication-related issues.

Streamlined cryogenic deep reactive ion etching protocol for hybrid micronozzle arrays

2011 ◽  
Vol 21 (10) ◽  
pp. 105001
Author(s):  
Ahmet Erten ◽  
Milan Makale ◽  
Xuekun Lu ◽  
Bernd Fruhberger ◽  
Santosh Kesari ◽  
...  
Keyword(s):  
Reactive Ion Etching ◽  
Ion Etching ◽  
Deep Reactive Ion Etching

scholarly journals Correction to Ultrahigh Resolution Titanium Deep Reactive Ion Etching

2017 ◽  
Vol 9 (27) ◽  
pp. 23263-23263
Author(s):  
Bryan W. K. Woo ◽  
Shannon C. Gott ◽  
Ryan A. Peck ◽  
Dong Yan ◽  
Mathias W. Rommelfanger ◽  
...  
Keyword(s):  
Reactive Ion Etching ◽  
Ultrahigh Resolution ◽  
Ion Etching ◽  
Deep Reactive Ion Etching

Deep reactive ion etching of sub-micrometer trenches with ultra high aspect ratio

2014 ◽  
Vol 113 ◽  
pp. 35-39 ◽  
Author(s):  
Jayalakshmi Parasuraman ◽  
Anand Summanwar ◽  
Frédéric Marty ◽  
Philippe Basset ◽  
Dan E. Angelescu ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Reactive Ion Etching ◽  
Ion Etching ◽  
Deep Reactive Ion Etching
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