Effect of water uptake on the fracture behavior of low-k organosilicate glass

2014 ◽  
Vol 32 (3) ◽  
pp. 031512 ◽  
Author(s):  
Xiangyu Guo ◽  
Joseph E. Jakes ◽  
Samer Banna ◽  
Yoshio Nishi ◽  
J. Leon Shohet
Keyword(s):  
Water Uptake ◽  
Fracture Behavior ◽  
Effect Of Water ◽  
Organosilicate Glass ◽  
Low K

The effect of water uptake on the mechanical properties of low-k organosilicate glass

2013 ◽  
Vol 114 (8) ◽  
pp. 084103 ◽  
Author(s):  
X. Guo ◽  
J. E. Jakes ◽  
M. T. Nichols ◽  
S. Banna ◽  
Y. Nishi ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Water Uptake ◽  
Effect Of Water ◽  
Organosilicate Glass ◽  
Low K

scholarly journals Effect of Water Ingress on the Mechanical and Chemical Properties of Polybutylene Terephthalate Reinforced with Glass Fibers

Materials ◽  
2021 ◽  
Vol 14 (5) ◽  
pp. 1261
Author(s):  
Catarina S. P. Borges ◽  
Alireza Akhavan-Safar ◽  
Eduardo A. S. Marques ◽  
Ricardo J. C. Carbas ◽  
Christoph Ueffing ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Water Absorption ◽  
Water Uptake ◽  
Significant Influence ◽  
Water Immersion ◽  
Water Diffusion ◽  
Polybutylene Terephthalate ◽  
Chemical Changes ◽  
Water Ingress ◽  
Effect Of Water

Short fiber reinforced polymers are widely used in the construction of electronic housings, where they are often exposed to harsh environmental conditions. The main purpose of this work is the in-depth study and characterization of the water uptake behavior of PBT-GF30 (polybutylene terephthalate with 30% of short glass fiber)as well as its consequent effect on the mechanical properties of the material. Further analysis was conducted to determine at which temperature range PBT-GF30 starts experiencing chemical changes. The influence of testing procedures and conditions on the evaluation of these effects was analyzed, also drawing comparisons with previous studies. The water absorption behavior was studied through gravimetric tests at 35, 70, and 130 °C. Fiber-free PBT was also studied at 35 °C for comparison purposes. The effect of water and temperature on the mechanical properties was analyzed through bulk tensile tests. The material was tested for the three temperatures in the as-supplied state (without drying or aging). Afterwards, PBT-GF30 was tested at room temperature following water immersion at the three temperatures. Chemical changes in the material were also analyzed through Fourier-transform infrared spectroscopy (FTIR). It was concluded that the water diffusion behavior is Fickian and that PBT absorbs more water than PBT-GF30 but at a slightly higher rate. However, temperature was found to have a more significant influence on the rate of water diffusion of PBT-GF30 than fiber content did. Temperature has a significant influence on the mechanical properties of the material. Humidity contributes to a slight drop in stiffness and strength, not showing a clear dependence on water uptake. This decrease in mechanical properties occurs due to the relaxation of the polymeric chain promoted by water ingress. Between 80 and 85 °C, after water immersion, the FTIR profile of the material changes, which suggests chemical changes in the PBT. The water absorption was simulated through heat transfer analogy with good results. From the developed numerical simulation, the minimum plate size to maintain the water ingress unidirectional was 30 mm, which was validated experimentally.

scholarly journals Water diffusion and fracture behavior in nanoporous low-k dielectric film stacks

2009 ◽  
Vol 106 (3) ◽  
pp. 033503 ◽  
Author(s):  
Han Li ◽  
Ting Y. Tsui ◽  
Joost J. Vlassak
Keyword(s):  
Fracture Behavior ◽  
Dielectric Film ◽  
Water Diffusion ◽  
Low K

Comparison of the Fracture Behavior of Brittle ILD Films used in the BEOL in Dry and Wet Environment using Nanoindentation

2006 ◽  
Vol 914 ◽  
Author(s):  
Eva Simonyi ◽  
Michael Lane ◽  
Erik Liniger ◽  
Alfred Grill
Keyword(s):  
Fracture Toughness ◽  
Film Thickness ◽  
Manufacturing Process ◽  
Fracture Behavior ◽  
Imaging Methods ◽  
Afm Imaging ◽  
Critical Film Thickness ◽  
Low K

AbstractDuring the manufacturing process of the BEOL the low-k brittle ILD dielectrics are exposed to wet environments. These environments could and do affect the films fracture toughness, the so called critical film thickness, above which spontaneous cracking occurs. Nanoindentation combined with AFM imaging methods allow to study these phenomena.

Spectroscopic Ellipsometry as a Potential In-Line Optical Metrology Tool For Relative Porosity Measurements of Low- K Dielectric Films

2001 ◽  
Vol 697 ◽  
Author(s):  
N.V. Edwards ◽  
J. Vella ◽  
Q. Xie ◽  
S. Zollner ◽  
D. Werho ◽  
...  
Keyword(s):  
Optical Properties ◽  
Spectral Range ◽  
Spectroscopic Ellipsometry ◽  
Optical Metrology ◽  
Dielectric Films ◽  
Electron Densities ◽  
Organosilicate Glass ◽  
Relative Porosity ◽  
Low K ◽  
Porosity Measurements

AbstractThe optical properties of organosilicate glass (OSG) samples were investigated with spectroscopic ellipsometry. We found that samples with dramatically higher hardness had higher indices of refraction (RI) and thus higher electron densities and lower relative porosities than films with lower hardnesses. The reverse was true for films with low hardnesses. As well, these films did not have the same optical properties as porous SiO2 across the spectral range measured, which we show has significant implications for the in-line optical metrology of these materials.

Subcritical Delamination of Dielectric and Metal Films from Low-k Organosilicate Glass (OSG) Thin Films in Buffered pH Solutions

2003 ◽  
Vol 795 ◽  
Author(s):  
Y. Lin ◽  
J. J. Vlassak ◽  
T. Y. Tsui ◽  
A. J. McKerrow
Keyword(s):  
Thin Films ◽  
Ph Value ◽  
Dielectric Materials ◽  
Barrier Films ◽  
Interface Delamination ◽  
Organosilicate Glass ◽  
Controlled Fracture ◽  
Ph Buffer ◽  
Subcritical Fracture ◽  
Low K

ABSTRACTUnderstanding subcritical fracture of low-k dielectric materials and barrier thin films in buffered solutions of different pH value is of both technical and scientific importance. Subcritical delamination of dielectric and metal barrier films from low-k organosilicate glass (OSG) films in pH buffer solutions was studied in this work. Crack path and subcritical fracture behavior of OSG depends on the choice of barrier layers. For the OSG/TaN system, fracture takes place in the OSG layer near the interface, while in OSG/SiNx system, delamination occurs at the interface. Delamination behavior of both systems is well described by a hyperbolic sine model that had been developed previously based on a chemical reaction controlled fracture process at the crack tip. The threshold toughness of both systems decreases linearly with increasing pH value. The slopes of the reaction-controlled regime of the crack velocity curves for both systems are independent of pH as predicted by the model. Near transport-controlled regime behavior was observed in OSG/TaN system.

Moisture Adsorption in Plasma-Damaged Porous Low-k Dielectrics

2008 ◽  
Vol 1079 ◽  
Author(s):  
Ekaterina Vinogradova ◽  
Casey E Smith ◽  
DW Mueller ◽  
Andrew J McKerrow ◽  
Rick Reidy
Keyword(s):  
Moisture Absorption ◽  
Deuterium Oxide ◽  
Grazing Angle ◽  
Film Surface ◽  
Ambient Conditions ◽  
Exchange Reactions ◽  
Plasma Etch ◽  
Organosilicate Glass ◽  
Altered Surface ◽  
Low K

ABSTRACTPlasma etch/ash processes can induce changes in low-k film surface/bulk chemistries and topographies resulting in increased water absorption, surface roughness, and metal intrusion. After ashing, the altered surface character of the low-k can impact wetting, adhesion, and, consequently, the resistance of subsequently deposited barrier layers. In this work, we describe the use of deuterium oxide as means of measuring moisture penetration into low-k films. Film chemistries have been monitored using grazing angle attenuated total reflectance (GATR) and transmission Fourier transform infrared spectroscopy (FTIR). To study moisture absorption in porous spin-on and CVD low-k films, unashed and ashed films have been exposed to D2O liquid and vapor treatments under “dry” nitrogen. The extent of D2O uptake, removal and exchange reactions has been studied using transmission and GATR FTIR methods because the D2O and O-D adsorption peaks are distinct from water and O-H as well as other low-k adsorptions. This method can be used to study Si-OH species because deuterium can exchange with hydrogen within silanols under ambient conditions while methyl groups are much less likely to exchange. Three different low-k films, a porous spin-on MSQ (k=2.2), a porous CVD (k=2.3), and an organosilicate glass (OSG, k=2.85) have been used. In FTIR spectra, unashed low-k films show minimal D2O adsorption. In MSQ hydrogen-ashed films, the data suggest the presence of deuterium oxide and O-D peaks. Further, D2O adsorption appears to be considerably higher for ashed films as would be expected due to the hydrophobicity of these films. In the CVD films, there does not appear to be as marked a difference. This method permits the introduction of a chemical “marker” into low-k wet and ambient processes allowing one to distinguish among adsorptions from different aqueous sources.

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