Optimum ambient N[sub 2] pressure during HfAlO pulsed-laser deposition in Pt∕SBT∕HfAlO∕Si field effect transistors

Author(s):  
M. Takahashi ◽  
T. Horiuchi ◽  
S. Wang ◽  
Q.-H. Li ◽  
S. Sakai
2015 ◽  
Vol 27 (25) ◽  
pp. 3748-3754 ◽  
Author(s):  
Zhibin Yang ◽  
Jianhua Hao ◽  
Shuoguo Yuan ◽  
Shenghuang Lin ◽  
Hei Man Yau ◽  
...  

2016 ◽  
Vol 4 (43) ◽  
pp. 10386-10394 ◽  
Author(s):  
Md. Shafiqur Rahman ◽  
Susmita Ghose ◽  
Liang Hong ◽  
Pradip Dhungana ◽  
Abbas Fahami ◽  
...  

SrTiO3 films on GaAs, grown by molecular beam epitaxy, serve as buffer layers for epitaxial growth of ferromagnetic or multiferroic films using pulsed laser deposition.


2004 ◽  
Vol 25 (1) ◽  
pp. 334-338 ◽  
Author(s):  
Jun Yamaguchi ◽  
Kenji Itaka ◽  
Tomohiro Hayakawa ◽  
Keiichiro Arai ◽  
Mitsugu Yamashiro ◽  
...  

2004 ◽  
Vol 843 ◽  
Author(s):  
A. R. Phani ◽  
J. E. Krzanowski

ABSTRACTNitride thin films have potential applications in different areas of silicon device technology, namely as diffusion barrier in metallization schemes, rectifying and ohmic contacts, and gate electrodes in field effect transistors. In the present investigation, TiN and CrN films have been deposited by reactive pulsed laser deposition technique using Ti and Cr targets at 10mTorr background pressure of N2. Si (100) and AISI 440C steel substrates were used for the present study. Films were deposited at different temperatures in the range of 200°C to 600°C. The deposited films exhibited densely packed grain, with smooth and uniform structures. X-ray Photoelectron Spectroscopy (XPS) analysis of the films showed and 50% Ti and 40% of N in TiN films, 45% of Cr and 45% of N in CrN films deposited on Si (111), with the balance mostly oxygen, indicating near stoichiometric composition of the deposited nitride thin films. Hardness of the films changed from 22 GPa at 200°C to 30 GPa at 600°C for TiN, whereas for CrN we obtained 26 GPa at 200°C to 31 GPa at 600°C. The residual stress in the films showed a change from compressive stress at 200°C to tensile stress at 600°C in both the cases. Friction coefficient of the films were measured by pin-on-disk technique for all films, up to the tested limit of 10, 000 cycles at 1 N load and found to be very high (≥ 1) in both cases.


2018 ◽  
Vol 2018 ◽  
pp. 1-5 ◽  
Author(s):  
Lei Jiao ◽  
Yuehui Wang ◽  
Yusong Zhi ◽  
Wei Cui ◽  
Zhengwei Chen ◽  
...  

Direct growth of uniform wafer-scale two-dimensional (2D) layered materials using a universal method is of vital importance for utilizing 2D layers into practical applications. Here, we report on the structural and transport properties of large-scale few-layer MoS2 back-gated field effect transistors (FETs), fabricated using conventional pulsed laser deposition (PLD) technique. Raman spectroscopy and transmission electron microscopy results confirmed that the obtained MoS2 layers on SiO2/Si substrate are multilayers. The FETs devices exhibit a relative high on/off ratio of 5 × 102 and mobility of 0.124 cm2V−1S−1. Our results suggest that the PLD would be a suitable pathway to grow 2D layers for future industrial device applications.


2004 ◽  
Vol 79 (4-6) ◽  
pp. 807-809 ◽  
Author(s):  
C. Hirose ◽  
Y. Matsumoto ◽  
Y. Yamamoto ◽  
H. Koinuma

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