Optimization of a Cl[sub 2]–H[sub 2] inductively coupled plasma etching process adapted to nonthermalized InP wafers for the realization of deep ridge heterostructures
2005 ◽
Vol 23
(4)
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pp. 1521
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2011 ◽
Vol 4
(1)
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pp. 34-39
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2011 ◽
Vol 29
(5)
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pp. 051802
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2005 ◽
Vol 34
(6)
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pp. 740-745
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2015 ◽
Vol 32
(5)
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pp. 058102
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