Wafer level microarcing model in 90nm chemical-vapor deposition low-k via etch on 300mm silicon-on-insulator substrate

2006 ◽  
Vol 24 (4) ◽  
pp. 1404-1409 ◽  
Author(s):  
Hai Cong ◽  
Chun Hui Low ◽  
Yelehanka Ramachandramurthy Pradeep ◽  
Xin Zhang ◽  
Perera Chandima ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Silicon On Insulator ◽  
Wafer Level ◽  
Low K ◽  
Insulator Substrate

Chemical-vapor-deposition growth and characterization of epitaxial 3C–SiC films on SOI substrates with thin silicon top layers

2001 ◽  
Vol 16 (1) ◽  
pp. 24-27 ◽  
Author(s):  
C. K. Moon ◽  
H. J. Song ◽  
J. K. Kim ◽  
J. H. Park ◽  
S. J. Jang ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Silicon On Insulator ◽  
Significant Shift ◽  
Misfit Dislocations ◽  
Chemical Vapor Deposition Growth ◽  
Hydrogen Flow ◽  
Soi Substrates ◽  
Sic Films

Epitaxial 3C–SiC films were grown by chemical vapor deposition on the silicon-on-insulator (SOI) substrates with 20–75-nm-thick Si top layers. A relatively low growth temperature of 1150 °C and a reduced hydrogen flow rate of 1 lpm during the precarbonization process was necessary to preserve the SOI structure and thereby obtain high-quality SiC films. The transmission electron microscopy observation of the SiC/SOI structures revealed high density of misfit dislocations in the SiC film, but no dislocation within the top Si layer. The x-ray-diffraction results did not show any significant shift of the (400) SiC peak position among the SiC/Si and the SiC/SOI samples. This strongly suggests that the Si top layer is not deformed during the SiC/SOI growth and the strain within the 3C–SiC layer is not critically affected by substituting the Si substrate with the SOI substrate, even when the Si top layer is as thin as 20 nm.

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