Effect of initial resist thickness on residual layer thickness of nanoimprinted structures

Author(s):  
Hae-Jeong Lee ◽  
Hyun Wook Ro ◽  
Christopher L. Soles ◽  
Ronald L. Jones ◽  
Eric K. Lin ◽  
...  
2008 ◽  
Vol 85 (5-6) ◽  
pp. 846-849 ◽  
Author(s):  
Nikolaos Kehagias ◽  
Vincent Reboud ◽  
Clivia M. Sotomayor Torres ◽  
Vadim Sirotkin ◽  
Alexander Svintsov ◽  
...  

Author(s):  
Sungkwan Koo ◽  
Sung Ho Lee ◽  
Jeong Dae Kim ◽  
Jung Goo Hong ◽  
Hyoung Won Baac ◽  
...  

2009 ◽  
Author(s):  
Shinmo An ◽  
Hyun-Shik Lee ◽  
Se-Guen Park ◽  
Beom-Hoan O ◽  
Seung-Gol Lee ◽  
...  

2007 ◽  
Vol 121-123 ◽  
pp. 649-652
Author(s):  
Ki Don Kim ◽  
Young Suk Sim ◽  
Jun Ho Jeong ◽  
Hyun Kee Sohn ◽  
Eung Sug Lee ◽  
...  

We investigated the non-uniformity of the residual layer thickness caused by wafer deformation in an experiment that examined different wafer thicknesses using UV-NIL with an element-wise patterned stamp (EPS). Experiments using the EPS were performed on an EVG®620-NIL. Severe deformation of the wafer served as an obstacle to the spread of resin drops, which caused non-uniformity of the residual layer thickness. We also simulated the imprint process using a simplified model and finite element method to analyze the non-uniformity.


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