Thermal stability of trimethylsilylated mesoporous silica thin films as the ultralow-k dielectric for copper interconnects
2005 ◽
Vol 23
(5)
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pp. 2034
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Keyword(s):
2004 ◽
Vol 43
(6A)
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pp. 3340-3345
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Keyword(s):
2021 ◽
Vol 46
(5)
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pp. 4137-4153
2006 ◽
2006 ◽
Vol 279
(1-2)
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pp. 256-265
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2006 ◽
Vol 16
(1)
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pp. 54-58
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1998 ◽
Vol 16
(2)
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pp. 477-481
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2001 ◽
Vol 141
(1)
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pp. 55-61
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