Thermal stability of trimethylsilylated mesoporous silica thin films as the ultralow-k dielectric for copper interconnects

Author(s):  
J. Y. Chen ◽  
F. M. Pan ◽  
L. Chang ◽  
A. T. Cho ◽  
K. J. Chao
2007 ◽  
Vol 102 (4) ◽  
pp. 044507 ◽  
Author(s):  
A. P. Singh ◽  
D. D. Gandhi ◽  
R. Moore ◽  
G. Ramanath

2021 ◽  
Vol 46 (5) ◽  
pp. 4137-4153
Author(s):  
Neha Verma ◽  
Rob Delhez ◽  
Niek M. van der Pers ◽  
Frans D. Tichelaar ◽  
Amarante J. Böttger

2005 ◽  
Vol 17 (8) ◽  
pp. 1035-1039 ◽  
Author(s):  
H. Fukumoto ◽  
S. Nagano ◽  
N. Kawatsuki ◽  
T. Seki

1998 ◽  
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pp. 477-481 ◽  
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Yong Tae Kim ◽  
Chul Soon Kwon ◽  
Dong Joon Kim ◽  
Jong-Wan Park ◽  
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