High aspect ratio pattern transfer in imprint lithography using a hybrid mold

2004 ◽  
Vol 22 (6) ◽  
pp. 2764 ◽  
Author(s):  
Wen-Chang Liao ◽  
Steve Lien-Chung Hsu
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Pattern Transfer ◽  
Imprint Lithography

Wafer-Scale, Highly-Ordered Silicon Nanowires Produced by Step-and-Flash Imprint Lithography and Metal-Assisted Chemical Etching

2012 ◽  
Vol 1512 ◽  
Author(s):  
Jian-Wei Ho ◽  
Qixun Wee ◽  
Jarrett Dumond ◽  
Li Zhang ◽  
Keyan Zang ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Cross Sections ◽  
Silicon Nanowires ◽  
High Aspect Ratio ◽  
Chemical Etching ◽  
Semiconductor Device ◽  
Imprint Lithography ◽  
Wafer Level ◽  
Conventional Photolithography ◽  
Metal Assisted Chemical Etching

ABSTRACTA combinatory approach of Step-and-Flash Imprint Lithography (SFIL) and Metal-Assisted Chemical Etching (MacEtch) was used to generate near perfectly-ordered, high aspect ratio silicon nanowires (SiNWs) on 4" silicon wafers. The ordering and shapes of SiNWs depends only on the SFIL nanoimprinting mould used, thereby enabling arbitary SiNW patterns not possible with nanosphere and interference lithography (IL) to be generated. Very densely packed SiNWs with periodicity finer than that permitted by conventional photolithography can be produced. The height of SiNWs is, in turn, controlled by the etching duration. However, it was found that very high aspect ratio SiNWs tend to be bent during processing. Hexagonal arrays of SiNW with circular and hexagonal cross-sections of dimensions 200nm and less were produced using pillar and pore patterned SFIL moulds. In summary, this approach allows highlyordered SiNWs to be fabricated on a wafer-level basis suitable for semiconductor device manufacturing.

Sub-20 nm Si fins with high aspect ratio via pattern transfer using fullerene-based spin-on-carbon hard masks

2019 ◽  
Vol 210 ◽  
pp. 8-13 ◽  
Author(s):  
Li-Ting Tseng ◽  
Dimitrios Kazazis ◽  
Xiaolong Wang ◽  
Carmen M. Popescu ◽  
Alex P.G. Robinson ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Pattern Transfer

High-aspect ratio grating fabrication by imprint lithography

2004 ◽  
Author(s):  
Yoshihiko Hirai ◽  
Takaaki Konishi ◽  
Tomohiro Kanakugi ◽  
Hiroaki Kawata ◽  
Hisao Kikuta
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Imprint Lithography ◽  
Grating Fabrication

X-Ray Fabrication of Repetitive Structures

1999 ◽  
Author(s):  
Yadong Liu ◽  
Paul Sheng
Keyword(s):  
Aspect Ratio ◽  
Process Planning ◽  
High Aspect Ratio ◽  
Pattern Transfer ◽  
Grid Structure ◽  
X Ray ◽  
Gear Teeth ◽  
Process Characteristics ◽  
Micro Level ◽  
Advanced Applications

Abstract The fabrication of repetitive mechanical structures in millimeter range by deep x-ray micromachining is reported in this paper. With higher energy and wider x-ray beam lines available, macro-sized mechanical structures with micro-level features can be fabricated by the modified LIGA process to meet the need on high aspect ratio, high precision components in advanced applications. Through metrology study, better understanding of the process characteristics is achieved to provide important information on error modes in pattern transfer, which could be ultimately used in product design and process planning. Case studies of a rectangular HESSI grid structure and involute gear teeth are presented.

Electroforming of Ni mold for imprint lithography using high-aspect-ratio PMMA microstructures fabricated by proton beam writing

2011 ◽  
Vol 88 (8) ◽  
pp. 2145-2148 ◽  
Author(s):  
Yusuke Tanabe ◽  
Hiroyuki Nishikawa ◽  
Yoshihiro Seki ◽  
Takahiro Satoh ◽  
Yasuyuki Ishii ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Proton Beam ◽  
High Aspect Ratio ◽  
Imprint Lithography ◽  
Proton Beam Writing

scholarly journals Advancing next generation nanolithography with infiltration synthesis of hybrid nanocomposite resists

2019 ◽  
Vol 7 (29) ◽  
pp. 8803-8812 ◽  
Author(s):  
Nikhil Tiwale ◽  
Ashwanth Subramanian ◽  
Kim Kisslinger ◽  
Ming Lu ◽  
Jiyoung Kim ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Vapor Phase ◽  
High Aspect Ratio ◽  
Pattern Transfer ◽  
Hybrid Nanocomposite ◽  
Performance Parameters ◽  
Next Generation ◽  
Transfer Capability

Novel positive-tone hybrid resists developed by vapor-phase inorganic infiltration feature fully tunable resist performance parameters and high-aspect-ratio pattern transfer capability.

Progress and perspectives in dry processes for nanoscale feature fabrication: fine pattern transfer and high-aspect-ratio feature formation

2019 ◽  
Vol 58 (SE) ◽  
pp. SE0802 ◽  
Author(s):  
Taku Iwase ◽  
Yoshito Kamaji ◽  
Song Yun Kang ◽  
Kazunori Koga ◽  
Nobuyuki Kuboi ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Pattern Transfer ◽  
Fine Pattern
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