Characterization of sidewall roughness of InP/InGaAsP etched using inductively coupled plasma for low loss optical waveguide applications

2003 ◽  
Vol 21 (6) ◽  
pp. 2888 ◽  
Author(s):  
J. W. Bae ◽  
W. Zhao ◽  
J. H. Jang ◽  
I. Adesida ◽  
A. Lepore ◽  
...  
Keyword(s):  
Optical Waveguide ◽  
Inductively Coupled Plasma ◽  
Low Loss ◽  
Sidewall Roughness ◽  
Inductively Coupled

Low Loss High Mesa Optical Waveguides Based on InGaAsP/InP Heterostructures

2006 ◽  
Vol 6 (11) ◽  
pp. 3562-3566
Author(s):  
W. S. Choi ◽  
J. H. Jang ◽  
B.-A. Yu ◽  
Y. L. Lee ◽  
W. Zhao ◽  
...  
Keyword(s):  
Optical Waveguides ◽  
Inductively Coupled Plasma ◽  
Three Dimensional ◽  
Low Loss ◽  
Sidewall Roughness ◽  
Scattering Loss ◽  
Inductively Coupled ◽  
Atomic Force ◽  
Fabry Perot ◽  
Propagation Losses

Low loss high mesa optical waveguides were fabricated on InGaAsP/InP heterostructures by utilizing inductively-coupled-plasma reactive ion etching (ICP-RIE) and electron beam lithography technique. The fabrication process was optimized by measuring sidewall roughness of deep-etched waveguides. Atomic force microscope loaded with carbon nanotude was used to obtain three-dimensional image of the etched sidewall of waveguides. The obtained statistical information such as rms roughness and correlation length was used to theoretically calculate scattering loss of waveguides. Several waveguides with different number of sharp bends and the length were fabricated and their propagation losses were measured by modified Fabry-Perot method. The measured propagation losses were compared with theoretically calculated losses.

Manufacture of High Aspect Ratio Bulk Titanium Micro-Parts by Inductively Coupled Plasma Etching

2008 ◽  
Author(s):  
Gang Zhao ◽  
Qiong Shu ◽  
Yue Li ◽  
Jing Chen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Inductively Coupled Plasma ◽  
Etching Rate ◽  
Sidewall Roughness ◽  
Inductively Coupled ◽  
Icp Etching ◽  
Novel Technology ◽  
Micro Parts ◽  
Etching Mask

A novel technology is developed to fabricate high aspect ratio bulk titanium micro-parts by inductively coupled plasma (ICP) etching. An optimized etching rate of 0.9 μm/min has been achieved with an aspect ratio higher than 10:1. For the first time, SU-8 is used as titanium etching mask instead of the traditional hard mask such as TiO2 or SiO2. With an effective selectivity of 3 and a spun-on thickness beyond 100 μm, vertical etching sidewall and low sidewall roughness are obtained. Ultra-deep titanium etching up to 200 μm has been realized, which is among the best of the present reports. Titanium micro-springs and planks are successfully fabricated with this approach.

scholarly journals Speciation of organometals using a synchronizing GC-EIMS and GC-ICPMS system for simultaneous detection

2014 ◽  
Vol 29 (6) ◽  
pp. 1132-1137 ◽  
Author(s):  
Lucia D'Ulivo ◽  
Lu Yang ◽  
Yong-Lai Feng ◽  
John Murimboh ◽  
Zoltán Mester
Keyword(s):  
Gas Chromatography ◽  
Mass Spectrometer ◽  
Inductively Coupled Plasma ◽  
Simultaneous Detection ◽  
Electron Ionization ◽  
Ionization Mass ◽  
Inductively Coupled

Accurate quantitation and characterization of organometals are successfully achieved by splitting the gas chromatography (GC) flow to both an electron ionization mass spectrometer (EIMS) and an inductively coupled plasma mass spectrometer (ICPMS).

Geochemical Characterization of Lapita Pottery Via Inductively Coupled Plasma-mass Spectrometry (ICP-MS)

Archaeometry ◽  
2004 ◽  
Vol 46 (1) ◽  
pp. 35-46 ◽  
Author(s):  
D. J. Kennett ◽  
A. J. Anderson ◽  
M. J. Cruz ◽  
G. R. Clark ◽  
G. R. Summerhayes
Keyword(s):  
Mass Spectrometry ◽  
Inductively Coupled Plasma ◽  
Geochemical Characterization ◽  
Inductively Coupled ◽  
Icp Ms ◽  
Plasma Mass Spectrometry
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