Effect of Microstructure on the Electromigration Life of Thin Film Al–Cu Conductors
1972 ◽
Vol 9
(1)
◽
pp. 283-283
◽
2014 ◽
Vol 39
(30)
◽
pp. 17092-17103
◽
1995 ◽
Vol 31
(6)
◽
pp. 2833-2835
◽
2014 ◽
Vol 52
(12)
◽
pp. 1003-1008
1993 ◽
Vol 61
(7)
◽
pp. 905-906
◽
Keyword(s):