Transient Liquid Phase Bonding of Inconel 718 With Ni and BNi-2 Nano-Braze Materials

2019 ◽  
Author(s):  
Denzel Bridges ◽  
Anming Hu ◽  
Raymond Xu
Keyword(s):  
Solid State ◽  
Liquid Phase ◽  
Heating Rate ◽  
Bonding Strength ◽  
Inconel 718 ◽  
Bonding Temperature ◽  
Particle Diameter ◽  
Transient Liquid Phase ◽  
Surface Melting ◽  
Ni Nanoparticles

Abstract Ni nanoparticles were successfully used to join Inconel 718 via transient liquid phase (TLP) bonding in a vacuum environment. Ni nanoparticles of 20 nm, 29 nm, and 41 nm in diameter were synthesized by controlling the reducing agent injection rate and joined at up to 1050 °C and heating rate 5–15 °C/min. Based on the Gibbs-Thomson equation and surface melting models, joining using Ni nanoparticles occurs due to competing solid-state sintering and surface melting processes. It was found that faster heating rate; higher maximum bonding temperature, and larger particle size resulted in higher bonding strength. Using a faster heating rate suppresses the amount of solid-state particle-particle sintering that occurs at lower temperatures, where particle-Inconel 718 joining is less active. The suppression of particle-particle sintering as a function of particle diameter is also discussed. The maximum bonding strength achieved is 243 MPa. The fracture surface for Ni nanoparticle-bonded joints demonstrated intergranular fracture (low strength joints) and a combination of cleavage and microvoid coalescence (high strength joints).

Phase Transition during Slow Heating in the Mixture Insert Metal Using TLP Bonded Interlayer

2005 ◽  
Vol 475-479 ◽  
pp. 639-642
Author(s):  
Sung Wook Kim ◽  
Chang Hee Lee
Keyword(s):  
Phase Transition ◽  
Liquid Phase ◽  
Heating Rate ◽  
Base Metal ◽  
Bonding Temperature ◽  
High Vacuum ◽  
Transient Liquid Phase ◽  
Slow Heating ◽  
Metal Powders ◽  
Insert Metal

This study was carried out to investigate the effect of heating rate on the phase transition between additive base metal powder and liquid insert metal during transient liquid phase (TLP) diffusion bonding of Ni-based superalloy GTD-111. Heating rates studied were 10, 1, 0.5 and 0.1°Cs-1 in high vacuum conditions (3×10-5 torr) by means of a high frequency induction furnace. When heated at lower than 0.5°Cs-1, the transition of dissolution to solidification occurred during heating. In the case of very slow heating, the dissolution quickly finished at a lower temperature, and solidification soon started. The separated grains of additive base metal powders supplied the lager interface area for the diffusion of boron. Solidification transition temperatures of liquid phase were affected by the increase of diffusion interface and of duration time during slow heating. A minimum heating rate required to heat insert materials to a normal TLP isothermal bonding temperature of GTD-111 (≈1150°C) without a dissolution-solidification transition during heating should be higher than 1°Cs-1.

Effect of Heating Rate on Transient Liquid Phase Diffusion Bonding of Ni-Based Superalloy GTD-111

2004 ◽  
Vol 449-452 ◽  
pp. 133-136 ◽  
Author(s):  
Woo Hyuk Choi ◽  
Sung Wook Kim ◽  
Chang Hee Lee ◽  
Jung Cheol Jang
Keyword(s):  
Liquid Phase ◽  
Heating Rate ◽  
Diffusion Bonding ◽  
Completion Time ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Isothermal Solidification ◽  
Solidification Behavior ◽  
Phase Diffusion ◽  
Time Required

This study was carried out to investigate the effect of heating rate on dissolution and solidification behavior during transient liquid phase diffusion bonding of Ni-based superalloy GTD-111. The heating rate was varied by 0.1K/sec, 1K/sec, 10K/sec to the bonding temperatures 1373K and 1423K in vacuum. When the heating rate was slower and the bonding temperature was higher, the completion time of dissolution after reaching bonding temperature decreased. When the heating rate was very slow, the solidification proceeded before reaching bonding temperature and the time required for the completion of isothermal solidification was shorter. However, when the total time required for completion of solidification from the beginning of heating was considered, heating at 0.1K/sec was nearly the same as heating at 10K/sec.

Bonding temperature effects on the wide gap transient liquid phase bonding of Inconel 718 using BNi-2 paste filler metal

2019 ◽  
Vol 484 ◽  
pp. 1223-1233 ◽  
Author(s):  
Guangxu Yan ◽  
Ayan Bhowmik ◽  
Balasubramanian Nagarajan ◽  
Xu Song ◽  
Sung Chyn Tan ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Inconel 718 ◽  
Temperature Effects ◽  
Filler Metal ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Transient Liquid Phase Bonding ◽  
Wide Gap

scholarly journals Fail-Safe Joints between Copper Alloy (C18150) and Nickel-Based Superalloy (GH4169) Made by Transient Liquid Phase (TLP) Bonding and Using Boron-Nickel (BNi-2) Interlayer

Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1504
Author(s):  
Chengcong Zhang ◽  
Amir Shirzadi
Keyword(s):  
Solid State ◽  
Liquid Phase ◽  
Diffusion Bonding ◽  
Copper Alloy ◽  
Power Plants ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Heat Conducting ◽  
Nickel Based Superalloy ◽  
Tlp Bonding

Joining heat conducting alloys, such as copper and its alloys, to heat resistant nickel-based superalloys has vast applications in nuclear power plants (including future fusion reactors) and liquid propellant launch vehicles. On the other hand, fusion welding of most dissimilar alloys tends to be unsuccessful due to incompatibilities in their physical properties and melting points. Therefore, solid-state processes, such as diffusion bonding, explosive welding, and friction welding, are considered and commercially used to join various families of dissimilar materials. However, the solid-state diffusion bonding of copper alloys normally results in a substantial deformation of the alloy under the applied bonding load. Therefore, transient liquid phase (TLP) bonding, which requires minimal bonding pressure, was considered to join copper alloy (C18150) to a nickel-based superalloy (GH4169) in this work. BNi-2 foil was used as an interlayer, and the optimum bonding time (keeping the bonding temperature constant as 1030 °C) was determined based on microstructural examinations by optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS), tensile testing, and nano-hardness measurements. TLP bonding at 1030 °C for 90 min resulted in isothermal solidification, hence obtained joints free from eutectic phases. All of the tensile-tested samples failed within the copper alloy and away from their joints. The hardness distribution across the bond zone was also studied.

scholarly journals Transient Liquid Phase Bonding of Semi-Solid Metal 7075 Aluminum Alloy using ZA27 Zinc Alloy Interlayer

Metals ◽  
2018 ◽  
Vol 8 (8) ◽  
pp. 637 ◽  
Author(s):  
Chaiyoot Meengam ◽  
Yongyuth Dunyakul ◽  
Dech Maunkhaw ◽  
Suppachai Chainarong
Keyword(s):  
Aluminum Alloy ◽  
Liquid Phase ◽  
Bonding Strength ◽  
Transient Liquid Phase ◽  
Solid Metal ◽  
Bonding Time ◽  
Zinc Alloy ◽  
Transient Liquid Phase Bonding ◽  
Bonding Zone ◽  
Semi Solid

Transient Liquid Phase Bonding (TLPB) process of semi-solid metal 7075 aluminum alloys (SSM7075) using 50 μm thick of ZA27 zinc alloys as interlayers for the experiment were carried out under bonding temperatures of 480 and 540 °C and bonding times of 30, 60, 90 and 120 min respectively. In the bonding zone, the semi-solid state of ZA27 zinc alloy interlayers were diffused into the SSM7075 aluminum alloy. Examination of the bonding zone using Scanning Electron Microscope (SEM) and Energy-dispersive X-ray spectroscopy (EDS) showed that the precipitation of the intermetallic compound of η(Zn–Al–Cu), β(Al2Mg3Zn3), T′(Zn10Al35Cu55) and MgZn2 were formed in the bonding zone. The better homogenized microstructure in the bonding zone was formed when increasing bonding time and bonding temperature. The highest bonding strength was recorded at 17.44 MPa and average hardness was at 87.67 HV with the bonding time of 120 min and temperature at 540 °C. Statistically, the coefficient of determination analysis of bonding strength data was at 99.1%.

Microstructural Evolution of TLP Bonded Ti3Al-Nb Alloy Joints

2014 ◽  
Vol 33 (6) ◽  
pp. 525-529 ◽  
Author(s):  
X.Y. Gu ◽  
Z.Z. Duan ◽  
X.P. Gu ◽  
D.Q. Sun
Keyword(s):  
Solid Solution ◽  
Liquid Phase ◽  
Microstructural Evolution ◽  
Bonding Temperature ◽  
Pure Copper ◽  
Transient Liquid Phase ◽  
Base Material ◽  
Isothermal Solidification ◽  
Bonding Time ◽  
Solid Solution Phase

AbstractIn the present study microstructural evolution in transient liquid phase (TLP) bonded Ti3Al-Nb alloy joints using a pure copper as interlayer was investigated. TLP bonded Ti3Al-Nb alloy joints composed of intermetallic compound layers were produced. Microstructural evolution of joints depended on both bonding time and bonding temperature. With increasing bonding time and bonding temperature, the joint width increased and amount of compounds in the joint decreased. The joint microstructure at 1173 K × 1 min mainly consisted of Ti (solid solution) + Ti2Cu + TiCu + Ti3Cu4 + Ti2Cu3 + TiCu4 + Cu (solid solution) phase and it changed to Ti (solid solution) + Ti2Cu + TiCu at 1223 K × 60 min. Compounds formed on cooling from the bonding temperature by liquid phase were eliminated from the joint at 1223 K × 60 min due to isothermal solidification of liquid phase. The increase of the width of joint is attributed to the composition difference between the isothermal solidification production and its adjacent base material.

scholarly journals The Effect of Transient Liquid Phase on the Joining Process of Aluminum Foam Core Sandwiches

2016 ◽  
Vol 16 (1) ◽  
pp. 48-58
Author(s):  
A. T. Tabrizi ◽  
M. Azadbeh
Keyword(s):  
Liquid Phase ◽  
Bonding Strength ◽  
Energy Dispersive Spectrometry ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Bending Test ◽  
Recent Developments ◽  
Al Foam ◽  
Joining Process ◽  
Mathematical Relations

Abstract Despite recent developments in sandwich panels production technology, there are some difficulties in joining core sandwiches. Liquid Phase Sintering is a conventional method to increase the density of powder metallurgy parts. In this paper, we applied LPS as a joining process between Al-foam and Al-metal by using Al-mixture powders with different compositions as the interlayer. At first stage, Al-Zn powder mixture was used and the possibility of this process was investigated. At later stages, we tried to increase the joint bonding strength with different Al-mixture powder compositions. 3-point bending test was applied and by using mathematical relations, bonding strengths were calculated. The highest bonding strength was obtained, about 9 kPa, when Al-Zn-Mg was used as the interlayer. Also energy dispersive spectrometry (EDS) was used to investigate the diffusion of additive elemental powders to Al-mixture powders.

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