Fabricating Microchannels in Elastomer Substrates for Stretchable Electronics

2016 ◽  
Author(s):  
Michelle C. Yuen ◽  
Rebecca K. Kramer
Keyword(s):  
Flexible Electronics ◽  
Electronic Devices ◽  
Stretchable Electronics ◽  
Flexible Substrates ◽  
Soft Sensors ◽  
Elastic Substrate ◽  
Conductive Fluid ◽  
Manufacturing Method ◽  
Flexible Devices ◽  
Soft Electronics

As flexible devices and machines become more ubiquitous, there is a growing need for similarly deformable electronics. Soft polymers continue to be widely used as stretchable and flexible substrates for soft electronics, and in particular, soft sensing. These soft sensors generally consist of a highly elastic substrate with embedded microchannels filled with a conductive fluid. Deforming the substrate deforms the embedded microchannels and induces a change in the electrical resistance through the conductive fluid. Microchannels, thus, are the foundation of flexible electronic devices and sensors. These microchannels have been fabricated using various methods, where the manufacturing method greatly impacts device functionality. In this paper, comparisons are made between the following methods of microchannel manufacturing: cast molding, 3D printing of the elastomer substrate itself, and laser ablation. Further processing of the microchannels into flexible electronics is also presented for all three methods. Lastly, recommended ranges of microchannel sizes and their associated reproducibility and accuracy measures for each manufacturing method are presented.

scholarly journals Printing the Ultra-Long Ag Nanowires Inks onto the Flexible Textile Substrate for Stretchable Electronics

Nanomaterials ◽  
2019 ◽  
Vol 9 (5) ◽  
pp. 686 ◽  
Author(s):  
Sheng-Hai Ke ◽  
Qing-Wen Xue ◽  
Chuan-Yuan Pang ◽  
Pan-Wang Guo ◽  
Wei-Jing Yao ◽  
...  
Keyword(s):  
Screen Printing ◽  
Low Cost ◽  
Electronic Devices ◽  
Cost Effective ◽  
Water Soluble ◽  
Stretchable Electronics ◽  
Intrinsic Structure ◽  
Flexible Devices ◽  
Ag Nanowires ◽  
Stretchable Circuits

Printing technology offers a simple and cost-effective opportunity to develop all-printed stretchable circuits and electronic devices, possibly providing ubiquitous, low-cost, and flexible devices. To successfully prepare high-aspect-ratio Ag nanowires (NWs), we used water and anhydrous ethanol as the solvent and polyvinylpyrrolidone (PVP) as the viscosity regulator to obtain a water-soluble Ag NWs conductive ink with good printability. Flexible and stretchable fabric electrodes were directly fabricated through screen printing. After curing at room temperature, the sheet resistance of the Ag NW fabric electrode was 1.5 Ω/sq. Under a tensile strain of 0–80% and with 20% strains applied for 200 cycles, good conductivity was maintained, which was attributed to the inherent flexibility of the Ag NWs and the intrinsic structure of the interlocked texture.

High Temperature Processable Flexible Polymer Films

2016 ◽  
Vol 16 (03) ◽  
pp. 1650038
Author(s):  
D. Shanmuga Sundar ◽  
A. Sivanantha Raja ◽  
C. Sanjeeviraja ◽  
D. Jeyakumar
Keyword(s):  
Flexible Electronics ◽  
Flexible Substrate ◽  
Electronic Devices ◽  
Visible Region ◽  
Thermal Characteristics ◽  
Index Formula ◽  
Flexible Substrates ◽  
Transparent Substrate ◽  
Flexible Polymer ◽  
Recent Developments

Recent developments in the field of flexible electronics motivated the researchers to start working in verdict of new flexible substrate for replacing the existing rigid glass and flexible plastics. Flexible substrates offer significant rewards in terms of being able to fabricate flexible electronic devices that are robust, thinner, conformable, lighter and can be rolled away when needed. In this work, a new flexible and transparent substrate with the help of organic materials such as Polydimethylsiloxane (PDMS) and tetra ethoxy orthosilicate (TEOS) is synthesized. Transmittance of about 90–95% is acquired in the visible region (400–700[Formula: see text]nm) and the synthesized substrate shows better thermal characteristics and withstands temperature up to 200[Formula: see text]C without any significant degradation. Characteristics such as transmittance ([Formula: see text]), absorption ([Formula: see text]), reflectance ([Formula: see text]), refractive index ([Formula: see text]) and extinction coefficient ([Formula: see text]) are also reported.

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

2021 ◽  
Author(s):  
Pradeep Lall ◽  
Padmanava Choudhury ◽  
Scott Miller
Keyword(s):  
Flexible Electronics ◽  
Electronic Devices ◽  
Surface Preparation ◽  
Peel Strength ◽  
Electronics Industry ◽  
Harsh Environment ◽  
Fe Model ◽  
Experimental Conditions ◽  
Flexible Devices ◽  
Cleaning Methods

Abstract Flexible devices, considered to be the next wave of electronics industry, require flexible encapsulation for protection while conforming to flexibility-needs in end applications. The characteristics of flexible electronics is not only reduced production cost but also thinner, lightweight and non-breakable which creates a new form application for the electronic devices. One such application is use to electronic devices in daily environment to monitor the vitals of one’s body. These devices are often expose to dust, sweat and moisture also they are generally subjected to flexing and folding motion which accrues stresses in those devices. These stresses and the harsh environment are often mitigated by using potting compounds, encapsulants to improve their survivability of the devices. In our study, we have chosen five different formulation of encapsulant subjected it various cure profiles to determine the adhesive strength of the various encapsulant. The benchmark peel strength was developed using a FE-model of the AU-biometric band and encapsulant peel strength at experimental conditions were compared to give us the best performing material. This paper includes the sample geometry which consists of five different encapsulants and two different substrate namely, polyimide and pet tested at four different cure schedule while the substrates were cleaned using two different cleaning methods. The encapulants are compared among each other to create a rank for possible future applications in FHE devices.

Flexible Electronic Devices From Hot Embossing Materials Transfer

2005 ◽  
Author(s):  
Ashante’ Allen ◽  
Andrew Cannon ◽  
William King ◽  
Samuel Graham
Keyword(s):  
Flexible Electronics ◽  
Low Cost ◽  
Electronic Devices ◽  
Building Blocks ◽  
Transfer Printing ◽  
Flexible Devices ◽  
Planar Surfaces ◽  
Flexible Electronic ◽  
Semiconductor Nanomaterials ◽  
Flexible Electronic Devices

The development of processing methods for flexible electronic devices is seen as an enabling technology for the creation of a new array of semiconductor products. These devices have the potential be low cost, disposable, and can be applied to deformable or non-planar surfaces. While much effort has been put into the development of amorphous silicon and organic semiconductor technology for flexible devices, semiconductor nanomaterials are of interest due to their inherently flexibility, high transport mobilities, and their unique optoelectronic and piezoelectric properties. However, the synthesis of these materials directly onto polymer substrates is not feasible due to the high temperatures or harsh chemical environments under which they are synthesized. This challenge has limited the development of flexible electronics with semiconductor nanomaterial building blocks. A number of techniques which address the manufacturing concerns include solution based processing [1,2] as well as dry transfer techniques [3–5]. In general, dry transfer printing methods carry advantages over solution based processing as the need to address substrate-fluid compatibility is mitigated.

Alkyl-π functional molecular liquids towards soft electronics

2021 ◽  
Author(s):  
Takashi Machida ◽  
Takashi Nakanishi
Keyword(s):  
Energy Harvesting ◽  
Electronic Devices ◽  
Molecular Liquids ◽  
Flexible Devices ◽  
Soft Electronics

A new trend in electronics is “soft electronics” possessing freely deformable, stretchable, and bendable features on flexible devices. Soft electronic devices have attracted attention in the fields of energy harvesting,...

scholarly journals Sheet Resistance Measurements of Conductive Thin Films: A Comparison of Techniques

Electronics ◽  
2021 ◽  
Vol 10 (8) ◽  
pp. 960
Author(s):  
Mira Naftaly ◽  
Satyajit Das ◽  
John Gallop ◽  
Kewen Pan ◽  
Feras Alkhalil ◽  
...  
Keyword(s):  
Thin Films ◽  
Sheet Resistance ◽  
Flexible Electronics ◽  
Electronic Devices ◽  
Conductivity Measurements ◽  
Terahertz Time Domain Spectroscopy ◽  
Comparison Of Techniques ◽  
Terahertz Frequencies ◽  
Conductive Thin Films ◽  
Multiple Samples

Conductive thin films are an essential component of many electronic devices. Measuring their conductivity accurately is necessary for quality control and process monitoring. We compare conductivity measurements on films for flexible electronics using three different techniques: four-point probe, microwave resonator and terahertz time-domain spectroscopy. Multiple samples were examined, facilitating the comparison of the three techniques. Sheet resistance values at DC, microwave and terahertz frequencies were obtained and were found to be in close agreement.

Stretchable Systems

2021 ◽  
Author(s):  
Yogeenth Kumaresan ◽  
Nivasan Yogeswaran ◽  
Luigi G. Occhipinti ◽  
Ravinder Dahiya
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Electrical Response ◽  
Inorganic Compounds ◽  
Stretchable Electronics ◽  
Material Research ◽  
Active Materials ◽  
Challenges And Opportunities ◽  
Integration Techniques ◽  
Strain Invariant

Stretchable electronics is one of the transformative pillars of future flexible electronics. As a result, the research on new passive and active materials, novel designs, and engineering approaches has attracted significant interest. Recent studies have highlighted the importance of new approaches that enable the integration of high-performance materials, including, organic and inorganic compounds, carbon-based and layered materials, and composites to serve as conductors, semiconductors or insulators, with the ability to accommodate electronics on stretchable substrates. This Element presents a discussion about the strategies that have been developed for obtaining stretchable systems, with a focus on various stretchable geometries to achieve strain invariant electrical response, and summarises the recent advances in terms of material research, various integration techniques of high-performance electronics. In addition, some of the applications, challenges and opportunities associated with the development of stretchable electronics are discussed.

ZnSxO1-x Films Grown on Flexible Substrates

2012 ◽  
Vol 1394 ◽  
Author(s):  
Jesse Huso ◽  
Hui Che ◽  
John L. Morrison ◽  
Dinesh Thapa ◽  
Michelle Huso ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Flexible Substrates ◽  
Semiconductor Films ◽  
Ethylene Propylene ◽  
Transmission Spectroscopy ◽  
Fluorinated Ethylene Propylene ◽  
Potential Substrate

ABSTRACTBandgap engineered ZnSxO1-x films were grown on Fluorinated Ethylene Propylene (FEP) substrates and analyzed using transmission spectroscopy. FEP is considered as a potential substrate for application in flexible electronics and semiconductor films.

Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

2009 ◽  
Author(s):  
Khalid Alzoubi ◽  
Susan Lu ◽  
Bahgat Sammakia ◽  
Mark Poliks
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Polyethylene Terephthalate ◽  
Flexible Electronics ◽  
Electrical Resistance ◽  
Thermal Stresses ◽  
Electronic Systems ◽  
Total Width ◽  
Flexible Substrates ◽  
Polyethylene Naphthalate

Flexible electronics represent an emerging area in the electronics packaging and systems integration industry with the potential for new product development and commercialization in the near future. Manufacturing electronics on flexible substrates will produce low cost devices that are rugged, light, and flexible. However, electronic systems are vulnerable to failures caused by mechanical and thermal stresses. For electronic systems on flexible substrates repeated stresses below the ultimate tensile strength or even below the yield strength will cause failures in the thin films. It is known that mechanical properties of thin films are different from those of bulk materials; so, it is difficult to extrapolate bulk material properties on thin film materials. The objective of this work is to study the behavior of thin-film metal coated flexible substrates under high cyclic bending fatigue loading. Polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) are widely used substrates in the fabrication of microelectronic devices. Factors affecting the fatigue life of thin-film coated flexible substrates were studied, including thin film thickness, temperature, and humidity. A series of experiments for sputter-deposited copper on PET substrates were performed. Electrical resistance and crack growth rate were monitored during the experiments at specified time intervals. High magnification images were obtained to observe the crack initiation and propagation in the metal film. Statistical analysis based on design of experiments concepts was performed to identify the main factors and factor’s interaction that affect the life of a thin-film coated substrate. The results of the experiments showed that the crack starts in the middle of the sample and slowly grows toward the edges. Electrical resistance increases slightly during the test until the crack length covers about 90% of the total width of the sample where a dramatic increase in the resistance takes place.

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