Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing

Integration of solid-state microchips into soft-matter, and stretchable printed electronics has been the biggest challenge against their scalable fabrication. We introduce, Pol-Gel, a simple technique for self-soldering, self-encapsulation, and self-healing, that allows low cost, scalable, and rapid fabrication of hybrid microchip-integrated ultra-stretchable circuits. After digitally printing the circuit, and placing the microchips, we trigger a Polymer-Gel transition in physically cross-linked block copolymers substrate, and silver liquid metal composite ink, by exposing the circuits to the solvent vapor. Once in the gel state, microchips penetrate to the ink and the substrate (Self-Soldering), and the ink penetrates to the substrate (Self-encapsulation). Maximum strain tolerance of ~1200% for printed stretchable traces, and >500% for chip-integrated soft circuits is achieved, which is 5x higher than the previous works. We demonstrate condensed soft-matter patches and e-textiles with integrated sensors, processors, and wireless communication, and repairing of a fully cut circuits through Pol-Gel.

Stretchable anisotropic conductive film (S-ACF) for electrical interfacing in high-resolution stretchable circuits

In stretchable electronics, high-resolution stretchable interfacing at a mild temperature is considered as a great challenge and has not been achieved yet. This study presents a stretchable anisotropic conductive film (S-ACF) that can electrically connect high-resolution stretchable circuit lines to other electrodes whether they are rigid, flexible, or stretchable. The key concepts of this study are (i) high-resolution (~50 μm) but low–contact resistance (0.2 ohm in 0.25 mm2) interfacing by periodically embedding conductive microparticles in thermoplastic film, (ii) low-temperature interfacing through the formation of chemical bonds between the S-ACF and the substrates, (iii) economical interfacing by selectively patterning the S-ACF, and (iv) direct interfacing of chips by using the adhesion of the thermoplastic matrix. We integrate light-emitting diodes on the patterned S-ACF and demonstrate stable light operation at large biaxial areal stretching (εxy = 70%).

Printing the Ultra-Long Ag Nanowires Inks onto the Flexible Textile Substrate for Stretchable Electronics

Printing technology offers a simple and cost-effective opportunity to develop all-printed stretchable circuits and electronic devices, possibly providing ubiquitous, low-cost, and flexible devices. To successfully prepare high-aspect-ratio Ag nanowires (NWs), we used water and anhydrous ethanol as the solvent and polyvinylpyrrolidone (PVP) as the viscosity regulator to obtain a water-soluble Ag NWs conductive ink with good printability. Flexible and stretchable fabric electrodes were directly fabricated through screen printing. After curing at room temperature, the sheet resistance of the Ag NW fabric electrode was 1.5 Ω/sq. Under a tensile strain of 0–80% and with 20% strains applied for 200 cycles, good conductivity was maintained, which was attributed to the inherent flexibility of the Ag NWs and the intrinsic structure of the interlocked texture.

Reliable interfaces for EGaIn multi-layer stretchable circuits and microelectronics

Multi-layer on-skin EMG with integrated chips and EgaIn stretchable circuitry for stretchable electronics, bio-monitoring and human–machine interaction.