Robust Direct-Write Dispensing Tool and Solutions for Micro/Meso-Scale Manufacturing and Packaging

Author(s):  
B. Li ◽  
P. A. Clark ◽  
K. H. Church

The development of functional and reliable miniaturized devices including Micro Electro Mechanical Systems (MEMS) has stressed the manufacturing and packaging processes. The traditional micro fabrication techniques, such as lithography, physical vapor deposition (PVD), chemical vapor deposition (CVD) and etching, are layer-by-layer processes and mostly suitable for thin-filmed devices. LIGA (an acronym from German words for lithography, electroplating, and molding) is a newly developed process for thick metallic devices; however, it involves electroplating process and high quality molds, which are hard to move after electroforming. In all the processes mentioned above, masks and photoresist processing are inevitable, which complicates the whole process and increases the processing time and the total cost. It is also well known that packaging is another barrier for the advancement of MEMS. MEMS packaging, which is required to provide mechanical support, environmental protection and electrical connection to other system components, is much more complicated as compared to electronic components due to the moving structures, fluids or chemicals involved. It is the most expensive process in micromachining. Therefore, enabling tools and technologies are greatly needed for the fabrication and packaging of complicated devices and highly integrated micro assemblies. In this paper, we will present novel direct-print dispensing techniques and robust tools for 21st century manufacturing and packaging. Comparing to other dispensing technologies such as time-pressure needle dispensing, screen printing, pin transfer and jetting, nScrypt’s pumping techniques can dispense materials with precise volume control for 10’s of Pico liter resolution, accurate placement or alignment within a few microns, conformably print on exaggerated surfaces of 10’s of centimeters, and are extremely flexible with materials and patterns. The dispensing tip (nozzle) is optimized to reduce the pressure drop as compared to the traditional tubing needles. Comparing to traditional micro fabrication technologies, our direct-print dispensing technology is maskless and thus a cost effective process. While micro-dispensing is a solution based approach, it has the advantage of not being a wet process such as wet etching or electroplating. Direct-print dispensing of micro lines, micro dots, and three-dimensional structures will be presented. The technology has a wide range of applications in the manufacturing and packaging of micro/meso-scale devices and bio structures.

1988 ◽  
Vol 116 ◽  
Author(s):  
R.A. Rudder ◽  
S.V. Hattangady ◽  
D.J. Vitkavage ◽  
R.J. Markunas

Heteroepitaxial growth of Ge on Si(100) has been accomplished using remote plasma enhanced chemical vapor deposition at 300*#x00B0;C. Reconstructed surfaces with diffraction patterns showing non-uniform intensity variations along the lengths of the integral order streaks are observed during the first 100 Å of deposit. This observation of an atomically rough surface during the initial stages of growth is an indication of three-dimensional growth. As the epitaxial growth proceeds, the diffraction patterns become uniform with extensive streaking on both the integral and fractional order streaks. Subsequent growth, therefore, takes place in a layer-by-layer, two-dimensional mode. X-ray photoelectron spectroscopy of the early nucleation stages, less than 80 Å, show that there is uniform coverage with no evidence of island formation.


Author(s):  
Jae-hyoung Park ◽  
David W. Rosen

Rapid Prototyping (RP) technology refers to the fabrication of an arbitrary three-dimensional part layer-by-layer. Laser Chemical Vapor Deposition (LCVD) is a promising RP and manufacturing process that deposits metals and ceramics by local heating of a substrate with a laser. Even though many LCVD process planning characteristics are shared with those of more common RP technologies, LCVD process planning requires new efforts due to its unique characteristics. Unlike a conventional RP technology that only builds horizontal planar layers, LCVD can build conformal layers (conform to nonplanar substrates), thin walls, and fibers (rod-shape) as build primitives. Based on these unique characteristics, we have developed the overall approach for LCVD process planning and developed several of the main methods in this approach. In this paper, we report on the overall approach, the conformal slicing algorithm, and two different 1D path generation algorithms. Two examples are presented to illustrate the application of the process planning methods.


2007 ◽  
Vol 1002 ◽  
Author(s):  
Bo Li ◽  
Patrick Alan Clark ◽  
Kenneth Hail

ABSTRACTThe trend for the electronics industry to develop more functional, smarter and more compact devices has stressed the traditional manufacturing and packaging processes including the printing/dispensing technology. The traditional printing technique (e.g. time-pressure needle dispensing, screen printing, pin transfer and jetting) each has their own disadvantages in terms of dimensionality, accuracy, repeatability, flexibility and consistency, which have become the bottle neck of the industry. Enabling tools and technologies are greatly needed for the manufacturing and packaging of highly integrated and complicated parts and assemblies. In this paper, nScrypt will present novel pumping technologies and innovative printing/dispensing solutions for 21st century manufacturing and packaging. nScrypt's novel pump and robust system can dispense with precise volume control for tens of picoliter resolution, accurately place or align within a few microns, conformably print on exaggerated surfaces of tens of centimeters, and are flexible with materials and patterns. Dispensing of micro lines, dots, three-dimensional structures and conformal printing will be presented. This process has a wide range of applications including, but not limited to, conductors, resistors, optics, adhesives, sealants, frit, solders, encapsulates, wire bonding, underfilling, flip-chip bumping and 3-D structures.


2021 ◽  
Vol 9 ◽  
Author(s):  
Berik Uzakbaiuly ◽  
Aliya Mukanova ◽  
Yongguang Zhang ◽  
Zhumabay Bakenov

With the development of smart electronics, a wide range of techniques have been considered for efficient co-integration of micro devices and micro energy sources. Physical vapor deposition (PVD) by means of thermal evaporation, magnetron sputtering, ion-beam deposition, pulsed laser deposition, etc., is among the most promising techniques for such purposes. Layer-by-layer deposition of all solid-state thin-film batteries via PVD has led to many publications in the last two decades. In these batteries, active materials are homogeneous and usually binder free, which makes them more promising in terms of energy density than those prepared by the traditional powder slurry technique. This review provides a summary of the preparation of cathode materials by PVD for all solid-state thin-film batteries. Cathodes based on intercalation and conversion reaction, as well as properties of thin-film electrode–electrolyte interface, are discussed.


2018 ◽  
Vol 140 (5) ◽  
Author(s):  
Arnaud Duchosal ◽  
Damien Joly ◽  
René Leroy ◽  
Roger Serra

In this paper, the effect of compacted graphite iron (CGI) microstructure has been investigated in tribological strategy. From industrial context, two coatings have been chosen: a single layer coating (physical vapor deposition (PVD)) and a multilayer coating (chemical vapor deposition (CVD)). Pin-on-disk tests have been done to analyze wear mechanisms and to directly obtain the coefficient of friction. Rotation speed of the disk has been adjusted to get the same linear velocity on different disk radii to get up to 150 m min−1 similar to machining condition. Three-dimensional (3D) profilometer, scanning electron microscopy, and nano-indentation were used to observe the track profiles, the pin, and the disk wears and to measure the hardness of microstructure components, respectively. Results showed that PVD coating was more abrasive and had more volume of sticking materials. Chemical vapor deposition coating, which could be the most appropriate for machining CGI, has a real antisticking property and has less friction coefficient than PVD coating. But the presence of small TiCN precipitates in CGI material has a proven negative effect in CVD coating lifetime.


Author(s):  
Kiran Bhole ◽  
Sunil Ekshinge ◽  
Prasanna Gandhi

This paper presents fabrication of varying thickness polymer micro-cantilever using recently developed and characterized, single scan, three-dimensional (3D) micro-fabrication process termed as “bulk lithography”. The process allows fabrication of 3D microstructures that demonstrate continuous variation in the thickness direction as against the discrete variation provided by the normal microstereolithography (layer-by-layer) and other VLSI processes. The required depth variation is obtained during fabrication by allowing unconstrained depth photopolymerization and varying laser exposure while scanning. Towards goal to achieve the control over cured depth and smooth free surface (down facing surface), the process is characterized for cured depth and width under wide range of energy dose at different exposure duration. The depth characterization, represented earlier in a form of an empirical model, is used programmatically to impose any desired spatial intensity variation during scan. Additional width characterization, presented in this paper, is used to optimize the line spacing for achieving smooth unconstrained surface. Specific case of fabrication of tapered micro-cantilever is demonstrated with the proposed technique.


Biomedicines ◽  
2021 ◽  
Vol 9 (8) ◽  
pp. 851
Author(s):  
Svetlana I. Dorovskikh ◽  
Evgeniia S. Vikulova ◽  
Elena V. Chepeleva ◽  
Maria B. Vasilieva ◽  
Dmitriy A. Nasimov ◽  
...  

This work is aimed at developing the modification of the surface of medical implants with film materials based on noble metals in order to improve their biological characteristics. Gas-phase transportation methods were proposed to obtain such materials. To determine the effect of the material of the bottom layer of heterometallic structures, Ir, Pt, and PtIr coatings with a thickness of 1.4–1.5 μm were deposited by metal–organic chemical vapor deposition (MOCVD) on Ti6Al4V alloy discs. Two types of antibacterial components, namely, gold nanoparticles (AuNPs) and discontinuous Ag coatings, were deposited on the surface of these coatings. AuNPs (11–14 nm) were deposited by a pulsed MOCVD method, while Ag films (35–40 nm in thickness) were obtained by physical vapor deposition (PVD). The cytotoxic (24 h and 48 h, toward peripheral blood mononuclear cells (PBMCs)) and antibacterial (24 h) properties of monophase (Ag, Ir, Pt, and PtIr) and heterophase (Ag/Pt, Ag/Ir, Ag/PtIr, Au/Pt, Au/Ir, and Au/PtIr) film materials deposited on Ti-alloy samples were studied in vitro and compared with those of uncoated Ti-alloy samples. Studies of the cytokine production by PBMCs in response to incubation of the samples for 24 and 48 h and histological studies at 1 and 3 months after subcutaneous implantation in rats were also performed. Despite the comparable thickness of the fibrous capsule after 3 months, a faster completion of the active phase of encapsulation was observed for the coated implants compared to the Ti alloy analogs. For the Ag-containing samples, growth inhibition of S. epidermidis, S. aureus, Str. pyogenes, P. aeruginosa, and Ent. faecium was observed.


Author(s):  
Yuan Gao ◽  
Xiaoguang Duan ◽  
Bin Li ◽  
Qianqian Jia ◽  
Yang Li ◽  
...  

Persulfate-based advanced oxidation processes are promising technologies to solve water pollution. In this work, single iron atoms are anchored in three-dimensional N-doped carbon nanosheets by a chemical vapor deposition (CVD)...


Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 215
Author(s):  
Andreia A. Ferreira ◽  
Francisco J. G. Silva ◽  
Arnaldo G. Pinto ◽  
Vitor F. C. Sousa

PVD (physical vapor deposition) and CVD (chemical vapor deposition) have gained greater significance in the last two decades with the mandatory shift from electrodeposition processes to clean deposition processes due to environmental, public safety, and health concerns. Due to the frequent use of coatings in several industrial sectors, the importance of studying the chromium coating processes through PVD–sputtering can be realized, investing in a real alternative to electroplated hexavalent chromium, usually denominated by chromium 6, regularly applied in electrodeposition processes of optical products in the automotive industry. At an early stage, experimental tests were carried out to understand which parameters are most suitable for obtaining chromium coatings with optical properties. To study the coating in a broad way, thickness and roughness analysis of the coatings obtained using SEM and AFM, adhesion analyzes with the scratch-test and transmittance by spectrophotometry were carried out. It was possible to determine that the roughness and transmittance decreased with the increase in the number of layers, the thickness of the coating increased linearly, and the adhesion and resistance to climatic tests remained positive throughout the study. Thus, this study allows for the understanding that thin multilayered Cr coatings can be applied successfully to polymeric substrates regarding optical applications in the automotive industry.


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