Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing

2021 ◽  
Author(s):  
Alec Nordlund ◽  
Rachel McAfee ◽  
Rebecca Ledsham ◽  
Joshua Gess
Keyword(s):  
Additive Manufacturing ◽  
Liquid Nitrogen ◽  
Data Center ◽  
Power Efficiency ◽  
Thermal Design ◽  
Cryogenic Cooling ◽  
Air Cooling ◽  
Two Phase ◽  
Computational Performance ◽  
Two Phase Cooling

Abstract Processor energy density is exceeding the capabilities of conventional air-cooling technology, but two-phase cooling has the potential to manage these resulting heat fluxes at reliable temperatures and higher electrical efficiency. When two-phase cooling is used in tandem with overclocking, data center footprints are reduced as individual chip processing power can be set at limits well beyond the manufacturer’s Thermal Design Power (TDP) or nominal operating condition. This study examines how Liquid Nitrogen (LN2) can be used with Additive Manufacturing (AM) and overclocking to increase the computational performance of a commercially available GPU. The power consumption and frequency relationship were established for both the cryogenically cooled solution and a comparative air-cooled solution. The cryogenic solution saw up to a 17.4% increase in compute efficiency and an 18.1% improvement in compute speed with comparable power efficiency at an equivalent performance level to the air-cooled solution. This study considers the computational performance and efficiency gains that can be acquired through cryogenic cooling on an individual graphics card, which can be replicated on a larger scale in data center applications.

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

2019 ◽  
Author(s):  
Devdatta P. Kulkarni ◽  
Priyanka Tunuguntla ◽  
Guixiang Tan ◽  
Casey Carte
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Sink ◽  
Capital Investment ◽  
Thermal Design ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Pipe Heat

Abstract In recent years, rapid growth is seen in computer and server processors in terms of thermal design power (TDP) envelope. This is mainly due to increase in processor core count, increase in package thermal resistance, challenges in multi-chip integration and maintaining generational performance CAGR. At the same time, several other platform level components such as PCIe cards, graphics cards, SSDs and high power DIMMs are being added in the same chassis which increases the server level power density. To mitigate cooling challenges of high TDP processors, mainly two cooling technologies are deployed: Liquid cooling and advanced air cooling. To deploy liquid cooling technology for servers in data centers, huge initial capital investment is needed. Hence advanced air-cooling thermal solutions are being sought that can be used to cool higher TDP processors as well as high power non-CPU components using same server level airflow boundary conditions. Current air-cooling solutions like heat pipe heat sinks, vapor chamber heat sinks are limited by the heat transfer area, heat carrying capacity and would need significantly more area to cool higher TDP than they could handle. Passive two-phase thermosiphon (gravity dependent) heat sinks may provide intermediate level cooling between traditional air-cooled heat pipe heat sinks and liquid cooling with higher reliability, lower weight and lower cost of maintenance. This paper illustrates the experimental results of a 2U thermosiphon heat sink used in Intel reference 2U, 2 node system and compare thermal performance using traditional heat sinks solutions. The objective of this study was to showcase the increased cooling capability of the CPU by at least 20% over traditional heat sinks while maintaining cooling capability of high-power non-CPU components such as Intel’s DIMMs. This paper will also describe the methodology that will be used for DIMMs serviceability without removing CPU thermal solution, which is critical requirement from data center use perspective.

Thermal Performance and Key Challenges for Future CPU Cooling Technologies

2005 ◽  
Author(s):  
Ioan Sauciuc ◽  
Ravi Prasher ◽  
Je-Young Chang ◽  
Hakan Erturk ◽  
Gregory Chrysler ◽  
...  
Keyword(s):  
Power Density ◽  
Thermal Performance ◽  
Hot Spot ◽  
Average Power ◽  
Building Blocks ◽  
Thermal Design ◽  
Air Cooling ◽  
Back Side ◽  
Two Phase ◽  
Density Factor

Over the past few years, thermal design for cooling microprocessors has become increasingly challenging mainly because of an increase in both average power density and local power density, commonly referred to as “hot spots”. The current air cooling technologies present diminishing returns, thus it is strategically important for the microelectronics industry to establish the research and development focus for future non air-cooling technologies. This paper presents the thermal performance capability for enabling and package based cooling technologies using a range of “reasonable” boundary conditions. In the enabling area a few key main building blocks are considered: air cooling, high conductivity materials, liquid cooling (single and two-phase), thermoelectric modules integrated with heat pipes/vapor chambers, refrigeration based devices and the thermal interface materials performance. For package based technologies we present only the microchannel building block (cold plate in contact with the back-side of the die). It will be shown that as the hot spot density factor increases, package based cooling technologies should be considered for more significant cooling improvements. In addition to thermal performance, a summary of the key technical challenges are presented in the paper.   This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference.

Thermal Design and Performance of Two-Phase Meso-Scale Heat Exchangers

2005 ◽  
Author(s):  
Robert Hannemann ◽  
Joseph Marsala ◽  
Martin Pitasi
Keyword(s):  
Heat Exchangers ◽  
Thermal Design ◽  
Low Flow ◽  
Commercial Application ◽  
Working Fluid ◽  
Small Scale ◽  
Air Cooling ◽  
Cold Plate ◽  
Two Phase ◽  
Meso Scale

Dramatically increased power dissipation in electronic and electro-optic devices has prompted the development of advanced thermal management approaches to replace conventional air cooling using extended surfaces. One such approach is Pumped Liquid Multiphase Cooling (PLMC), in which a refrigerant is evaporated in a cold plate in contact with the devices to be cooled. Heat is then rejected in an air or water-cooled condenser and the working fluid is returned to the cold plate. Reliable, highly efficient, small-scale components are required for the commercial application of this technology. This paper presents experimental results for two-phase meso-scale heat exchangers (cold plates) for use in electronics cooling. The configurations studied include single and multi-pass designs using R134a as the working fluid. With relatively low flow rates, low effective thermal resistances were achieved at power levels as high as 376 W. The results confirm the efficacy of PLMC technology for cooling the most powerful integrated circuits planned for the next decade.

scholarly journals Recent Advances in High-Flux, Two-Phase Thermal Management

2013 ◽  
Author(s):  
Issam Mudawar
Keyword(s):  
Dissipation Rate ◽  
Heat Dissipation ◽  
Future Research ◽  
Air Cooling ◽  
High Flux ◽  
Computer Algorithms ◽  
Two Phase ◽  
Computer Data ◽  
Predictive Tools ◽  
Two Phase Cooling

Recent developments in applications such as computer data centers, electric vehicle power electronics, avionics, radars and lasers have led to alarming increases in heat dissipation rate, which now far exceeds the capability of air cooling schemes and even the most aggressive single-phase liquid cooling schemes. This trend is responsible for a recent transition to two-phase cooling, which capitalizes upon the coolant’s latent heat rather than sensible heat alone to achieve several order-of-magnitude increases in heat transfer coefficient. Three two-phase cooling configurations have surfaced as top contenders for the most demanding applications: mini/micro-channel, jet and spray. This study will explore the implementation of these configurations into practical cooling packages, assess available predictive tools, and identify future research needs for each. It is shown that the design and performance assessment of high-flux, two-phase cooling systems are highly dependent on empirical or semi-empirical predictive tools and, to a far lesser extent, theoretical mechanistic models. A major challenge in using such tools is the lack of databases for coolants with drastically different thermophysical properties, and which cover broad ranges of such important parameters as flow passage size, mass velocity, quality and pressure. Recommendations are therefore made for future research to correct any critical knowledge gaps, including the need for robust computer algorithms. Also discussed is a new class of ‘hybrid’ cooling schemes that capitalize upon the merits of multiple cooling configurations. It is shown that these hybrid schemes not only surpass the basic cooling configurations in heat dissipation rate, but they also provide better surface temperature uniformity.

Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

2015 ◽  
Author(s):  
Pritish R. Parida ◽  
Hsin-Hua Tsuei ◽  
Timothy J. Chainer
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
Flow Boiling ◽  
Dielectric Fluid ◽  
Multiphase Model ◽  
Micro Channel ◽  
Complex Flow ◽  
Two Phase ◽  
Computational Performance ◽  
Two Phase Cooling

The 3D (three dimensional) integration of microelectronic chips into chip stacks is an enabling technology to provide a possible path for increasing computational performance. However, 3D chip stacks require a solution to significant new thermal challenges. As a feasible solution, two-phase cooling utilizing a chip-to-chip interconnect-compatible dielectric fluid can be used. This chip-integrated micrometer scale two-phase cooling technology can be essential to fully optimize the benefits of improved integration density and modularity of 3D stacking of high performance integrated circuits (ICs) for future computing systems; but is faced with significant developmental challenges including high fidelity modeling. In the present work, an Eulerian multiphase model has been developed for simulating two-phase evaporative cooling through chip embedded microscale cavities. First, the model was used to predict the flow and heat transfer characteristics for coolant R245fa flowing through a single straight micro channel with cross section 100 × 100 um and length 10 mm. The flow is sub-cooled in the initial section of the channel and saturated in the remaining. The results were compared to experimental data available from literature, focusing on the model capability to predict the correct flow pattern, temperature profile and pressure drop. Next, the validated model was extended to the simulation of complex flow geometries expected in microprocessor chip-stacks with chip-to-chip interconnects.

Liquid Cooling Network Systems for Energy Conservation in Data Centers

2011 ◽  
Author(s):  
Mayumi Ouchi ◽  
Yoshiyuki Abe ◽  
Masato Fukagaya ◽  
Haruhiko Ohta ◽  
Yasuhisa Shinmoto ◽  
...  
Keyword(s):  
Heat Exchanger ◽  
Data Center ◽  
Single Phase ◽  
Cooling System ◽  
Heat Pipes ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Cooling Systems ◽  
Cooling Methods

Energy consumption in data center has been drastically increasing in recent years. In data center, server racks are cooled down by air conditioning for the whole room in a roundabout way. This air cooling method is inefficient in cooling and it causes hotspot problem that IT equipments are not cooled down enough, but the room is overcooled. On the other hand, countermeasure against the heat of the IT equipments is also one of the big issues. We therefore proposed new liquid cooling systems which IT equipments themselves are cooled down and exhaust heat is not radiated into the server room. For our liquid cooling systems, three kinds of cooling methods have been developed simultaneously. Two of them are direct cooling methods that the cooling jacket is directly attached to heat source, or CPU in this case. Single-phase heat exchanger or two-phase heat exchanger is used as cooling jackets. The other is indirect cooling methods that the heat generated from CPU is transported to the outside of the chassis through flat heat pipes, and condensation sections of the heat pipes are cooled down by liquid. Verification tests have been conducted by use of real server racks equipped with these cooling techniques while pushing ahead with five R&D subjects which constitute our liquid cooling system, which single-phase heat exchanger, two-phase heat exchanger, high performance flat heat pipes, nanofluids technology, and plug-in connector. As a result, the energy saving effect of 50∼60% comparing with conventional air cooling system was provided in direct cooling technique with single-phase heat exchanger.

The Thermal Design of a Next Generation Data Center: A Conceptual Exposition

2008 ◽  
Vol 130 (4) ◽  
Author(s):  
Emad Samadiani ◽  
Yogendra Joshi ◽  
Farrokh Mistree
Keyword(s):  
Data Center ◽  
Data Centers ◽  
Cooling System ◽  
Thermal Design ◽  
Engineering System ◽  
Air Cooling ◽  
Next Generation ◽  
The Future ◽  
Thermal Solution ◽  
Near Future

In the near future, electronic cabinets of data centers will house high performance chips with heat fluxes approaching 100 W/cm2 and associated high volumetric heat generation rates. With the power trends in the electronic cabinets indicating 60 kW cabinets in the near future, the current cooling systems of data centers will be insufficient and new solutions will need to be explored. Accordingly, the key issue that merits investigation is identifying and satisfying the needed specifications of the new thermal solutions, considering the design environment of the next generation data centers. Anchoring our work in the open engineering system paradigm, we identify the requirements of the future thermal solutions and explore various design specifications of an ideally open thermal solution for a next generation data center. To approach an open cooling system for the future data centers, the concept of a thermal solution centered on the multiscale (multilevel) nature of the data centers is discussed. The potential of this solution to be open, along with its theoretical advantages compared with the typical air-cooling solutions, is demonstrated through some scenarios. The realization problems and the future research needs are highlighted to achieve a practical open multiscale thermal solution in data centers. Such solution is believed to be both effective and efficient for the next generation data centers.

scholarly journals Recent Advances in High-Flux, Two-Phase Thermal Management

2013 ◽  
Vol 5 (2) ◽  
Author(s):  
Issam Mudawar
Keyword(s):  
Dissipation Rate ◽  
Heat Dissipation ◽  
Future Research ◽  
Air Cooling ◽  
High Flux ◽  
Computer Algorithms ◽  
Two Phase ◽  
Computer Data ◽  
Predictive Tools ◽  
Two Phase Cooling

Recent developments in applications such as computer data centers, electric vehicle power electronics, avionics, radars, and lasers have led to alarming increases in heat dissipation rate, which now far exceeds the capability of air cooling schemes and even the most aggressive single-phase liquid cooling schemes. This trend is responsible for a recent transition to two-phase cooling, which capitalizes upon the coolant's latent heat rather than sensible heat alone to achieve several order-of-magnitude increases in heat transfer coefficient. Three two-phase cooling configurations have surfaced as best contenders for the most demanding applications: mini/microchannel, jet, and spray. This study will explore the implementation of these configurations into practical cooling packages, assess available predictive tools, and identify future research needs for each. It is shown that the design and performance assessment of high-flux, two-phase cooling systems are highly dependent on empirical or semiempirical predictive tools and, to a far lesser extent, theoretical mechanistic models. A major challenge in using such tools is the lack of databases for coolants with drastically different thermophysical properties, and which cover broad ranges of such important parameters as flow passage size, mass velocity, quality, and pressure. Recommendations are therefore made for future research to correct any critical knowledge gaps, including the need for robust computer algorithms. Also discussed is a new class of “hybrid” cooling schemes that capitalize upon the merits of multiple cooling configurations. It is shown that these hybrid schemes not only surpass the basic cooling configurations in heat dissipation rate, but they also provide better surface temperature uniformity.

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