Additively Printed Flexible Temperature Sensor for Wearable Applications

2021 ◽  
Author(s):  
Pradeep Lall ◽  
Hyesoo Jang ◽  
Jinesh Narangaparambil ◽  
Kartik Goyal ◽  
Curtis Hill
Keyword(s):  
Temperature Sensor ◽  
Environmental Temperature ◽  
Portable Devices ◽  
Direct Write ◽  
Planar Surfaces ◽  
Printed Sensors ◽  
Evolution Of Resistance ◽  
And Performance ◽  
Compact Design ◽  
Sensor Accuracy

Abstract The flexible sensor has the capability to be mounted on any curved surfaces of applications and be used for portable devices. Additively printed sensors have received attention owing to their compact design and ability of application to non-planar surfaces. Wearable applications require capability of integration into a variety of surfaces with ability to flex, fold, twist and stretch under the stresses of daily motion. There is scarcity of data on the interaction of the process parameters with the realized performance. In addition, there is need for data focused on sensor accuracy, repeatability, and reliability. In this study, experimental analysis on function of the fabricated sensing board is conducted. The temperature sensors are made by direct write printing method with nScrypt printer. A calibration of the sensors has been conducted to confirm that resistance is well related to actual temperature and find TCR (temperature coefficient to resistance). The evolution of resistance has been correlated with the environmental temperature. The sensor hysteresis has been quantified using upswing and downswing of the environmental temperature. In addition, the effect of humidity on the temperature sensor accuracy and performance has been quantified. The effect of a polymide coat on the sensor to prevent humidity effects has also been quantified.

Effects of Mounting Methods on Temperature Sensor Accuracy Below 10K

1992 ◽  
pp. 619-626 ◽  
Author(s):  
Theodore A. Kobel ◽  
Maksymilian A. Kozyrczak ◽  
S. W. Schwenterly ◽  
William M. Bell
Keyword(s):  
Temperature Sensor ◽  
Sensor Accuracy

scholarly journals Fabrication and Performance Evaluation of Thin Film RTD Temperature Sensor Array on a Curved Glass Surface

2011 ◽  
Vol 9 (2) ◽  
pp. 34-39 ◽  
Author(s):  
Chul-Hee Ahn ◽  
Hyoung-Hoon Kim ◽  
Sang-Hu Park ◽  
Chang-Min Son ◽  
Jeung-Sang Go
Keyword(s):  
Thin Film ◽  
Performance Evaluation ◽  
Temperature Sensor ◽  
Glass Surface ◽  
Sensor Array ◽  
Curved Glass ◽  
And Performance

Printing Characteristics and Performance of Polymer Thick Film Inks for Direct Write Applications

2010 ◽  
pp. 373-376
Author(s):  
Liang Hao ◽  
Sandeep Raja ◽  
Mike Sloan ◽  
Richard Robinson ◽  
Jennifer McDonald ◽  
...  
Keyword(s):  
Thick Film ◽  
Direct Write ◽  
And Performance

Cost-Effective Precision 3D Glass Microfabrication for Advanced Packaging Applications

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 000791-000810
Author(s):  
Jeb Flemming ◽  
Roger Cook ◽  
Kevin Dunn ◽  
James Gouker
Keyword(s):  
Cost Effective ◽  
High Density ◽  
Consumer Electronics ◽  
Liquid Crystal Polymers ◽  
Portable Devices ◽  
Signal Loss ◽  
Wafer Level ◽  
Advanced Packaging ◽  
And Performance ◽  
Optical Waveguiding

Today's packaging has become the limiting element in system cost and performance for IC development. Assembly and packaging technologies have become primary differentiators for manufactures of consumer electronics and the main enabler of small IC product development. Traditional packaging approaches to address the needs in these “High Density Portable” devices, including FR4, liquid crystal polymers, and Low Temperature Co-Fire Ceramics, are running into fundamental limits in packaging layer thinness, high density interconnects (HDI) size and density, and do not present solutions to in-package thermal management, and optical waveguiding. In this talk, 3D Glass Solutions will present on our efforts to create advanced microelectronic packing solutions using our APEX™ Glass ceramic which offers a single material capable of being simultaneously used for ultra-HDI through glass vias (TGVs), optical waveguiding, and in-package microfluidic cooling. In this talk we will discuss our latest results in wafer-level microfabrication of packaging solutions. We will present on our efforts for creating copper filled vias, surface metallization, and passivation. Furthermore, we will present our efforts in exploring this material to produce (1) ultra-HDI glass interposers, with TGVs as small as 12 microns, with 14 micron center –to-center, (2) advanced RF packages with unique surface architectures designed to minimize signal loss, and (3) creating wave guiding structures in HDI packages.

A Calibration Method for Distributed Optical Fiber Temperature Sensor

2010 ◽  
Vol 44-47 ◽  
pp. 2774-2777
Author(s):  
Le Chen ◽  
Xiao Li Zhang ◽  
Yan Song
Keyword(s):  
Optical Fiber ◽  
Temperature Sensor ◽  
Environmental Temperature ◽  
Calibration Method ◽  
Measurement Precision ◽  
Temperature Calibration ◽  
Calibration Technique ◽  
Calibration Methods ◽  
Accurate Temperature ◽  
Distributed Optical Fiber

Based on the principle of the distributed optical fiber temperature sensor, the research with temperature calibration technique for temperature measurement precision of system was studied in this paper. Accurate temperature was gotten by standards of environmental temperature thermometer, with different temperature calibration methods to solve the accuracy problem of the distributed optical fiber temperature sensor.

scholarly journals The Energy Requirements and Performance of Growing Chickens and Turkeys as Affected by Environmental Temperature

1980 ◽  
Vol 59 (10) ◽  
pp. 2290-2299 ◽  
Author(s):  
S. HURWITZ ◽  
M. WEISELBERG ◽  
U. EISNER ◽  
I. BARTOV ◽  
G. RIESENFELD ◽  
...  
Keyword(s):  
Environmental Temperature ◽  
Energy Requirements ◽  
And Performance

scholarly journals Inkjet-Printed Flexible Temperature Sensor Based on Silver Nanoparticles Ink

2020 ◽  
Vol 2 (1) ◽  
pp. 3
Author(s):  
Qiao Jun Liew ◽  
Aiman Sajidah Abd Aziz ◽  
Hing Wah Lee ◽  
Mai Woon Lee ◽  
Huzein Fahmi Hawari ◽  
...  
Keyword(s):  
Silver Nanoparticles ◽  
Linear Relationship ◽  
Polyethylene Terephthalate ◽  
Temperature Sensor ◽  
Large Scale ◽  
Average Width ◽  
Sensor Performance ◽  
Printed Sensors ◽  
Higher Sensitivity ◽  
Pet Substrate

In this research, a flexible inkjet-printed temperature sensor with in-house silver nanoparticles ink is presented and compared with the sensor printed with commercial silver nanoparticles ink. These sensors have an average width of 0.5 ± 0.04 mm in the latter and 0.5 ± 0.03 mm in the former. These serpentine-structure sensors were printed on polyethylene terephthalate (PET) substrate by using a Fujifilm Dimatix 2850 printer. The corresponding results indicating resistance have been recorded in the range of 30–100 °C to evaluate the sensor performance. The result of the studies showed that there was a linear relationship between the resistance and temperature for both ink types. The printed sensors developed using the in-house ink presented higher sensitivity, 0.1086 Ω/°C, compared to the commercial ink, which was 0.0543 Ω/°C. Therefore, the flexible inkjet-printed temperature sensor with the in-house silver nanoparticles ink is recommended for the large-scale productions and implementations.

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