Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions

2020 ◽  
Author(s):  
Arun V. Gowda ◽  
Rinaldo L. Miorini ◽  
Michael Fish ◽  
Darin J. Sharar ◽  
Peter deBock
Keyword(s):  
Silicon Carbide ◽  
Heat Dissipation ◽  
Swirling Flow ◽  
Radial Pressure ◽  
Electrical Performance ◽  
Phase System ◽  
Module Structure ◽  
Power Module ◽  
Two Phase ◽  
Radial Acceleration

Abstract The demand for high power density, therefore high heat dissipation, silicon carbide power electronics modules is propelled by applications such as hybrid transportation and renewable power generation and conversion, among others. Besides a low thermal resistance, these applications require high thermal capacitance to manage transient operations. The Package Integrated Cyclone COoler (PICCO) is an additively manufactured, thermal energy storing cooler codesigned by GE Research (GRC) in collaboration with the US Army Research Lab (ARL). The key aspect of PICCO is its capability to swirl a two-phase coolant, i.e. liquid-gas. The centrifugal field creates a radial pressure gradient inducing buoyancy. The strong radial acceleration to which the fluid is subject forces relatively cold flow outward to reach the hot wall, thus boosting the heat transfer, while hot flow and bubbles migrate inward and the two-phase system is nearly isothermal (thermal storage). In this paper, we introduce a novel power module package which brings together silicon carbide devices, Power OverLay (POL) wirebondless interconnect, and two-phase swirling flow in an additively manufactured cooler. Various embodiments of this power module structure are presented along with a discussion on their thermal behavior when subjected to a hybrid vehicle drive cycle.

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

2020 ◽  
Author(s):  
Rinaldo L. Miorini ◽  
Darin J. Sharar ◽  
Peter deBock
Keyword(s):  
Heat Transfer ◽  
Heat Dissipation ◽  
Heat Conduction Problem ◽  
Thermal Conductance ◽  
Radial Pressure ◽  
High Heat ◽  
Phase System ◽  
Two Phase ◽  
Radial Acceleration ◽  
Us Army

Abstract The demand for high power density, therefore high heat dissipation, power electronics modules is propelled by applications such as hybrid transportation and asynchronous power generation, among others. Besides a low thermal resistance, these applications require high thermal capacitance to manage transient operations. The Package Integrated Cyclone COoler (PICCO) is an additively manufactured, thermal energy storing cooler codesigned by GE Research (GRC) in collaboration with the US Army Research Lab (ARL). The key aspect of PICCO is its capability to swirl a two-phase coolant, i.e. liquid-gas. The centrifugal field creates a radial pressure gradient inducing buoyancy. The strong radial acceleration to which the fluid is subject forces relatively cold flow outward to reach the hot wall, thus boosting the heat transfer, while hot flow and bubbles migrate inward and the two-phase system is nearly isothermal (thermal storage). The proposed study models the swirled flow in terms of liquid film heat conductance and critical heat flux predictions. The resulting heat transfer coefficient can be applied to the walls of the cyclone and used as a boundary condition for the heat conduction problem through the cyclone wall and the module layers.

Comparison of High Voltage SiC MOSFET and Si IGBT Power Module Thermal Performance

2019 ◽  
Vol 954 ◽  
pp. 194-201
Author(s):  
Yu Jie Du ◽  
Jin Yuan Li ◽  
Peng Wang ◽  
Mei Ting Cui
Keyword(s):  
Silicon Carbide ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
High Voltage ◽  
Lateral Spread ◽  
Module Structure ◽  
Packaging Materials ◽  
Power Module ◽  
Spread Model ◽  
Power Densities

Silicon carbide (SiC) devices have been gradually applied in power electronic for the characteristics of high voltage, high power densities, elevated operating temperature and low switching energy loss. In this paper, a SiC MOSFET welding power module is proposed based on high voltage Si IGBT standard module structure to evaluate the thermal performance. The thermal lateral spread model expounds the expansion of the heat flow in the vertical crossing of a thermal conductor, and thermal resistance distributions of packaging materials in Silicon carbide and Silicon power module are studied through the COMSOL Multiphysics finite element software based on the thermal lateral spread model assumption that minute changes in thermal conductivity would produce no alterations in heat spreading angle. The result indicate that SiC MOSFET module gives the larger thermal resistance than the Si IGBT module with the same encapsulation structure but higher power densities for SiC, what’s more, the solder for die attach and direct bonding copper which include upper copper, substrate and lower copper contribute more thermal resistance in SiC MOSFET module. The differences of thermal Performance in SiC and Si modules can be obtained to benefit us in optimizing SiC MOSFET power module structure design and packaging materials selection.

On the Problem of “Two-Phase” Activated Sludge

1991 ◽  
Vol 24 (7) ◽  
pp. 59-64 ◽  
Author(s):  
R. W. Szetela
Keyword(s):  
Activated Sludge ◽  
Single Phase ◽  
Phase System ◽  
Two Phase ◽  
Wastewater Treatment Process ◽  
Sludge Stabilization ◽  
Technological Advantage ◽  
In Series ◽  
State Models ◽  
Activated Sludge Systems

Steady-state models are presented to describe the wastewater treatment process in two activated sludge systems. One of these makes use of a single complete-mix reactor; the other one involves two complete-mix reactors arranged in series. The in-series system is equivalent to what is known as the “two-phase” activated sludge, a concept which is now being launched throughout Poland in conjunction with the PROMLECZ technology under implementation. Analysis of the mathematical models has revealed the following: (1) treatment efficiency, excess sludge production, energy consumption, and the degree of sludge stabilization are identical in the two systems; (2) there exists a technological equivalence of “two-phase” sludge with “single-phase” sludge; (3) the “two-phase” system has no technological advantage over the “single-phase” system.

A Novel Two-phase Soft Starter Used for Three-phase Asynchronous Motors

2020 ◽  
Vol 13 (8) ◽  
pp. 1175-1182
Author(s):  
Jingwen Chen ◽  
Hongshe Dang
Keyword(s):  
Pulse Generation ◽  
Power Module ◽  
Two Phase ◽  
Power Semiconductor ◽  
Starting Current ◽  
Semiconductor Switches ◽  
Soft Starter ◽  
Three Phase ◽  
And Control ◽  
Driving Circuit

Background: Traditional thyristor-based three-phase soft starters of induction motor often suffer from high starting current and heavy harmonics. Moreover, both the trigger pulse generation and driving circuit design are usually complicated. Methods: To address these issues, we propose a novel soft starter structure using fully controlled IGBTs in this paper. Compared to approaches of traditional design, this structure only uses twophase as the input, and each phase is controlled by a power module that is composed of one IGBT and four diodes. Results: Consequently, both driving circuit and control design are greatly simplified due to the requirement of fewer controlled power semiconductor switches, which leads to the reduction of the total cost. Conclusion: Both Matlab/Simulink simulation results and experimental results on a prototype demonstrate that the proposed soft starter can achieve better performances than traditional thyristorbased soft starters for Starting Current (RMS) and harmonics.

Interphase distribution of 2-furylethylenes

1985 ◽  
Vol 50 (8) ◽  
pp. 1642-1647 ◽  
Author(s):  
Štefan Baláž ◽  
Anton Kuchár ◽  
Ernest Šturdík ◽  
Michal Rosenberg ◽  
Ladislav Štibrányi ◽  
...  
Keyword(s):  
Partition Coefficient ◽  
Partition Coefficients ◽  
Transport Rate ◽  
Phase System ◽  
Two Phase ◽  
Interphase Distribution ◽  
Distribution Kinetics ◽  
System 1 ◽  
Kinetics Of

The distribution kinetics of 35 2-furylethylene derivatives in two-phase system 1-octanol-water was investigated. The transport rate parameters in direction water-1-octanol (l1) and backwards (l2) are partition coefficient P = l1/l2 dependent according to equations l1 = logP - log(βP + 1) + const., l2 = -log(βP + 1) + const., const. = -5.600, β = 0.261. Importance of this finding for assesment of distribution of compounds under investigation in biosystems and also the suitability of the presented method for determination of partition coefficients are discussed.

Effects of Varying Geometrical Parameters on Boiling From Microfabricated Enhanced Structures

2003 ◽  
Vol 125 (1) ◽  
pp. 103-109 ◽  
Author(s):  
C. Ramaswamy ◽  
Y. Joshi ◽  
W. Nakayama ◽  
W. B. Johnson
Keyword(s):  
Heat Dissipation ◽  
Layer Structure ◽  
Single Layer ◽  
Nucleate Boiling ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Geometrical Parameters ◽  
Small Range ◽  
Two Phase ◽  
Wall Superheat

The current study involves two-phase cooling from enhanced structures whose dimensions have been changed systematically using microfabrication techniques. The aim is to optimize the dimensions to maximize the heat transfer. The enhanced structure used in this study consists of a stacked network of interconnecting channels making it highly porous. The effect of varying the pore size, pitch and height on the boiling performance was studied, with fluorocarbon FC-72 as the working fluid. While most of the previous studies on the mechanism of enhanced nucleate boiling have focused on a small range of wall superheats (0–4 K), the present study covers a wider range (as high as 30 K). A larger pore and smaller pitch resulted in higher heat dissipation at all heat fluxes. The effect of stacking multiple layers showed a proportional increase in heat dissipation (with additional layers) in a certain range of wall superheat values only. In the wall superheat range 8–13 K, no appreciable difference was observed between a single layer structure and a three layer structure. A fin effect combined with change in the boiling phenomenon within the sub-surface layers is proposed to explain this effect.

scholarly journals Numerical Study of a Cooling System Using Phase Change of a Refrigerant in a Thermosyphon

Energies ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3634
Author(s):  
Grzegorz Czerwiński ◽  
Jerzy Wołoszyn
Keyword(s):  
Mass Transfer ◽  
Phase Change ◽  
Heat Dissipation ◽  
Cooling System ◽  
Numerical Study ◽  
Relaxation Parameter ◽  
Phase Changes ◽  
Transfer Time ◽  
Two Phase ◽  
Time Relaxation

With the increasing trend toward the miniaturization of electronic devices, the issue of heat dissipation becomes essential. The use of phase changes in a two-phase closed thermosyphon (TPCT) enables a significant reduction in the heat generated even at high temperatures. In this paper, we propose a modification of the evaporation–condensation model implemented in ANSYS Fluent. The modification was to manipulate the value of the mass transfer time relaxation parameter for evaporation and condensation. The developed model in the form of a UDF script allowed the introduction of additional source equations, and the obtained solution is compared with the results available in the literature. The variable value of the mass transfer time relaxation parameter during condensation rc depending on the density of the liquid and vapour phase was taken into account in the calculations. However, compared to previous numerical studies, more accurate modelling of the phase change phenomenon of the medium in the thermosyphon was possible by adopting a mass transfer time relaxation parameter during evaporation re = 1. The assumption of ten-fold higher values resulted in overestimated temperature values in all sections of the thermosyphon. Hence, the coefficient re should be selected individually depending on the case under study. A too large value may cause difficulties in obtaining the convergence of solutions, which, in the case of numerical grids with many elements (especially three-dimensional), significantly increases the computation time.

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