Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

2020 ◽  
Author(s):  
Rinaldo L. Miorini ◽  
Darin J. Sharar ◽  
Peter deBock
Keyword(s):  
Heat Transfer ◽  
Heat Dissipation ◽  
Heat Conduction Problem ◽  
Thermal Conductance ◽  
Radial Pressure ◽  
High Heat ◽  
Phase System ◽  
Two Phase ◽  
Radial Acceleration ◽  
Us Army

Abstract The demand for high power density, therefore high heat dissipation, power electronics modules is propelled by applications such as hybrid transportation and asynchronous power generation, among others. Besides a low thermal resistance, these applications require high thermal capacitance to manage transient operations. The Package Integrated Cyclone COoler (PICCO) is an additively manufactured, thermal energy storing cooler codesigned by GE Research (GRC) in collaboration with the US Army Research Lab (ARL). The key aspect of PICCO is its capability to swirl a two-phase coolant, i.e. liquid-gas. The centrifugal field creates a radial pressure gradient inducing buoyancy. The strong radial acceleration to which the fluid is subject forces relatively cold flow outward to reach the hot wall, thus boosting the heat transfer, while hot flow and bubbles migrate inward and the two-phase system is nearly isothermal (thermal storage). The proposed study models the swirled flow in terms of liquid film heat conductance and critical heat flux predictions. The resulting heat transfer coefficient can be applied to the walls of the cyclone and used as a boundary condition for the heat conduction problem through the cyclone wall and the module layers.

Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions

2020 ◽  
Author(s):  
Arun V. Gowda ◽  
Rinaldo L. Miorini ◽  
Michael Fish ◽  
Darin J. Sharar ◽  
Peter deBock
Keyword(s):  
Silicon Carbide ◽  
Heat Dissipation ◽  
Swirling Flow ◽  
Radial Pressure ◽  
Electrical Performance ◽  
Phase System ◽  
Module Structure ◽  
Power Module ◽  
Two Phase ◽  
Radial Acceleration

Abstract The demand for high power density, therefore high heat dissipation, silicon carbide power electronics modules is propelled by applications such as hybrid transportation and renewable power generation and conversion, among others. Besides a low thermal resistance, these applications require high thermal capacitance to manage transient operations. The Package Integrated Cyclone COoler (PICCO) is an additively manufactured, thermal energy storing cooler codesigned by GE Research (GRC) in collaboration with the US Army Research Lab (ARL). The key aspect of PICCO is its capability to swirl a two-phase coolant, i.e. liquid-gas. The centrifugal field creates a radial pressure gradient inducing buoyancy. The strong radial acceleration to which the fluid is subject forces relatively cold flow outward to reach the hot wall, thus boosting the heat transfer, while hot flow and bubbles migrate inward and the two-phase system is nearly isothermal (thermal storage). In this paper, we introduce a novel power module package which brings together silicon carbide devices, Power OverLay (POL) wirebondless interconnect, and two-phase swirling flow in an additively manufactured cooler. Various embodiments of this power module structure are presented along with a discussion on their thermal behavior when subjected to a hybrid vehicle drive cycle.

Experimental Investigation of a Thermosyphon With Microstructure on the Boiling Surface

2018 ◽  
Vol 11 (1) ◽  
Author(s):  
Y. Chai ◽  
W. Tian ◽  
J. Tian ◽  
L. W. Jin ◽  
X. Z. Meng ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Dissipation ◽  
Pool Boiling ◽  
High Heat ◽  
Primary Concern ◽  
Heat Transfer Efficiency ◽  
Heater Wall ◽  
Micro Structures ◽  
Thermal Physical Properties ◽  
Graphite Foam

Abstract In recent years, a primary concern in the development of electronic technology is high heat dissipation of power devices. The advantages of unique thermal physical properties of graphite foam raise up the possibility of developing pool boiling system with better heat transfer efficiency. A compact thermosyphon was developed with graphite foam insertions to explore how different parameters affect boiling performance. Heater wall temperature, superheat, departure frequency of bubbles, and thermal resistance of the system were analyzed. The results indicated that the boiling performance is affected significantly by thermal conductivity and pore diameter of graphite foam. A proposed heat transfer empirical correlation reflecting the relations between graphite foam micro structures and pool boiling performance of Novec7100 was developed in this paper.

Dropwise Condensation on Carbon Steel Surface

2016 ◽  
Author(s):  
Fangyu Cao ◽  
Sean Hoenig ◽  
Chien-hua Chen
Keyword(s):  
Heat Transfer ◽  
Carbon Steel ◽  
Power Plants ◽  
Heat Dissipation ◽  
Low Cost ◽  
Condensation Heat Transfer ◽  
Working Fluid ◽  
High Heat Flux ◽  
Dropwise Condensation ◽  
Two Phase

The increasing demand of heat dissipation in power plants has pushed the limits of current two-phase thermal technologies such as heat pipes and vapor chambers. One of the most obvious areas for thermal improvement is centered on the high heat flux condensers including improved evaporators, thermal interfaces, etc, with low cost materials and surface treatment. Dropwise condensation has shown the ability to increase condensation heat transfer coefficient by an order of magnitude over conventional filmwise condensation. Current dropwise condensation research is focused on Cu and other special metals, the cost of which limits its application in the scale of commercial power plants. Presented here is a general use of self-assembled monolayer coatings to promote dropwise condensation on low-cost steel-based surfaces. Together with inhibitors in the working fluid, the surface of condenser is protected by hydrophobic coating, and the condensation heat transfer is promoted on carbon steel surfaces.

Analytical Model Quantifying the Net Coolant Flow Rate to a Microstructured Copper Surface validated with Two-Phase PIV Measurements

2021 ◽  
Author(s):  
Matt Harrison ◽  
Joshua Gess
Keyword(s):  
Heat Transfer ◽  
Analytical Model ◽  
Flow Rate ◽  
Circular Disk ◽  
Nucleate Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
Coolant Flow ◽  
Coolant Flow Rate ◽  
Two Phase

Abstract Using Particle Image Velocimetry (PIV), the amount of fluid required to sustain nucleate boiling was quantified to a microstructured copper circular disk. Having prepared the disk with preferential nucleation sites, an analytical model of the net coolant flow rate requirements to a single site has been produced and validated against experimental data. The model assumes that there are three primary phenomena contributing to the coolant flow rate requirements at the boiling surface; radial growth of vapor throughout incipience to departure, bubble rise, and natural convection around the periphery. The total mass flowrate is the sum of these contributing portions. The model accurately predicts the quenching fluid flow rate at low and high heat fluxes with 4% and 30% error of the measured value respectively. For the microstructured surface examined in this study, coolant flow rate requirements ranged from 0.1 to 0.16 kg/sec for a range of heat fluxes from 5.5 to 11.0 W/cm2. Under subcooled conditions, the coolant flow rate requirements plummeted to a nearly negligible value due to domination of transient conduction as the primary heat transfer mechanism at the liquid/vapor/surface interface. PIV and the validated analytical model could be used as a test standard where the amount of coolant the surface needs in relation to its heat transfer coefficient or thermal resistance is a benchmark for the efficacy of a standard surface or boiling enhancement coating/surface structure.

Cavitation-Enhanced Microchannel Heat Exchanger Demonstration and Heat Transfer Correlation Development Using R-134a

2012 ◽  
Author(s):  
Joshua D. Sole ◽  
Bradley J. Shelofsky ◽  
Robert P. Scaringe ◽  
Gregory S. Cole
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
High Heat ◽  
High Heat Flux ◽  
Heat Transfer Correlation ◽  
Two Phase ◽  
Microchannel Heat Exchanger ◽  
Military Aviation ◽  
R 134A ◽  
Two Phase Heat Transfer

Electronics of all types, particularly those in the military aviation arena, are decreasing in size while at the same time increasing in power. As a result, newer high-heat-flux electronic components are exceeding the cooling capabilities of conventional single-phase military aviation coldplates and coolants. It is for this reason that we have been investigating new methods to cool the next generation of high-heat-flux military aviation electronics. In this work, a novel method of inducing two-phase conditions within a microchannel heat exchanger has been developed and demonstrated. Micro-orifices placed upstream of each microchannel in a microchannel heat exchanger not only cause an improvement in flow distribution, but can also induce cavitation in the incoming subcooled refrigerant and result in favorable two-phase flow regimes for enhanced heat transfer. In this study, R-134a is used as the coolant in the cavitation enhanced microchannel heat exchanger (CEMC-HX) which has been integrated into a vapor compression refrigeration system. Multiple micro-orifice geometries combined with a fixed microchannel geometry (nominally 250 μm × 250 μm) were investigated over a range of applied base heat fluxes (10–100 W/cm2) and mass fluxes (500–1000 kg/m2-s). Two-phase heat transfer coefficients exceeding 100,000 W/m2-K at refrigerant qualities of less than 5% have been demonstrated due to the achievement of preferential, cavitation-induced, flow regimes such as annular flow. To the author’s knowledge, this is the highest heat transfer coefficient ever reported in the literature for R-134a. Additionally, a four term two-phase heat transfer correlation was developed that achieved a mean absolute error (MAE) of 25.5%.

A Numerical Model of a Reciprocating-Mechanism Driven Heat Loop for Two-Phase High Heat Flux Cooling

2016 ◽  
Vol 8 (4) ◽  
Author(s):  
Olubunmi Popoola ◽  
Ayobami Bamgbade ◽  
Yiding Cao
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Numerical Model ◽  
Performance Optimization ◽  
Numerical Study ◽  
High Heat ◽  
Working Fluid ◽  
High Heat Flux ◽  
Two Phase ◽  
Transfer Device

An effective design option for a cooling system is to use a two-phase pumped cooling loop to simultaneously satisfy the temperature uniformity and high heat flux requirements. A reciprocating-mechanism driven heat loop (RMDHL) is a novel heat transfer device that could attain a high heat transfer rate through a reciprocating flow of the two-phase working fluid inside the heat transfer device. Although the device has been tested and validated experimentally, analytical or numerical study has not been undertaken to understand its working mechanism and provide guidance for the device design. The objective of this paper is to develop a numerical model for the RMDHL to predict its operational performance under different working conditions. The developed numerical model has been successfully validated by the existing experimental data and will provide a powerful tool for the design and performance optimization of future RMDHLs. The study also reveals that the maximum velocity in the flow occurs near the wall rather than at the center of the pipe, as in the case of unidirectional steady flow. This higher velocity near the wall may help to explain the enhanced heat transfer of an RMDHL.

Thermoreflectance Wall Temperature Measurement in Annular Two-Phase Flow

2019 ◽  
Author(s):  
Jason Chan ◽  
Brian E. Fehring ◽  
Roman W. Morse ◽  
Kristofer M. Dressler ◽  
Gregory F. Nellis ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Wall Temperature ◽  
Annular Flow ◽  
High Heat ◽  
High Heat Flux ◽  
Phase Flow ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Heat Transfer Coefficients ◽  
Dry Out

Abstract A thermoreflectance method to measure wall temperature in two-phase annular flow is described. In high heat flux conditions, momentary dry-out occurs as the liquid film vaporizes, resulting in dramatic decreases in heat transfer coefficient. Simultaneous liquid and vapor thermoreflectance measurements allow calculations of instantaneous and time-averaged heat transfer coefficients. Validation, calibration and uncertainty of the technique are discussed.

The Effect of Porous Material on the Improvement of the Micro-Chip Heat Dissipation

2008 ◽  
Author(s):  
Chyouhwu B. Huang ◽  
Hung-Shyong Chen ◽  
Szu-Ming Wu
Keyword(s):  
Heat Transfer ◽  
Porous Material ◽  
Porous Materials ◽  
Heat Transfer Rate ◽  
Transfer Rate ◽  
Heat Dissipation ◽  
Porous Ceramic ◽  
High Heat ◽  
Force Convection ◽  
Uninterruptible Power

Heat dissipation is a very important subject when dealing with industrial application especially in modern semiconductor related applications. Several techniques have been developed to solve the heat generated problem, such as heat dissipation device in IC packaging, high heat conductivity materials, heat tube, force convection, etc. Porous material is used in this study. Porous material is known to have large interior surface, therefore, with proper force convection; it can easily carry heat away. Micro porous ceramic (porous size: 490 μm) is attached to uninterruptible power supply (UPS) power chips. The increase of the heat dissipation rate improves UPS performance. Heat transfer properties comparisons for power chip with and without micro porous materials attached are studies. Also, heat transfer rate under different fan speeds (force convection) is studied. The results show that, heat transfer increases with the use of micro porous materials, the effectiveness ranges between 2–22%. Also, the heat transfer rate varies with air flow rate, the increase of heat transfer is about 4–6%. The dust effect was also performed; experimental results show that heat transfer rate will not be affected by the accumulated dust if a micro porous material is applied.

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