The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

2017 ◽  
Author(s):  
Quang Nguyen ◽  
Jeffrey C. Suhling ◽  
Richard C. Jaeger ◽  
Pradeep Lall
Keyword(s):  
Flip Chip ◽  
Failure Modes ◽  
Moisture Absorption ◽  
Numerical Study ◽  
Polymer Materials ◽  
Electronic Packages ◽  
Major Drawback ◽  
Electronic Package ◽  
Plastic Ball ◽  
Moisture Property

Polymer materials have been widely used in electronic packaging with many advantages such as: lower cost, light weight and good performance. They however suffer a major drawback that results in a number of challenges for reliability engineers and researchers, in which polymer materials are quite sensitive to moisture absorption when exposed to humid environment, causing many failure modes in electronic packages such as: popcorn cracking, delamination or corrosion. It is well-known that finite element simulation is a powerful tool to evaluate the effects of moisture on electronic package reliability. In this study, three moisture properties (diffusivity, saturated concentration, and coefficient of moisture expansion) were experimentally characterized. The obtained results were then used to perform moisture diffusion simulations on various types of electronic package. Finally, a numerical study was conducted on the dependence of the moisture effects (weight gains, die stresses) upon each moisture property of polymeric components of three kinds of electronic packages (Quad Flat Package, Plastic Ball Grid Array, and Flip Chip on Laminate). The results of the study provided valuable insights into how moisture induced die stresses vary with each moisture property of polymeric components in the packages.

Investigation on Hygro-Thermo-Mechanical Stress of a Plastic Electronic Package

2014 ◽  
Vol 30 (6) ◽  
pp. 625-630 ◽  
Author(s):  
F. Su ◽  
W.-J. Li ◽  
T.-B. Lan ◽  
W. Shang
Keyword(s):  
Finite Element ◽  
Thermal Stress ◽  
Mechanical Stress ◽  
Flip Chip ◽  
Moisture Absorption ◽  
Element Model ◽  
Electronic Package ◽  
Plastic Package ◽  
Thermal Stress Field ◽  
Plastic Ball

AbstractPlastic packaging materials tend to absorb moisture from ambient environment and get swollen, this may raise hygro-stress in plastic electronic package and redistribute the internal stress. In this paper, we reviewed the dramatic deformation of a plastic package (Flip Chip Plastic Ball Grid Array-FCPBGA) due to moisture absorption first, then hygro-thermo-mechanical stress of the plastic package and its evolution during a period of three months were investigated with finite element method, user development was performed for this investigation. The finite element model was verified with hygro-thermal deformation of the FCPBGA measured with a 3-D moiré interferometry system. Following findings were obtained: A. Thermal stress field was changed a lot due to moisture absorption; B. Thermal stress of chip was released to some extent, but peal stress up to 62.2MPa occurred to the solder bump, thus the danger of Under Bump Metal (UBM) opening increased.

Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects

2002 ◽  
Vol 124 (3) ◽  
pp. 184-187 ◽  
Author(s):  
J. H. Okura ◽  
A. Dasgupta ◽  
J. F. J. M. Caers
Keyword(s):  
Flip Chip ◽  
Failure Modes ◽  
Moisture Absorption ◽  
Accelerated Aging ◽  
Accelerated Life Tests ◽  
Accelerated Life ◽  
Service Durability ◽  
Mechanical Durability ◽  
Life Tests ◽  
And Diffusion

The effect of constant temperature and humidity environments on the durability of interconnects in underfilled Flip-Chip-on-Board (FCOB) assemblies is investigated in this study. Polymeric underfills, used to enhance thermomechanical durability of the interconnects, are found to create new failure modes due to hygromechanical swelling. Based on experimental observations, the failure mechanism is hypothesized to be cracking of intermetallics, which have weakened due to thermal aging. Pseudo 3-D finite element analyses are conducted to quantify the moisture absorption and diffusion through the polymeric underfill, and the resulting hygromechanical viscoplastic stress history. The simulations are combined with accelerated aging tests to assess in-service durability in hot, humid environments. Model predictions are compared with results of accelerated life tests available in the literature.

Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects

2000 ◽  
Author(s):  
J. H. Okura ◽  
A. Dasgupta ◽  
J. F. J. M. Caers
Keyword(s):  
Flip Chip ◽  
Failure Modes ◽  
Moisture Absorption ◽  
Accelerated Aging ◽  
Accelerated Life Tests ◽  
Accelerated Life ◽  
Model Predictions ◽  
Service Durability ◽  
Life Tests ◽  
And Diffusion

Abstract The effect of constant temperature and humidity environments on the durability of interconnects in underfilled Flip-Chip-on-Board (FCOB) assemblies is investigated in this study. Polymeric underfills, used to enhance thermomechanical durability of the interconnects, are found to create new failure modes due to hygromechanical swelling. Based on experimental observations, the failure mechanism is hypothesized to be cracking of intermetallics, which have weakened due to thermal aging. Pseudo 3-D finite element analyses are conducted to quantify the moisture absorption and diffusion through the polymeric underfill, and the resulting hygromechanical viscoplastic stress history. The simulations are combined with accelerated aging tests to assess in-service durability in hot, humid environments. Model predictions are compared with results of accelerated life tests available in the literature.

Resin Selection Criteria for Molded Electronic Packages

1987 ◽  
Vol 108 ◽  
Author(s):  
S. B. Rimsa
Keyword(s):  
Thermal Stresses ◽  
Moisture Absorption ◽  
Initial Step ◽  
Electronic Packages ◽  
Application Process ◽  
Electronic Package ◽  
Wave Soldering ◽  
Multi Stage ◽  
End Use ◽  
The Cost

The selection of the proper resin system for a molded PWB or electronic package must take into account considerably more parameters than simply the cost of and the ability of the polymer to fill the tooling. Molding of an electronic package is only the initial step in a multi stage sequence to produce a functional PWB or interconnect device.It is of extreme importance that a manufacturer of molded electronic packages understand not only the fabrication properties of a resin, but also those mechanical, thermal, and chemical requirements of the circuit application and assembly operations.A specific circuitry application process will usually require a specific set of substrate characteristics. These performance characteristics may relate to platability, thermal stability, modulus, compressive strength, or even adhesive bondability for a given procedure. The substrate requirements for several popular circuit application methods is reviewed.Assembly presents perhaps the most demanding area of resin performance in electronic package or PWB fabrication. The thermal stresses encountered in wave soldering and vapor phase reflow will quickly differentiate among current engineering resin offerings. The importance of controlled moisture absorption and high temperature modulus retention is explored in addition to end use environmental factors which can be of special concern.

Backside Application of Acoustic Micro Imaging (AMI) on Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) Packages

2004 ◽  
Author(s):  
Luis A. Curiel ◽  
Andrew J. Komrowski ◽  
Daniel J.D. Sullivan
Keyword(s):  
Ball Grid Array ◽  
Acoustic Microscopy ◽  
Electronic Packages ◽  
Nondestructive Technique ◽  
Molding Compound ◽  
Microscopy Technique ◽  
Plastic Ball ◽  
Die Surface ◽  
Plastic Ball Grid Array ◽  
Bond Pads

Abstract Acoustic Micro Imaging (AMI) is an established nondestructive technique for evaluation of electronic packages. Non-destructive evaluation of electronic packages is often a critical first step in the Failure Analysis (FA) process of semiconductor devices [1]. The molding compound to die surface interface of the Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) packages is an important interface to acquire for the FA process. Occasionally, with these packages, the standard acoustic microscopy technique fails to identify defects at the molding compound to die surface interface. The hard to identify defects are found at the edge of the die next to the bond pads or under the bonds wires. This paper will present a technique, Backside Acoustic Micro Imaging (BAMI) analysis, which can better resolve the molding compound to die surface interface at the die edge by sending the acoustic signal through the backside of the PBGA and PQFP packages.

scholarly journals Design and analysis of concrete-filled tubular flange girders under combined loading

2021 ◽  
pp. 136943322110015
Author(s):  
Rana Al-Dujele ◽  
Katherine Ann Cashell
Keyword(s):  
Finite Element ◽  
Axial Force ◽  
Failure Modes ◽  
Numerical Study ◽  
Combined Loading ◽  
Torsional Stiffness ◽  
Fe Model ◽  
Combined Effects ◽  
Element Analysis ◽  
Hollow Section

This paper is concerned with the behaviour of concrete-filled tubular flange girders (CFTFGs) under the combination of bending and tensile axial force. CFTFG is a relatively new structural solution comprising a steel beam in which the compression flange plate is replaced with a concrete-filled hollow section to create an efficient and effective load-carrying solution. These members have very high torsional stiffness and lateral torsional buckling strength in comparison with conventional steel I-girders of similar depth, width and steel weight and are there-fore capable of carrying very heavy loads over long spans. Current design codes do not explicitly include guidance for the design of these members, which are asymmetric in nature under the combined effects of tension and bending. The current paper presents a numerical study into the behaviour of CFTFGs under the combined effects of positive bending and axial tension. The study includes different loading combinations and the associated failure modes are identified and discussed. To facilitate this study, a finite element (FE) model is developed using the ABAQUS software which is capable of capturing both the geometric and material nonlinearities of the behaviour. Based on the results of finite element analysis, the moment–axial force interaction relationship is presented and a simplified equation is proposed for the design of CFTFGs under combined bending and tensile axial force.

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

2003 ◽  
Vol 125 (4) ◽  
pp. 512-519 ◽  
Author(s):  
C. J. Liu ◽  
L. J. Ernst ◽  
G. Wisse ◽  
G. Q. Zhang ◽  
M. Vervoort
Keyword(s):  
Failure Modes ◽  
Research Effort ◽  
Metal Layer ◽  
Electronic Packages ◽  
Ceramic Substrates ◽  
Thermally Induced ◽  
Thermal Expansion Coefficients ◽  
Interface Delamination ◽  
Delamination Buckling ◽  
Expansion Coefficients

Interface delamination failure caused by thermomechanical loading and mismatch of thermal expansion coefficients and other material properties is one of the important failure modes occurring in electronic packages, thus a threat for package reliability. To solve this problem, both academic institutions and industry have been spending tremendous research effort in order to understand the inherent failure mechanisms and to develop advanced and reliable experimental and simulation methodologies, thus to be able to predict and to avoid interface delamination before physical prototyping. Various damage mechanisms can be involved and can result in interface delamination phenomena. These are not all sufficiently addressed and/or reported so far, probably because of the complexities caused by the occurrence of strong geometric and materials nonlinearities. One of the phenomena being insufficiently understood so far is the so-called buckling-driven delamination of thin metalic layers on ceramic substrates. This phenomenon will be discussed in the present paper.

scholarly journals Moisture Absorption Effects on the Mechanical Properties of Sandwich Biocomposites with Cork Core and Flax/PLA Face Sheets

Molecules ◽  
2021 ◽  
Vol 26 (23) ◽  
pp. 7295
Author(s):  
Hom Nath Dhakal ◽  
Chulin Jiang ◽  
Moumita Sit ◽  
Zhongyi Zhang ◽  
Moussa Khalfallah ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Failure Modes ◽  
Moisture Absorption ◽  
Mechanical Performance ◽  
Core Sample ◽  
Environmental Benefits ◽  
Matrix Cracking ◽  
Core Material ◽  
Poly Lactic Acid ◽  
The Core

The aim of this study was to evaluate the moisture absorption behaviour and its influence on the mechanical properties of newly developed sandwich biocomposites with flax fibre-reinforced poly-lactic acid (PLA) face sheets and soft cork as the core material. Three different types of sandwich biocomposite laminates comprised of different layup configurations, namely, non-woven flax/PLA (Sample A), non-woven flax/PLA and cork as core (Sample B) and non-woven flax/paper backing/PLA, cork as core (Sample C), were fabricated. In order to evaluate the influence of moisture ingress on the mechanical properties, the biocomposites were immersed in seawater for a period of 1200 h. The biocomposites (both dry and water immersed) were then subjected to tensile, flexural and low-velocity falling weight impact tests. It was observed from the experimental results that the moisture uptake significantly influenced the mechanical properties of the biocomposites. The presence of the cork and paper in sample C made it more susceptible to water absorption, reaching a value of 34.33%. The presence of cork in the core also has a considerable effect on the mechanical, as well as energy dissipation, behaviours. The results of sample A exhibited improved mechanical performance in both dry and wet conditions compared to samples B and C. Sample A exhibits 32.6% more tensile strength and 81.4% more flexural strength in dry conditions than that in sample C. The scanning electron microscopy (SEM) and X-ray micro-CT images revealed that the failure modes observed are a combination of matrix cracking, core crushing and face core debonding. The results from this study suggest that flax/PLA sandwich biocomposites can be used in various lightweight applications with improved environmental benefits.

Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

2004 ◽  
Vol 127 (2) ◽  
pp. 120-126 ◽  
Author(s):  
Daijiao Wang ◽  
Ronald L. Panton
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
Numerical Study ◽  
Void Formation ◽  
Middle Layer ◽  
Molten Solder ◽  
Previous Theory ◽  
Solder Interconnects ◽  
Heating Profiles ◽  
High Lead

Understanding the formation of voids in solder joints is important for predicting the long-term reliability of solder interconnects. This paper reports experimental research on the formation of void bubbles within molten solder bumps in flip-chip connections. For flip-chip-soldered electronic components, which have small solder volume, voids can be more detrimental to reliability. A previous theory based on thermocapillary flow reveals that the direction of heating influences void formation. Using different heating profiles, 480 solder joints of flip-chip assemblies were processed. A high-lead 90Pb∕8Sn∕2Ag solder was employed in the experiments. The solder samples were microsectioned to determine the actual size or diameter of the voids. A database on sizes and locations of voids was then constructed. More defective bumps, 80%, and higher void volume were found when the solder was melted from top (flip-chip side) to bottom (test board side). The observation on cases with melting direction from bottom to top had 40% defective bumps. The results show that a single big void is near the solder bump center with a few small voids near the edge. This supports the numerical study based on the thermocapillary theory. When the melting direction was reversed, many small voids appear near the edge. Big and middle-size voids tend to stay in the middle and outer regions from top towards middle layer of the bump. This experimental finding does not completely agree with the interpretation on the formation of voids by thermocapillary theory, however, the results do show that heat flux direction plays significant role in the formation and distribution of void bubbles in molten solder.

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