Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling

2015 ◽  
Author(s):  
Pritish R. Parida
Keyword(s):  
Flow Boiling ◽  
Three Dimensional ◽  
Dielectric Fluid ◽  
Transfer Model ◽  
Enabling Technology ◽  
It Industry ◽  
Two Phase ◽  
3D Stacking ◽  
Spatially Varying ◽  
Two Phase Cooling

The information technology (IT) industry is exploring three-dimensional (3D) stacking of chips to maintain future computing scalability. However, 3D chip stacks require a solution to significant new thermal challenges. Interlayer two-phase evaporative cooling with a chip-to-chip interconnect-compatible dielectric fluid is an enabling technology but faces significant development issues. One such issue is the inability to thermally model a microprocessor with spatially varying heat sources together with a two phase microfluidic convection network. While progress has been made on two-phase conjugate simulations at the chip and channel levels, none of those provide a computationally manageable approach. In the present study, a reduced physics conjugate heat transfer model has been developed for simulating two-phase flow boiling through chip embedded micron scale cavities. This model has been validated with good accuracy against data available from literature. The validated model was then extended to predict the thermal performance of a state-of-the-art microprocessor chip with embedded two-phase cooling, where significant improvements in device junction temperatures were observed compared to the baseline cooling solution.

Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

2015 ◽  
Author(s):  
Pritish R. Parida ◽  
Hsin-Hua Tsuei ◽  
Timothy J. Chainer
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
Flow Boiling ◽  
Dielectric Fluid ◽  
Multiphase Model ◽  
Micro Channel ◽  
Complex Flow ◽  
Two Phase ◽  
Computational Performance ◽  
Two Phase Cooling

The 3D (three dimensional) integration of microelectronic chips into chip stacks is an enabling technology to provide a possible path for increasing computational performance. However, 3D chip stacks require a solution to significant new thermal challenges. As a feasible solution, two-phase cooling utilizing a chip-to-chip interconnect-compatible dielectric fluid can be used. This chip-integrated micrometer scale two-phase cooling technology can be essential to fully optimize the benefits of improved integration density and modularity of 3D stacking of high performance integrated circuits (ICs) for future computing systems; but is faced with significant developmental challenges including high fidelity modeling. In the present work, an Eulerian multiphase model has been developed for simulating two-phase evaporative cooling through chip embedded microscale cavities. First, the model was used to predict the flow and heat transfer characteristics for coolant R245fa flowing through a single straight micro channel with cross section 100 × 100 um and length 10 mm. The flow is sub-cooled in the initial section of the channel and saturated in the remaining. The results were compared to experimental data available from literature, focusing on the model capability to predict the correct flow pattern, temperature profile and pressure drop. Next, the validated model was extended to the simulation of complex flow geometries expected in microprocessor chip-stacks with chip-to-chip interconnects.

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

2010 ◽  
Vol 132 (4) ◽  
Author(s):  
Yoon Jo Kim ◽  
Yogendra K. Joshi ◽  
Andrei G. Fedorov ◽  
Young-Joon Lee ◽  
Sung-Kyu Lim
Keyword(s):  
Integrated Circuits ◽  
Mass Flow Rate ◽  
Thermal Management ◽  
Mass Flow ◽  
Flow Rate ◽  
Single Phase ◽  
Hot Spot ◽  
Three Dimensional ◽  
Two Phase ◽  
Two Phase Cooling

It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked ICs, the interlayer microfluidic cooling scheme is adopted and analyzed in this study focusing on a single cooling layer performance. The effects of cooling mode (single-phase versus phase-change) and stack/layer geometry on thermal management performance are quantitatively analyzed, and implications on the through-silicon-via scaling and electrical interconnect congestion are discussed. Also, the thermal and hydraulic performance of several two-phase refrigerants is discussed in comparison with single-phase cooling. The results show that the large internal pressure and the pumping pressure drop are significant limiting factors, along with significant mass flow rate maldistribution due to the presence of hot-spots. Nevertheless, two-phase cooling using R123 and R245ca refrigerants yields superior performance to single-phase cooling for the hot-spot fluxes approaching ∼300 W/cm2. In general, a hybrid cooling scheme with a dedicated approach to the hot-spot thermal management should greatly improve the two-phase cooling system performance and reliability by enabling a cooling-load-matched thermal design and by suppressing the mass flow rate maldistribution within the cooling layer.

Flow Boiling in Horizontal Tubes: Part 3—Development of a New Heat Transfer Model Based on Flow Pattern

1998 ◽  
Vol 120 (1) ◽  
pp. 156-165 ◽  
Author(s):  
N. Kattan ◽  
J. R. Thome ◽  
D. Favrat
Keyword(s):  
Heat Transfer ◽  
Annular Flow ◽  
Flow Boiling ◽  
Heat Transfer Model ◽  
Transfer Model ◽  
Two Phase ◽  
Horizontal Tubes ◽  
High Vapor ◽  
Coefficient Versus ◽  
The Heat Transfer Coefficient

A new heat transfer model for intube flow boiling in horizontal plain tubes is proposed that incorporates the effects of local two-phase flow patterns, flow stratification, and partial dryout in annular flow. Significantly, the local peak in the heat transfer coefficient versus vapor quality can now be determined from the prediction of the location of onset of partial dryout in annular flow. The new method accurately predicts a large, new database of flow boiling data, and is particularly better than existing methods at high vapor qualities (x > 85 percent) and for stratified types of flows.

Effects of Orientation on Critical Heat Flux From Chip Arrays During Flow Boiling

1992 ◽  
Vol 114 (3) ◽  
pp. 290-299 ◽  
Author(s):  
C. O. Gersey ◽  
I. Mudawar
Keyword(s):  
Heat Flux ◽  
Critical Heat Flux ◽  
Single Phase ◽  
Cooling System ◽  
Flow Boiling ◽  
Flow Channel ◽  
Two Phase ◽  
Channel Orientation ◽  
Two Phase Cooling ◽  
Layer Development

Boiling experiments were performed with FC-72 on a series of nine in-line simulated microelectronic chips in a flow channel to ascertain the effects of channel orientation on critical heat flux (CHF). The simulated chips, measuring 10 mm × 10 mm, were flush-mounted to one wall of a 20 mm × 5 mm flow channel. The channel was rotated in increments of 45 degrees through 360 degrees such that the chips were subjected to coolant in upflow, downflow, or horizontal flow with the chips on the top or bottom walls of the channel with respect to gravity. Flow velocity was varied between 13 and 400 cm/s for subcoolings of 3, 14, 25, and 36°C and an inlet pressure of 1.36 bar. While changes in angle of orientation produced insignificant variations in the single-phase heat transfer coefficient, these changes had considerable effects on the boiling pattern in the flow channel and on CHF for velocities below 200 cm/s,’ with some chips reaching CHF at fluxes as low as 18 percent of those corresponding to vertical upflow. Increased subcooling was found to slightly dampen this adverse effect of orientation. The highest CHF values were measured with near vertical upflow and/or upward-facing chips, while the lowest values were measured with near vertical downflow and/or downward-facing chips. These variations in CHF were attributed to differences in flow boiling regime and vapor layer development on the surfaces of the chips between the different orientations. The results of the present study reveal that, while some flexibility is available in the packaging of multi-chip modules in a two-phase cooling system, some orientations should always be avoided.

Development and Application of a UTSG Thermal-Hydraulic Analysis Code

2014 ◽  
Author(s):  
Tenglong Cong ◽  
Guanghui Su ◽  
Wenxi Tian ◽  
Suizheng Qiu
Keyword(s):  
Steam Generator ◽  
Structural Integrity ◽  
Tube Bundle ◽  
Flow Boiling ◽  
Three Dimensional ◽  
Hydraulic Parameters ◽  
Two Phase ◽  
Drift Flux ◽  
Thermal Hydraulic Analysis ◽  
Secondary Side

Structural integrity of steam generator should be maintained during operation, since it performs as the pressure and heat transfer boundary of primary side coolant. Localized thermal-hydraulic parameters of secondary side are essential for the analysis of tube wastage, fatigue and failure. In this paper, a three-dimensional thermohydraulics analysis code, named STAF, is developed based on FLUENT. With STAF code, three-dimensional thermohydraulics of secondary side of AP1000 steam generator are generated. This code is developed based on the porous media theory. In this code, the drift flux two-phase model coupled with a simplified flow boiling model is utilized to present two-phase flow among the U-tube bundle. Downcomer, tube bundle, support plates and primary separators in steam generator are considered in STAF code. The calculated results are compared with a general steam generator thermohydraulic analysis code ATHOS, which is developed by EPRI steam generator group. The comparison indicates that STAF code performs well in evaluating thermal-hydraulic parameters in steam generator. The results show that the flow field varies significantly at different position in AP1000 steam generator. Flow vapor quality at the inlet of primary separators varies significantly, which is a severe challenge to the capacity design of separators.

Microchannel Size Effects on Two-Phase Local Heat Transfer and Pressure Drop in Silicon Microchannel Heat Sinks With a Dielectric Fluid

2007 ◽  
Author(s):  
Tannaz Harirchian ◽  
Suresh V. Garimella
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Flow Boiling ◽  
Heat Sinks ◽  
Dielectric Fluid ◽  
Two Phase ◽  
Microchannel Heat Sinks ◽  
The Heat Transfer Coefficient

Two-phase heat transfer in microchannels can support very high heat fluxes for use in high-performance electronics-cooling applications. However, the effects of microchannel cross-sectional dimensions on the heat transfer coefficient and pressure drop have not been investigated extensively. In the present work, experiments are conducted to investigate the local flow boiling heat transfer in microchannel heat sinks. The effect of channel size on the heat transfer coefficient and pressure drop is studied for mass fluxes ranging from 250 to 1600 kg/m2s. The test sections consist of parallel microchannels with nominal widths of 100, 250, 400, 700, and 1000 μm, all with a depth of 400 μm, cut into 12.7 mm × 12.7 mm silicon substrates. Twenty-five microheaters embedded in the substrate allow local control of the imposed heat flux, while twenty-five temperature microsensors integrated into the back of the substrates enable local measurements of temperature. The dielectric fluid Fluorinert FC-77 is used as the working fluid. The results of this study serve to quantify the effectiveness of microchannel heat transport while simultaneously assessing the pressure drop trade-offs.

Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial Channels

2016 ◽  
Vol 138 (2) ◽  
Author(s):  
Mark Schultz ◽  
Fanghao Yang ◽  
Evan Colgan ◽  
Robert Polastre ◽  
Bing Dang ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Heat Fluxes ◽  
Test Facility ◽  
Coolant Temperature ◽  
Two Phase ◽  
Chip Area ◽  
Power Maps ◽  
Core Areas ◽  
Two Phase Cooling ◽  
Initial Results

Thermal performance for embedded two-phase cooling using dielectric coolant (R1234ze) is evaluated on a ∼20 mm × 20 mm large die. The test vehicles incorporate radial expanding channels with embedded pin fields suitable for through-silicon-via (TSV) interconnects of multidie stacks. Power generating features mimicking those anticipated in future generations of processor chips with eight cores are included. Initial results show that for the types of power maps anticipated, critical heat fluxes (CHFs) in “core” areas of at least 350 W/cm2 with at least 20 W/cm2 “background” heating in rest of the chip area can be achieved with less than 30 °C temperature rise over the inlet coolant temperature. These heat fluxes are significantly higher than those seen for relatively long parallel channel devices of similar base channel dimensions. Experimental results of flow rate, pressure drop, “device,” and coolant temperature are also provided for these test vehicles along with details of the test facility developed to properly characterize the test vehicles.

Progress in the Modeling and Simulation of Flow Boiling Heat Transfer of Binary Fluids Using Advanced Multi-Fluid Modeling Techniques

2012 ◽  
Author(s):  
Vedanth Srinivasan ◽  
Rok Kopun
Keyword(s):  
Heat Transfer ◽  
Mass Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Bubble Dynamics ◽  
Flow Boiling ◽  
Three Dimensional ◽  
Transfer Model ◽  
Transfer Coefficients ◽  
Wide Range

In this paper, we discuss the implementation and testing of a novel boiling mass transfer model to simulate the thermal and phase transformation behavior, generated due to boiling of binary mixtures, using the commercial CFD code AVL FIRE® v2011. The phase change model, based on detailed bubble dynamics effects, is solved in conjunction with incompressible phasic momentum, turbulence and energy equations in a segregated fashion, to study the flow boiling process inside a rectangular duct. Full three dimensional validation studies including the effect of flow velocity and exit pressure conditions, acting on a wide range of operating wall (superheat) temperatures, clearly shows the suppression of heat and mass transfer coefficients with enhancement in flow convection. Competing mechanisms such as phase change process and turbulent convection are identified to influence the heat transfer characteristics. In particular, the varying influence of the mass transfer effects on the heat flux characteristics with alteration in wall temperature is well demonstrated. Comparisons of the predicted total heat flux, computed as the sum of the convection and phase change components, indicate a very good agreement with experimental data, wherever available. Description of the flow field inclusive of phasic fraction, temperature and velocity field provides extensive details of the multiphase behavior of the boiling flow. Some preliminary results on the phase change work flow to model heat transfer in cooling jackets, for automotive applications, is also discussed.

scholarly journals Simulation of Boiling Flow Experiments Close to CHF with the Neptune_CFD Code

2008 ◽  
Vol 2008 ◽  
pp. 1-8 ◽  
Author(s):  
Boštjan Končar ◽  
Borut Mavko
Keyword(s):  
Volume Fraction ◽  
Flow Boiling ◽  
Three Dimensional ◽  
Heated Wall ◽  
Wall Region ◽  
Two Phase ◽  
Subcooled Flow Boiling ◽  
Boiling Flow ◽  
Flow Experiments ◽  
Near Wall

A three-dimensional two-fluid code Neptune_CFD has been validated against the Arizona State University (ASU) and DEBORA boiling flow experiments. Two-phase flow processes in the subcooled flow boiling regime have been studied on ASU experiments. Within this scope a new wall function has been implemented in the Neptune_CFD code aiming to improve the prediction of flow parameters in the near-wall region. The capability of the code to predict the boiling flow regime close to critical heat flux (CHF) conditions has been verified on selected DEBORA experiments. To predict the onset of CHF regime, a simplified model based on the near-wall values of gas volume fraction was used. The results have shown that the code is able to predict the wall temperature increase and the sharp void fraction peak near the heated wall, which are characteristic phenomena for CHF conditions.

Flow Boiling in a Microchannel Heat Sink

2005 ◽  
Author(s):  
Dong Liu ◽  
Suresh V. Garimella
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Boiling Heat Transfer ◽  
Flow Boiling ◽  
Transfer Model ◽  
Microchannel Heat Sink ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Convective Boiling ◽  
Saturated Boiling

Flow boiling heat transfer in a microchannel heat sink is experimentally investigated. The microchannels considered are 275 μm wide and 636 μm deep, and the experiments are conducted at inlet water temperatures in the range of 66 to 95°C and mass fluxes of 341 to 936 kg/m2s. Convective boiling heat transfer coefficients are measured and compared to predictions from correlations proposed for larger channels. While an existing correlation was found to provide satisfactory prediction of the heat transfer coefficient in subcooled boiling in the microchannels, saturated boiling was not well predicted by the correlations for macrochannels. A new heat transfer model is developed to correlate the data in the saturated boiling regime. Good agreement with the experimental measurements indicates that this correlation is suitable for use in the design of two-phase microchannel heat sinks.

Sign in / Sign up

Export Citation Format

Share Document