Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages

2015 ◽  
Author(s):  
Bahar Öner ◽  
Hakan Ertürk
Keyword(s):  
Thermal Diffusion ◽  
Flip Chip ◽  
Heat Dissipation ◽  
Imaging Techniques ◽  
Acoustic Microscopy ◽  
Reconstruction Technique ◽  
Electronic Packages ◽  
Marquardt Algorithm ◽  
Non Destructive

Thermal management problems in electronic packages have been a challenging problem due to increasing number of transistors in chips and reduction in product size. Thermal interface materials (TIM) help heat dissipation by reducing thermal contact resistance between chip and integrated heat spreader (IHS) and TIM quality is critical for effective removal of heat generated from the package. Therefore, identification of defects within TIM is required during package assembly process development. Imaging techniques such as computerized scanning acoustic microscopy (CSAM) and X-ray tomography are used as non-destructive testing techniques to identify TIM defects qualitatively. More recently, it was shown that IR thermography can be used as a qualitative means of identifying defects as well. Thermal diffusion tomography is a powerful alternative to those techniques due to its lower cost and ease of application. In this study, quantitative characterization of defects in TIM is presented using thermal diffusion tomography. The study is conducted considering a high density interconnect flip chip package that includes spreading effect due to different sized IHS and die. Defect size and location are detected analyzing the measured thermal response of electronic package by solving the resulting inverse problem by Levenberg-Marquardt algorithm as an image reconstruction technique.

Characterization of Electronic Packages by Thermal Diffusion Tomography

2009 ◽  
Author(s):  
Hakan Erturk
Keyword(s):  
Thermal Management ◽  
Thermal Diffusion ◽  
Process Development ◽  
Imaging Techniques ◽  
Interface Layer ◽  
Acoustic Microscopy ◽  
Perturbation Approach ◽  
Electronic Packages ◽  
X Rays ◽  
Reconstruction Algorithms

One of the most important functions of an electronic package is thermal management, as package is responsible from removing the heat generated by the transistors to ensure reliability. The quality of the package is very important for proper thermal management and it is important to have minimal flaws that increase thermal resistance of the package. Therefore, detection of flaws in the multi-layered package is critical during the assembly process development to monitor the package quality. This is achieved by techniques such as computerized tomography (CT) using x-rays, or scanning acoustic microscopy (SAM), all of which require very expensive equipment and significant processing time. Thermal diffusion tomography (TDT) can be used for detecting the flaws as a lower cost alternative to these imaging techniques. The feasibility of TDT as a fault detection technique for electronic packages with IR thermometry is considered in the current study. Two reconstruction algorithms considered; an iterative perturbation approach and Levenberg-Marquard method were found to be capable of detecting the flaws in the thermal interface layer.

Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy

1996 ◽  
Author(s):  
O. Diaz de Leon ◽  
M. Nassirian ◽  
C. Todd ◽  
R. Chowdhury
Keyword(s):  
Failure Analysis ◽  
Large Scale ◽  
Flip Chip ◽  
Ultrasonic Waves ◽  
Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Chip Technology ◽  
Ball Joints ◽  
Non Destructive ◽  
Scanning Acoustic Microscope

Abstract Integration of circuits on semiconductor devices with resulting increase in pin counts is driving the need for improvements in packaging for functionality and reliability. One solution to this demand is the Flip- Chip concept in Ultra Large Scale Integration (ULSI) applications [1]. The flip-chip technology is based on the direct attach principle of die to substrate interconnection.. The absence of bondwires clearly enables packages to become more slim and compact, and also provides higher pin counts and higher-speeds [2]. However, due to its construction, with inherent hidden structures the Flip-Chip technology presents a challenge for non-destructive Failure Analysis (F/A). The scanning acoustic microscope (SAM) has recently emerged as a valuable evaluation tool for this purpose [3]. C-mode scanning acoustic microscope (C-SAM), has the ability to demonstrate non-destructive package analysis while imaging the internal features of this package. Ultrasonic waves are very sensitive, particularly when they encounter density variations at surfaces, e.g. variations such as voids or delaminations similar to air gaps. These two anomalies are common to flip-chips. The primary issue with this package technology is the non-uniformity of the die attach through solder ball joints and epoxy underfill. The ball joints also present defects as open contacts, voids or cracks. In our acoustic microscopy study packages with known defects are considered. It includes C-SCAN analysis giving top views at a particular package interface and a B-SCAN analysis that provides cross-sectional views at a desired point of interest. The cross-section analysis capability gives confidence to the failure analyst in obtaining information from a failing area without physically sectioning the sample and destroying its electrical integrity. Our results presented here prove that appropriate selection of acoustic scanning modes and frequency parameters leads to good reliable correlation between the physical defects in the devices and the information given by the acoustic microscope.

Extending Acoustic Microscopy for Comprehensive Failure Analysis Applications

2010 ◽  
Author(s):  
Sebastian Brand ◽  
Matthias Petzold ◽  
Peter Czurratis ◽  
Peter Hoffrogge
Keyword(s):  
Image Processing ◽  
Failure Analysis ◽  
Signal Analysis ◽  
Flip Chip ◽  
Fault Isolation ◽  
Acoustic Microscopy ◽  
Specific Information ◽  
Full Potential ◽  
Time Frequency ◽  
Non Destructive

Abstract In industrial manufacturing of microelectronic components, non-destructive failure analysis methods are required for either quality control or for providing a rapid fault isolation and defect localization prior to detailed investigations requiring target preparation. Scanning acoustic microscopy (SAM) is a powerful tool enabling the inspection of internal structures in optically opaque materials non-destructively. In addition, depth specific information can be employed for two- and three-dimensional internal imaging without the need of time consuming tomographic scan procedures. The resolution achievable by acoustic microscopy is depending on parameters of both the test equipment and the sample under investigation. However, if applying acoustic microscopy for pure intensity imaging most of its potential remains unused. The aim of the current work was the development of a comprehensive analysis toolbox for extending the application of SAM by employing its full potential. Thus, typical case examples representing different fields of application were considered ranging from high density interconnect flip-chip devices over wafer-bonded components to solder tape connectors of a photovoltaic (PV) solar panel. The progress achieved during this work can be split into three categories: Signal Analysis and Parametric Imaging (SA-PI), Signal Analysis and Defect Evaluation (SA-DE) and Image Processing and Resolution Enhancement (IP-RE). Data acquisition was performed using a commercially available scanning acoustic microscope equipped with several ultrasonic transducers covering the frequency range from 15 MHz to 175 MHz. The acoustic data recorded were subjected to sophisticated algorithms operating in time-, frequency- and spatial domain for performing signal- and image analysis. In all three of the presented applications acoustic microscopy combined with signal- and image processing algorithms proved to be a powerful tool for non-destructive inspection.

A Simple Method for Thermal Characterization of Stacked Die Electronic Packages in Staggered Arrangement

2018 ◽  
Vol 15 (3) ◽  
pp. 117-125 ◽  
Author(s):  
Bharath R. Bharadwaj ◽  
SriNithish Kandagadla ◽  
Praveen J. Nadkarni ◽  
V. Krishna ◽  
T. R. Seetharam ◽  
...  
Keyword(s):  
Heat Dissipation ◽  
Superposition Principle ◽  
Thermal Characterization ◽  
Electronic Packages ◽  
Heat Sources ◽  
Linear Superposition ◽  
Simple Method ◽  
Ansys Simulation ◽  
Staggered Arrangement

Abstract The need for compactness and efficiency of processing devices has kept increasing rapidly over the past few years. This need for compactness has driven the dice to be stacked one above the other. But with this come the difficulty of heat dissipation and its characterization because there are multiple heat sources and a single effective heat-conductive path. Hence, it becomes important to know the distribution and characterization of heat and temperature to provide effective cooling systems. In this article, we discuss the temperature distribution of various power configurations on stacked dice with five dice, when the dice are in staggered arrangement. The simulations have been carried out for both free convection and forced convection conditions using the ANSYS commercial software. The linear Superposition principle (LSP) is demonstrated on these configurations and validated with the results obtained from ANSYS simulation. LSP can be applied for the quick estimation of die temperatures with negligible error.

scholarly journals FTIR, Raman and AFM characterization of the clinically valid biochemical parameters of the thrombi in acute ischemic stroke

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Aneta Blat ◽  
Jakub Dybas ◽  
Karolina Chrabaszcz ◽  
Katarzyna Bulat ◽  
Agnieszka Jasztal ◽  
...  
Keyword(s):  
Ischemic Stroke ◽  
Biochemical Parameters ◽  
Imaging Techniques ◽  
Quantitative Imaging ◽  
Automated Analysis ◽  
Force Microscopy ◽  
Atomic Force ◽  
Non Destructive ◽  
Histological Staining

Abstract The significance and utility of innovative imaging techniques in arterial clot analysis, which enable far more detailed and automated analysis compared to standard methods, are presented. The examination of two types of human thrombi is shown, representing the main ischemic stroke etiologies: fibrin–predominant clot of large vessel origin and red blood cells–rich clot of cardioembolic origin. The synergy effect of Fourier–transform infrared spectroscopy (FTIR), Raman spectroscopy (RS) and atomic force microscopy (AFM) techniques supported by chemometrics in comparison with reference histological staining was presented. The main advantage of such approach refers to free–label and non–destructive quantitative imaging of clinically valid, biochemical parameters in whole sample (FTIR–low resolution) and selected regions (RS–ultra–high resolution). We may include here analysis of lipid content, its distribution and total degree of unsaturation as well as analysis of protein content (mainly fibrin and hemoproteins). The AFM studies enhanced the vibrational data, showed clearly shape and thickness of clot features as well as visualized the fibrin framework. The extraordinary sensitivity of FTIR and RS imaging toward detection and discrimination of clinically valid parameters in clot confirms its applicability in assessment of thrombi origin.

Edge Enhancement for Acoustic Microscopy of Flip Chip Devices

2005 ◽  
Author(s):  
Daniel J. D. Sullivan ◽  
Andrew J. Komrowski ◽  
Luis A. Curiel ◽  
Kevan V. Tan
Keyword(s):  
Flip Chip ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Edge Enhancement ◽  
New Materials ◽  
Ir Imaging ◽  
The Hours ◽  
Edge Cracks ◽  
Standard Practices ◽  
Non Destructive

Abstract Scanning acoustic microscopy (SAM) is a non-destructive tool for analysis of packaged devices. New materials, package configurations, and technologies have required adaptation of standard practices in SAM. The detection of cracked die, voids, or delamination in the underfill or package are standard issues for SAM. SAM can routinely detect large cracks through the central 80% of the die; however, the occurrence of smaller cracks at the edge of the flip chip die is problematic. This article proposes a model in which alteration in the standard SAM parameters, the gain and Time-of-Flight, enable detection of die edge cracks in assembled Flip Chip devices. IR imaging after thinning and polishing of the die confirms the die edge cracks. The SAM analysis can replace the IR imaging for detection of small die edge cracks taking minutes to complete instead of the hours involved in the sample preparation for IR imaging.

Non-Destructive Characterization of Multi Layer Objects by Thermal Tomography

2009 ◽  
Author(s):  
Hakan Erturk
Keyword(s):  
Low Cost ◽  
Operating Conditions ◽  
Acoustic Microscopy ◽  
Destructive Testing ◽  
Multilayer Systems ◽  
Thermal Signal ◽  
Thermal Tomography ◽  
Non Destructive ◽  
Non Destructive Characterization

Multi layered systems are frequently used for thermal management where the quality of the layers and the interfaces are critical in achieving desired operating conditions. Defects that introduce an additional thermal resistance in the thermal path must be prevented. Non-destructive characterization tools such as computerized tomography or scanning acoustic microscopy have been used to identify such problems, and help improve manufacturing process to ensure product quality. In a system with opaque solids, thermal tomography that relies on a thermal signal diffusing through the layers can be used to identify the defects in the system. Such a technique can constitute a practical and low cost alternative to the other non-destructive testing methods necessitating expansive equipment. Feasibility of thermal tomography for characterization of multilayer systems is tested considering different measurement configurations based on areal and discrete measurements. The configurations are compared considering different geometric parameters with Levenberg-Marquard method used for image reconstruction.

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