9D-6 Signal Analysis in Scanning Acoustic Microscopy for Non-Destructive Assessment of Connective Defects in Flip-Chip BGA Devices

2007 ◽  
Author(s):  
S. Brand ◽  
K. Raum ◽  
P. Czuratis ◽  
P. Hoffrogge
Keyword(s):  
Signal Analysis ◽  
Flip Chip ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Non Destructive

Extending Acoustic Microscopy for Comprehensive Failure Analysis Applications

2010 ◽  
Author(s):  
Sebastian Brand ◽  
Matthias Petzold ◽  
Peter Czurratis ◽  
Peter Hoffrogge
Keyword(s):  
Image Processing ◽  
Failure Analysis ◽  
Signal Analysis ◽  
Flip Chip ◽  
Fault Isolation ◽  
Acoustic Microscopy ◽  
Specific Information ◽  
Full Potential ◽  
Time Frequency ◽  
Non Destructive

Abstract In industrial manufacturing of microelectronic components, non-destructive failure analysis methods are required for either quality control or for providing a rapid fault isolation and defect localization prior to detailed investigations requiring target preparation. Scanning acoustic microscopy (SAM) is a powerful tool enabling the inspection of internal structures in optically opaque materials non-destructively. In addition, depth specific information can be employed for two- and three-dimensional internal imaging without the need of time consuming tomographic scan procedures. The resolution achievable by acoustic microscopy is depending on parameters of both the test equipment and the sample under investigation. However, if applying acoustic microscopy for pure intensity imaging most of its potential remains unused. The aim of the current work was the development of a comprehensive analysis toolbox for extending the application of SAM by employing its full potential. Thus, typical case examples representing different fields of application were considered ranging from high density interconnect flip-chip devices over wafer-bonded components to solder tape connectors of a photovoltaic (PV) solar panel. The progress achieved during this work can be split into three categories: Signal Analysis and Parametric Imaging (SA-PI), Signal Analysis and Defect Evaluation (SA-DE) and Image Processing and Resolution Enhancement (IP-RE). Data acquisition was performed using a commercially available scanning acoustic microscope equipped with several ultrasonic transducers covering the frequency range from 15 MHz to 175 MHz. The acoustic data recorded were subjected to sophisticated algorithms operating in time-, frequency- and spatial domain for performing signal- and image analysis. In all three of the presented applications acoustic microscopy combined with signal- and image processing algorithms proved to be a powerful tool for non-destructive inspection.

Edge Enhancement for Acoustic Microscopy of Flip Chip Devices

2005 ◽  
Author(s):  
Daniel J. D. Sullivan ◽  
Andrew J. Komrowski ◽  
Luis A. Curiel ◽  
Kevan V. Tan
Keyword(s):  
Flip Chip ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Edge Enhancement ◽  
New Materials ◽  
Ir Imaging ◽  
The Hours ◽  
Edge Cracks ◽  
Standard Practices ◽  
Non Destructive

Abstract Scanning acoustic microscopy (SAM) is a non-destructive tool for analysis of packaged devices. New materials, package configurations, and technologies have required adaptation of standard practices in SAM. The detection of cracked die, voids, or delamination in the underfill or package are standard issues for SAM. SAM can routinely detect large cracks through the central 80% of the die; however, the occurrence of smaller cracks at the edge of the flip chip die is problematic. This article proposes a model in which alteration in the standard SAM parameters, the gain and Time-of-Flight, enable detection of die edge cracks in assembled Flip Chip devices. IR imaging after thinning and polishing of the die confirms the die edge cracks. The SAM analysis can replace the IR imaging for detection of small die edge cracks taking minutes to complete instead of the hours involved in the sample preparation for IR imaging.

Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy

1996 ◽  
Author(s):  
O. Diaz de Leon ◽  
M. Nassirian ◽  
C. Todd ◽  
R. Chowdhury
Keyword(s):  
Failure Analysis ◽  
Large Scale ◽  
Flip Chip ◽  
Ultrasonic Waves ◽  
Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Chip Technology ◽  
Ball Joints ◽  
Non Destructive ◽  
Scanning Acoustic Microscope

Abstract Integration of circuits on semiconductor devices with resulting increase in pin counts is driving the need for improvements in packaging for functionality and reliability. One solution to this demand is the Flip- Chip concept in Ultra Large Scale Integration (ULSI) applications [1]. The flip-chip technology is based on the direct attach principle of die to substrate interconnection.. The absence of bondwires clearly enables packages to become more slim and compact, and also provides higher pin counts and higher-speeds [2]. However, due to its construction, with inherent hidden structures the Flip-Chip technology presents a challenge for non-destructive Failure Analysis (F/A). The scanning acoustic microscope (SAM) has recently emerged as a valuable evaluation tool for this purpose [3]. C-mode scanning acoustic microscope (C-SAM), has the ability to demonstrate non-destructive package analysis while imaging the internal features of this package. Ultrasonic waves are very sensitive, particularly when they encounter density variations at surfaces, e.g. variations such as voids or delaminations similar to air gaps. These two anomalies are common to flip-chips. The primary issue with this package technology is the non-uniformity of the die attach through solder ball joints and epoxy underfill. The ball joints also present defects as open contacts, voids or cracks. In our acoustic microscopy study packages with known defects are considered. It includes C-SCAN analysis giving top views at a particular package interface and a B-SCAN analysis that provides cross-sectional views at a desired point of interest. The cross-section analysis capability gives confidence to the failure analyst in obtaining information from a failing area without physically sectioning the sample and destroying its electrical integrity. Our results presented here prove that appropriate selection of acoustic scanning modes and frequency parameters leads to good reliable correlation between the physical defects in the devices and the information given by the acoustic microscope.

scholarly journals Possibilities of using scanning acoustic microscopy to analyze incompatibilities in braze welded joints

2019 ◽  
Vol 91 (10) ◽  
pp. 7-15
Author(s):  
Tomasz Piwowarczyk ◽  
Marcin Korzeniowski ◽  
Dawid Majewski
Keyword(s):  
Aluminum Alloys ◽  
Welded Joints ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Ultrasonic Techniques ◽  
Titanium Grade ◽  
Non Destructive

This article explores the possibilities of using non-destructive ultrasonic techniques to analyze the quality of lapped braze-welded joints. The tests were performed for 4 material groups (DC03+ZE steel and X5CrNi18-19 steel, aluminum alloys AW-5754 and AW-6061, titanium Grade 2 and copper Cu-ETP). As part of the work, additional materials and joint processes and its parameters were selected (TIG, MIG, laser). The quality of joints was monitored using scanning acoustic microscopy. Based on the A-scan andC-scan images, potential joints imperfections were determined. The possibilities of using advanced ultrasonic techniques to analyze the quality of braze joints was assessed.

scholarly journals Scanning acoustic microscopy as a non-destructive imaging tool to localize defects inside battery cells

2020 ◽  
Vol 6 ◽  
pp. 100035 ◽  
Author(s):  
L. Pitta Bauermann ◽  
L.V. Mesquita ◽  
C. Bischoff ◽  
M. Drews ◽  
O. Fitz ◽  
...  
Keyword(s):  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Imaging Tool ◽  
Non Destructive ◽  
Battery Cells

Detection Resolution Analysis of Scanning Acoustic Microscopy Used in Electronic Packaging

2014 ◽  
Vol 536-537 ◽  
pp. 272-275
Author(s):  
Xiang Hui Guo ◽  
Chun Guang Xu ◽  
Liu Yang ◽  
Kai Peng
Keyword(s):  
Electronic Packaging ◽  
Ultrasonic Transducer ◽  
Experimental Results ◽  
Acoustic Microscopy ◽  
Center Frequency ◽  
Detection Accuracy ◽  
Scanning Acoustic Microscopy ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
Non Destructive

Scanning Acoustic Microscopy (SAM) has been a powerful non-destructive testing tool used in electronic packaging and material characterization. With the development of 3D electronic packaging, internal dimensions of electronic packaging are getting more and more smaller, and the detection accuracy of existing non-destructive testing technology is far behind the requirements of manufacturing technology. In this study, a set of practical SAM system was developed independently by our Lab. And its detection resolution was analyzed using high frequency focused transducers with center frequency ranging from 20 MHz to 100MHz. The experimental results show that the lateral resolution of the ultrasonic transducer with 100MHz central frequency can reach about 40 microns, which is consistent with calculated resolution. Comparing with Sparrow criteria, Rayleigh criteria is more coherent with the experimental results.

Sign in / Sign up

Export Citation Format

Share Document