Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks

2011 ◽  
Author(s):  
Hung-Yun Lin ◽  
Abhishek Tambat ◽  
Ian Claydon ◽  
Ganesh Subbarayan ◽  
Dae Young Jung ◽  
...  
Keyword(s):  
Room Temperature ◽  
Flip Chip ◽  
Temperature Dependent ◽  
Interlayer Dielectric ◽  
Risk Of Fracture ◽  
Finite Element Software ◽  
Reflow Temperature ◽  
Deformation State ◽  
Die Surface ◽  
Low K

The risk of fracture in Interlayer Dielectric (ILD) stack is evaluated for various configurations of flip-chip packages in this paper. A novel analysis on the mechanical behavior of package with a focus on die surface provides the insights into the critical deformation state as well as its location. In Controlled Collapse Chip Connection (C4) process, the reflow phase involves a cooling of the entire package from the reflow temperature to room temperature, and is critical for package induced die cracking (Chip-Package Interaction or CPI). We use commercial finite element software ABAQUS to construct local sub-models of ILD region from global models of a representative 3-D package with component materials modeled as being temperature dependent elastic or elasto-plastic as appropriate. The risk of ILD fracture is systematically investigated using the described approach.

Development of a stress compensation layer for thin pixel modules 3D assembly

2014 ◽  
Vol 2014 (1) ◽  
pp. 000787-000793 ◽  
Author(s):  
G. Pares ◽  
T. McMullen ◽  
S. Tomé ◽  
L. Vignoud ◽  
R. Bates ◽  
...  
Keyword(s):  
Room Temperature ◽  
Flip Chip ◽  
Building Blocks ◽  
Back Side ◽  
Pixel Detector ◽  
Front Side ◽  
Radiation Length ◽  
Reflow Temperature ◽  
Solder Reflow ◽  
Deposition Conditions

The pixel modules are the fundamental building blocks of the ATLAS pixel detector system used in CERN LHC facility. They consist in their basic form of a silicon sensor that is flip-chipped bonded to a CMOS read-out integrated chip (ROIC). One of the main objectives for the ATLAS experiment is to develop an approach towards low mass modules and thus reducing radiation length. From the module perspective this can be achieved by using advanced 3D technology processes that includes the formation of copper and solder micro-bumps on top of the ROIC front-side, the thinning of both the sensor and the CMOS ROIC and finally the flip chip assembly of the 2 chips. The thinning of the silicon chips leads to low bump yield at the solder reflow stage due to bad co-planarity of the two chips creating dead zones within the pixel array. In the case of the ROIC, which is thinned to 100um, the chip bow varies from − 100 μm at room temperature to + 175 μm at reflow temperature resulting of CTE mismatch between materials in the CMOS stack and the silicon substrate. Our objective is to compensate dynamically the stress of the front side stack by adding a compensating layer to the back-side of the wafer. Utilising our material thermo-mechanical database coupled with a proprietary analytical simulator and measuring the bow of the ROIC at die level we are able to reduce the bow magnitude by approximately a factor of 3 by the introduction of the compensating layer. We show that it is possible to change the sign of the bow at room temperature after deposition of a SiN/Al:Si stack. This amplitude of the correction can be manipulated by the deposition conditions of the SiN/Al:Si stack. Further development of the backside deposition conditions are on-going where the target is to control the room temperature bow close to zero and reducing the bow magnitude throughout the full solder reflow temperature range hence conserving bump yield. In keeping with a 3D process the materials used are compatible with Through Silicon Via (TSV) technology with a TSV last approach in mind should we integrate this technology in the future.

Development of a Stress Compensation Layer for 3-D Assembly of Thin Pixel Modules

2015 ◽  
Vol 12 (1) ◽  
pp. 29-36
Author(s):  
G. Pares ◽  
T. McMullen ◽  
S. Tomé ◽  
L. Vignoud ◽  
R. Bates ◽  
...  
Keyword(s):  
Room Temperature ◽  
Flip Chip ◽  
Building Blocks ◽  
Back Side ◽  
Pixel Detector ◽  
Front Side ◽  
Radiation Length ◽  
Reflow Temperature ◽  
Solder Reflow ◽  
Deposition Conditions

Pixel modules are the fundamental building blocks of the ATLAS pixel detector system used in the CERN LHC facility. In their basic form, they consist of a silicon sensor that is flip-chip bonded to a CMOS read-out integrated chip (ROIC). One of the main objectives for the ATLAS experiment is to develop an approach toward low-mass modules, thus reducing radiation length. From the module perspective, this can be achieved by using advanced 3-D technology processes that include the formation of copper and solder microbumps on top of the ROIC front side, the thinning of both the sensor and the CMOS ROIC, and, finally, the flip-chip assembly of the two chips. The thinning of the silicon chips leads to low bump yield at the solder reflow stage, due to bad coplanarity of the two chips creating dead zones within the pixel array. In the case of the ROIC, which is thinned to 100 μm, the chip bow varies from −100 μm at room temperature to +175 μm at reflow temperature, resulting in CTE mismatch between materials in the CMOS stack and the silicon substrate. Our objective was to compensate dynamically for the stress of the front-side stack by adding a compensating layer to the back side of the wafer. Using our material thermomechanical database coupled with a proprietary analytical simulator, and measuring the bow of the ROIC at die level, we were able to reduce the bow magnitude by approximately a factor of 3 by introducing the compensating layer. We show that it is possible to change the sign of the bow at room temperature after deposition of a SiN/Al:Si stack. The amplitude of the correction can be manipulated by the deposition conditions of the SiN/Al:Si stack. Further development of the back-side deposition conditions are ongoing, where the target is to control the room temperature bow close to zero and reduce the bow magnitude throughout the full solder reflow temperature range, hence conserving bump yield. In keeping with a 3-D process, the materials used are compatible with through-silicon via (TSV) technology with a TSV-last approach in mind, should we integrate this technology in the future.

Thin PoP: Warpage Control for Thinner PoP Package in Mobile Applications

2012 ◽  
Vol 2012 (1) ◽  
pp. 001162-001168
Author(s):  
Yuka Tamadate ◽  
Seiji Sato ◽  
Hitomi Imai ◽  
Kota Takeda ◽  
Takeshi Meguro ◽  
...  
Keyword(s):  
Mobile Applications ◽  
Room Temperature ◽  
Flip Chip ◽  
Support Material ◽  
Assembly Process ◽  
Material Thickness ◽  
Reflow Temperature ◽  
Simulation Results

In order to significantly improve warpage of a PoP bottom package, Shinko developed an enhanced PoP structure. The inclusion of a support material attached to the backside of the flip chip die and over molded resin is the structure's key attribute. By adjusting the balance of each material (mold resin, substrate and support material thickness), we can better control warpage at both room temperature and reflow temperature. This enhanced thin PoP structure can be easily incorporated into a standard assembly process with existing equipment sets. This paper describes simulation results, along with measured warpage characteristics of the new package.

Effects of Under-Fill Curing on Substrate Warpage

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001857-001875
Author(s):  
Robert L. Hubbard
Keyword(s):  
Flip Chip ◽  
Heat Processing ◽  
Complex Nature ◽  
Optimum Conditions ◽  
Model Studies ◽  
Convection Oven ◽  
Die Surface ◽  
Thermal Data ◽  
Die Stress ◽  
Low K

The formulation of flip-chip under-fill adhesives has become more critical to avoid stress-induced cracking at the solder ball interfaces farthest from the center of the die (neutral point) and of the low-k dielectric layers on the die surface. Single die packages, multiple die packages, and thin core-less substrates have now become so warped as to make the ball attach and board attach processes difficult. Recommended under-fill supplier cure profiles are generally accepted without much modification. This work compares the stress-induced substrate warpage developed in flip-chip assemblies using seven different under-fills from three different suppliers. Both low and high Tg materials from each supplier are included. Standard isothermal convection oven cures and variable frequency microwave (VFM) cures were compared with programmed multi-step cure profiles to determine the optimum conditions for lowest die stress and substrate warpage. Due to the complex nature of modern under-fill mixtures and the significant differences in the heating mechanisms, the thermo-mechanical properties of the cured resins are not easily interpreted with respect to cause and effect, however some of the results are surprising. The differences in warpage between “full cure” and “cure to Tg” profiles for both heating methods are demonstrated and discussed with respect to potential adhesive network structures from model studies and actual thermal data. Recommendations are made for dispense temperatures, ramp rates, soak temperatures, and extended curing. These effects are important when assemblies face additional heat processing such as subsequent solder reflow.

(111) Monocrystalline Nickel Films

1972 ◽  
Vol 30 ◽  
pp. 512-513
Author(s):  
T.E. Pratt ◽  
R.W. Vook
Keyword(s):  
Film Thickness ◽  
Deposition Rate ◽  
Room Temperature ◽  
Narrow Range ◽  
High Vacuum ◽  
Residual Pressure ◽  
Temperature Dependent ◽  
Deposition Parameters ◽  
Transmission Electron ◽  
Substrate Temperatures

(111) oriented thin monocrystalline Ni films have been prepared by vacuum evaporation and examined by transmission electron microscopy and electron diffraction. In high vacuum, at room temperature, a layer of NaCl was first evaporated onto a freshly air-cleaved muscovite substrate clamped to a copper block with attached heater and thermocouple. Then, at various substrate temperatures, with other parameters held within a narrow range, Ni was evaporated from a tungsten filament. It had been shown previously that similar procedures would yield monocrystalline films of CU, Ag, and Au.For the films examined with respect to temperature dependent effects, typical deposition parameters were: Ni film thickness, 500-800 A; Ni deposition rate, 10 A/sec.; residual pressure, 10-6 torr; NaCl film thickness, 250 A; and NaCl deposition rate, 10 A/sec. Some additional evaporations involved higher deposition rates and lower film thicknesses.Monocrystalline films were obtained with substrate temperatures above 500° C. Below 450° C, the films were polycrystalline with a strong (111) preferred orientation.

Temperature Dependent Line-Shape of the Silicon Dangling Bond EPR-Resonance in Polycrystalline Silicon

1996 ◽  
Vol 452 ◽  
Author(s):  
N. H. Nickel ◽  
E. A. Schiff
Keyword(s):  
Electron Paramagnetic Resonance ◽  
Polycrystalline Silicon ◽  
Room Temperature ◽  
Dangling Bond ◽  
Temperature Dependent ◽  
Paramagnetic Resonance ◽  
Temperature Electron ◽  
Motional Narrowing ◽  
G Value ◽  
Electron Paramagnetic

AbstractThe temperature dependence of the silicon dangling-bond resonance in polycrystalline (poly-Si) and amorphous silicon (a-Si:H) was measured. At room temperature, electron paramagnetic resonance (EPR) measurements reveal an isotropie g-value of 2.0055 and a line width of 6.5 and 6.1 G for Si dangling-bonds in a-Si:H and poly-Si, respectively. In both materials spin density and g-value are independent of temperature. While in a-Si:H the width of the resonance did not change with temperature, poly-Si exhibits a remarkable T dependence of ΔHpp. In unpassivated poly-Si a pronounced decrease of ΔHpp is observed for temperatures above 300 K. At 384 K ΔHpp reaches a minimum of 5.1 G, then increases to 6.1 G at 460 K, and eventually decreases to 4.6 G at 530 K. In hydrogenated poly-Si ΔHpp decreases monotonically above 425 K. The decrease of ΔHpp is attributed to electron hopping causing motional narrowing. An average hopping distance of 15 and 17.5 Å was estimated for unhydrogenated and H passivated poly-Si, respectively.

scholarly journals Thermochromic aggregation-induced dual phosphorescence via temperature-dependent sp3-linked donor-acceptor electronic coupling

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Tao Wang ◽  
Zhubin Hu ◽  
Xiancheng Nie ◽  
Linkun Huang ◽  
Miao Hui ◽  
...  
Keyword(s):  
Excited State ◽  
Room Temperature ◽  
Electronic Coupling ◽  
Temperature Dependent ◽  
Molecular Systems ◽  
Donor And Acceptor ◽  
Theoretical Investigations ◽  
Donor Acceptor ◽  
And Control ◽  
Two Temperature

AbstractAggregation-induced emission (AIE) has proven to be a viable strategy to achieve highly efficient room temperature phosphorescence (RTP) in bulk by restricting molecular motions. Here, we show that by utilizing triphenylamine (TPA) as an electronic donor that connects to an acceptor via an sp3 linker, six TPA-based AIE-active RTP luminophores were obtained. Distinct dual phosphorescence bands emitting from largely localized donor and acceptor triplet emitting states could be recorded at lowered temperatures; at room temperature, only a merged RTP band is present. Theoretical investigations reveal that the two temperature-dependent phosphorescence bands both originate from local/global minima from the lowest triplet excited state (T1). The reported molecular construct serves as an intermediary case between a fully conjugated donor-acceptor system and a donor/acceptor binary mix, which may provide important clues on the design and control of high-freedom molecular systems with complex excited-state dynamics.

scholarly journals Local ferroelectric polarization switching driven by nanoscale distortions in thermoelectric $${\text {Sn}}_{0.7}{\text {Ge}}_{0.3}{\text {Te}}$$

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Aastha Vasdev ◽  
Moinak Dutta ◽  
Shivam Mishra ◽  
Veerpal Kaur ◽  
Harleen Kaur ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Figure Of Merit ◽  
Room Temperature ◽  
Lattice Thermal Conductivity ◽  
Direct Evidence ◽  
Temperature Dependent ◽  
Force Microscopy ◽  
Ferroelectric Domains ◽  
Pdf Analysis ◽  
Ferroelectric Transition Temperature

AbstractA remarkable decrease in the lattice thermal conductivity and enhancement of thermoelectric figure of merit were recently observed in rock-salt cubic SnTe, when doped with germanium (Ge). Primarily, based on theoretical analysis, the decrease in lattice thermal conductivity was attributed to local ferroelectric fluctuations induced softening of the optical phonons which may strongly scatter the heat carrying acoustic phonons. Although the previous structural analysis indicated that the local ferroelectric transition temperature would be near room temperature in $${\text {Sn}}_{0.7}{\text {Ge}}_{0.3}{\text {Te}}$$ Sn 0.7 Ge 0.3 Te , a direct evidence of local ferroelectricity remained elusive. Here we report a direct evidence of local nanoscale ferroelectric domains and their switching in $${\text {Sn}}_{0.7}{\text {Ge}}_{0.3}{\text {Te}}$$ Sn 0.7 Ge 0.3 Te using piezoeresponse force microscopy(PFM) and switching spectroscopy over a range of temperatures near the room temperature. From temperature dependent (250–300 K) synchrotron X-ray pair distribution function (PDF) analysis, we show the presence of local off-centering distortion of Ge along the rhombohedral direction in global cubic $${\text {Sn}}_{0.7}{\text {Ge}}_{0.3}{\text {Te}}$$ Sn 0.7 Ge 0.3 Te . The length scale of the $${\text {Ge}}^{2+}$$ Ge 2 + off-centering is 0.25–0.10 Å near the room temperatures (250–300 K). This local emphatic behaviour of cation is the cause for the observed local ferroelectric instability, thereby low lattice thermal conductivity in $${\text {Sn}}_{0.7}{\text {Ge}}_{0.3}{\text {Te}}$$ Sn 0.7 Ge 0.3 Te .

Atomistic prediction on the configuration- and temperature-dependent dielectric constant of Be0.25Mg0.75O superlattice as a high-κ dielectric layer

2021 ◽  
Author(s):  
Gyuseung Han ◽  
In Won Yeu ◽  
Kun Hee Ye ◽  
Seung-Cheol Lee ◽  
Cheol Seong Hwang ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Dft Calculations ◽  
Bond Length ◽  
Dielectric Layer ◽  
Room Temperature ◽  
High Dielectric Constant ◽  
Temperature Dependent ◽  
High Dielectric

Through DFT calculations, a Be0.25Mg0.75O superlattice having long apical Be–O bond length is proposed to have a high bandgap (>7.3 eV) and high dielectric constant (∼18) at room temperature and above.

Temperature-induced structural phase transitions in RERhSn (RE = Y, Gd-Tm, Lu)

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Simon Engelbert ◽  
Rolf-Dieter Hoffmann ◽  
Jutta Kösters ◽  
Steffen Klenner ◽  
Rainer Pöttgen
Keyword(s):  
Rare Earth ◽  
Phase Transitions ◽  
Driving Force ◽  
Room Temperature ◽  
Structural Phase ◽  
Structural Phase Transitions ◽  
Line Broadening ◽  
X Ray Diffraction ◽  
Temperature Dependent ◽  
X Ray

Abstract The structures of the equiatomic stannides RERhSn with the smaller rare earth elements Y, Gd-Tm and Lu were reinvestigated on the basis of temperature-dependent single crystal X-ray diffraction data. GdRhSn crystallizes with the aristotype ZrNiAl at 293 and 90 K. For RE = Y, Tb, Ho and Er the HP-CeRuSn type (approximant with space group R3m) is already formed at room temperature, while DyRhSn adopts the HP-CeRuSn type below 280 K. TmRhSn and LuRhSn show incommensurate modulated variants with superspace groups P31m(1/3; 1/3; γ) 000 (No. 157.1.23.1) (γ = 3/8 for TmRhSn and γ = 2/5 for LuRhSn). The driving force for superstructure formation (modulation) is a strengthening of Rh–Sn bonding. The modulation is expressed in a 119Sn Mössbauer spectrum of DyRhSn at 78 K through line broadening.

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