Electromigration in Copper-Core Solder Ball Joints During Thermal Cycle Tests

2011 ◽  
Author(s):  
Shinichi Fujiwara ◽  
Nobuhiko Chiwata ◽  
Masaru Fujiyoshi ◽  
Motoki Wakano ◽  
Hisashi Tanie
Keyword(s):  
Intermetallic Compounds ◽  
Cross Sections ◽  
Current Density ◽  
Thermal Cycle ◽  
Solder Joints ◽  
Test Sample ◽  
Cathode Side ◽  
Solder Balls ◽  
Current Densities ◽  
Semiconductor Packages

Electromigration current densities in Cu and Al lines on a silicon die exceed 1.0 × 106 A/cm2. However, solder joints can only withstand electromigration current densities below about 1.0 × 104 A/cm2. Thus, electromigration in solder joints will become a problem in semiconductor packages in the near future. Previous studies demonstrated that Cu-core solder balls increased the electromigration lifetime and led to better current stability at temperatures below 423K. This is because electrons flow through the Cu cores, reducing the current density on the cathode side, which is where electromigration occurs. In the present study, we forcused on the reliability of solder joints in a combined environment by examining the effect of thermal cycle tests on the current in a new test sample. A new test sample for the evaluation of joining reliability by using Cu-core solder balls in a combined enbironment was made. In initial tests, this test sample exhibited similar results to those observed in previous studies. Cu-core solder balls subjected to cyclic testing at 233/398K and a current density of 1.0 × 104 A/cm2 exhibited lower reliabilities than when there was no current. Examination of cross-sections of the solder balls after reliability testing revealed that the combined environment accelerated growth of intermetallic compounds and cracks in the joining region. In a combined environment, Cu-core balls were converted into intermetallic compounds on the anode side. This phenomenon is thought to occur due to the different electrical resistivities of Cu-Sn intermetallic compounds.

Electromigration in Solder Joints for High Temperature Flip-Chip Application

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 002481-002506
Author(s):  
Mathias Nowottnick ◽  
Andreas Fix
Keyword(s):  
High Temperature ◽  
Current Density ◽  
Flip Chip ◽  
Solder Joints ◽  
Metallographic Analysis ◽  
Solder Alloys ◽  
Directed Movement ◽  
Cross Sectional ◽  
Current Densities ◽  
And Migration

The electromigration effects in chip metallization and wire bonds are well known and detailed investigated. Current density could be extremely high because of the small size of the cross sectional area of conductors. This can cause a migration of metal atoms toward the electrical field, so current densities up to 106 A/cm2 are possible. In comparison with chip structures are the usual solder joints of flip chips relatively thick. But the homologue temperature of solder alloys, typically based on tin, is also much higher than for gold or aluminum wires. For instance a SAC solder alloy is naturally preheated up to 0.6 homologue temperature, for high temperature application with 125 °C operating temperature even more than 0.8. This means, that atoms are very agile and a directed movement needs only lower field strength. Additionally is the specific resistance of solder alloys tenfold higher than for aluminum, copper or silver. So is the self-heating of solder joints not negligible. This contribution shows the test results of flip-chip assemblies, loaded with different current densities and stored at 125 °C ambient temperature. At the end of life of a significant number of test chips, a metallographic analysis shows the causing failure effects and weak spots of assemblies. Accompanying simulations help to explain the interaction between current density and migration effects.

Effects of electromigration on the growth of intermetallic compounds in Cu/SnBi/Cu solder joints

2008 ◽  
Vol 23 (10) ◽  
pp. 2591-2596 ◽  
Author(s):  
X. Gu ◽  
D. Yang ◽  
Y.C. Chan ◽  
B.Y. Wu
Keyword(s):  
Activation Energy ◽  
Solder Joint ◽  
Intermetallic Compounds ◽  
Direct Current ◽  
Solder Joints ◽  
Cathode Side ◽  
Anode Side ◽  
Kinetics Parameters ◽  
Ambient Temperatures ◽  
Current Stressing

In this study, the effects of electromigration (EM) on the growth of Cu–Sn intermetallic compounds (IMCs) in Cu/SnBi/Cu solder joints under 5 × 103 A/cm2 direct current stressing at 308, 328, and 348 K were investigated. For each Cu/SnBi/Cu solder joint under current stressing, the IMCs at the cathode side grew faster than that at the anode side. The growth of these IMCs at the anode side and the cathode side were enhanced by electric current. The growth of these IMCs at the cathode followed a parabolic growth law. The kinetics parameters of the growth of the IMCs were calculated from the thickness data of the IMCs at the cathode side at different ambient temperatures. The calculated intrinsic diffusivity (D0) of the Cu–Sn IMCs was 9.91 × 10−5 m2/s, and the activation energy of the growth of the total Cu–Sn IMC layer was 89.2 kJ/mol (0.92 eV).

The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing

2019 ◽  
Vol 31 (4) ◽  
pp. 261-270
Author(s):  
Guang Chen ◽  
Jiqiang Li ◽  
Xinwen Kuang ◽  
Yaofeng Wu ◽  
Fengshun Wu
Keyword(s):  
Solder Joint ◽  
Current Density ◽  
Composite Solder ◽  
Solder Joints ◽  
Experimental Results ◽  
Lead Free ◽  
Cathode Side ◽  
High Current ◽  
Sac305 Solder ◽  
Content Type

Purpose The purpose of this paper is to investigate the effect of nickel-plated graphene (Ni-GNS) on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints before and after an electro-migration (EM) experiment. Design/methodology/approach In this paper, SAC305 solder alloy doped with 0.1 Wt.% Ni-GNS was prepared via the powder metallurgy method. A U-shaped sample structure was also designed and prepared to conduct an EM experiment. The EM experiment was carried out with a current density of 1.5 × 104 A/cm2. The microstructural and mechanical evolutions of both solder joints under EM stressing were comparatively studied using SEM and nanoindentation. Findings The experimental results showed that for the SAC305 solder, the interfacial intermetallic compounds (IMC) formulated a protrusion with an average height of 0.42 µm at the anode after 360 h of EM stressing; however, despite this, the surface of the composite solder joint was relatively smooth. During the stressing period, the interfacial IMC on the anode side of the plain SAC305 solder showed a continuous increasing trend, while the IMC at the cathode presented a decreasing trend for its thickness as the stressing time increased; after 360 h of stressing, some cracks and voids had formed on the cathode side. For the SAC305/ Ni-GNS composite solder, a continuous increase in the thickness of the interfacial IMC was found on both the anode and cathode side; the growth rate of the interfacial IMC at the anode was higher than that at the cathode. The nanoindentation results showed that the hardness of the SAC305 solder joint presented a gradient distribution after EM stressing, while the hardness data showed a relatively homogeneous distribution in the SAC305/ Ni-GNS solder joint. Originality/value The experimental results showed that the Ni-GNS reinforcement could effectively mitigate the EM behavior in solder joints under high current stressing. Specifically, the Ni particles that plated the graphene sheets can work as a fixing agent to suppress the diffusion and migration of Sn and Cu atoms by forming Sn-Cu-Ni IMC. In addition, the nanoidentation results also indicated that the addition of the Ni-GNS reinforcement was very helpful in maintaining the mechanical stability of the solder joint. These findings have provided a theoretical and experimental basis for the practical application of this novel composite solder with high current densities.

Microstructure and Reliability of Sputter Deposited Cr-Crcu-Cu thin Films for Flip-Chip Applications

1996 ◽  
Vol 445 ◽  
Author(s):  
Na Zhang ◽  
Mark Mcnicholas ◽  
Neil Colvin
Keyword(s):  
Cross Sections ◽  
Thermal Cycle ◽  
Flip Chip ◽  
Grain Structure ◽  
Transmission Electron ◽  
Alloy Solder ◽  
Solder Balls ◽  
Columnar Grain ◽  
Sputter Deposited ◽  
Bond Pads

AbstractThe Cr‐CrCu‐Cu metal scheme, as a terminal multistructure metallization for flip chip applications, has been investigated utilizing PVD sputter deposition varying the conditions of deposition power and temperature, and film thickness. A modified Controlled Collapse Chip Connection (C4) process was utilized in order to evaluate the aforementioned deposition of the Cr‐CrCu‐Cu multilayers and the effect of film microstructure on the parameters of shear strength and thermal cycle reliability. Thermal cycle reliability results proved to be a function of both the CrCu alloy and the Cu overlayer thickness. Transmission electron microscopy (TEM) cross‐sections of the Cr‐CrCu‐Cu multilayers suggests that the columnar grain structure of the CrCu layer may provide a sacrificial thermal diffusion barrier between the PbSn alloy solder balls and the Al bond pads during the thermal‐cycle tests.

Long-term Electromigration Study of Lead-Free Flip-Chips with Solder Bumps with 50 μm or 60 μm Diameter Employing ENIG Surface Finish on Both Chip and Substrate Side

2013 ◽  
Vol 2013 (1) ◽  
pp. 000523-000530 ◽  
Author(s):  
Marek Gorywoda ◽  
Rainer Dohle ◽  
Stefan Härter ◽  
Andreas Wirth ◽  
Jörg Goßler ◽  
...  
Keyword(s):  
Current Density ◽  
Surface Finish ◽  
Flip Chip ◽  
Solder Joints ◽  
High Current Density ◽  
Life Time ◽  
Lead Free ◽  
Cathode Side ◽  
Solder Bumps

Electromigration behaviour of Pb-free solder joints in flip-chip interconnects is usually studied in highly accelerated, short-term experiments using high current density and temperature. Failures typically occur in bumps which are in cathode contact at the chip side. There are only a few published studies in which Electroless Ni-P/Immersion Au (ENIG) surface finish was used as under-bump-metallization (UBM) structure, e.g. [5]. This paper deals with the long-term electromigration behaviour of Pb-free SAC305 flip-chip solder joints with a pitch of 100 μm and solder bump diameters of 50 μm or 60 μm, respectively. The ENIG surface finish was used on both the substrate and chip side. Test specimens were subjected to several levels of temperature and current density and tested up to 16,000 hours. The life time data is summarized using Weibull and lognormal distribution. The microstructure changes of interconnects in failed samples were subsequently investigated by SEM and EDX. Interconnects had failed due to consumption of Nickel, voids caused by electromigration, and Kirkendall void formation in the Ni-P-layer. The damage was asymmetric in respect to the current flow direction through the solder bumps and was most pronounced at the cathode side. Unexpectedly, however, the most severe damage occurred at the substrate and not at the chip side. We could show that - allowing for a few guidelines - lead-free flip-chip solder joints with 50 μm or 60 μm diameter have a sufficient electromigration life time for most applications.

Evaluation of electromigration in flip-chip solder joints

2011 ◽  
Vol 2011 (1) ◽  
pp. 000979-000984 ◽  
Author(s):  
Hyun-Kyu Lee ◽  
Yong-Chul Chu ◽  
Myung-Ho Chun ◽  
Sang-Ho Jeon ◽  
Jung-Ug Kwak ◽  
...  
Keyword(s):  
Electric Current ◽  
Flip Chip ◽  
Solder Joints ◽  
Cathode Side ◽  
Time To Failure ◽  
Chip Technology ◽  
Solder Bumps ◽  
Solder Balls ◽  
Initial Resistance ◽  
Reliability Issue

The flip-chip solder joint has become one of the most important technologies of high-density packaging in the microelectronics industry. But, electromigration has become a critical reliability issue in flip-chip technology. Because the dimensions of solder joints are expected to decrease and current density is expected to increase. This study is about electromigration of flip-chip solder joints, we evaluated many kinds of solder balls such as SnAgCu, SnCu and so on in flip chip package. The lifetime against electromigration was defined the fail from the value of resistance with electric current reaches 1.5 times of that of initial resistance with electric current for. In solder bumps with electric current, since the atoms composed of the solder bump and UBM move in the direction of electron flows, the IMC was accumulated on the anode side. Meanwhile, the IMC disappeared in the cathode side, and the voids were formed. In the solder bumps without electric current, the IMC gradually grew on both sides. SnAgCu had better lifetime than SnCu, and different time-to-failure caused by different crystallographic orientation of Sn. And various dopants in SnCu had a different EM lifetime each other.

scholarly journals Microstructure and Properties of Ni and Ni/Al2O3 Coatings Electrodeposited at Various Current Densities

2016 ◽  
Vol 61 (1) ◽  
pp. 55-60 ◽  
Author(s):  
A. Góral ◽  
K. Berent ◽  
M. Nowak ◽  
B. Kania
Keyword(s):  
Residual Stresses ◽  
Cross Sections ◽  
Current Density ◽  
Steel Substrate ◽  
Composite Coatings ◽  
Nickel Coatings ◽  
Nano Crystalline ◽  
Current Densities ◽  
Growth Character ◽  
Steel Substrates

The study presents investigations of an influence of various direct current densities on microstructure, residual stresses, texture, microhardness and corrosion resistance of the nickel coatings electrodeposited from modified Watt’s baths. The properties of obtained coatings were compared to the nano-crystalline composite Ni/Al2O3 coatings prepared under the same plating conditions. The similarities and differences of the obtained coatings microstructures visible on both their surfaces and cross sections and determined properties were presented. The differences in the growth character of the Ni matrix and in the microstructural properties were observed. All electrodeposited Ni and Ni/Al2O3 coatings were compact and well adhering to the steel substrates. The thickness and the microhardness of the Ni and Ni/Al2O3 deposits increased significantly with the current density in the range 2 - 6 A/dm2. Residual stresses are tensile and they reduced as the current density increased. The composite coatings revealed better protection from the corrosion of steel substrate than pure nickel in solution 1 M NaCl.

Facet Topography and Dislocation Structure as a Possible Source for Electrical Heterogeneity in [001] TILT Bicrystals of YBa2Cu3O7-δ

1996 ◽  
Vol 54 ◽  
pp. 338-339
Author(s):  
I-Fei Tsu ◽  
D.L. Kaiser ◽  
S.E. Babcock
Keyword(s):  
Grain Boundary ◽  
Critical Current Density ◽  
Critical Current ◽  
Current Density ◽  
Electromagnetic Properties ◽  
Length Scale ◽  
Density Values ◽  
Current Densities ◽  
Applied Fields ◽  
A Current

A current theme in the study of the critical current density behavior of YBa2Cu3O7-δ (YBCO) grain boundaries is that their electromagnetic properties are heterogeneous on various length scales ranging from 10s of microns to ˜ 1 Å. Recently, combined electromagnetic and TEM studies on four flux-grown bicrystals have demonstrated a direct correlation between the length scale of the boundaries’ saw-tooth facet configurations and the apparent length scale of the electrical heterogeneity. In that work, enhanced critical current densities are observed at applied fields where the facet period is commensurate with the spacing of the Abrikosov flux vortices which must be pinned if higher critical current density values are recorded. To understand the microstructural origin of the flux pinning, the grain boundary topography and grain boundary dislocation (GBD) network structure of [001] tilt YBCO bicrystals were studied by TEM and HRTEM.

Electron-beam damage of oxides at high current densities

1989 ◽  
Vol 47 ◽  
pp. 634-635
Author(s):  
M. R. McCartney ◽  
J. K. Weiss ◽  
David J. Smith
Keyword(s):  
Electron Beam ◽  
Electron Microscope ◽  
Current Density ◽  
Transition Metal Oxides ◽  
Time Resolved ◽  
Rapid Acquisition ◽  
Resolution Electron ◽  
Current Densities ◽  
Electron Stimulated Desorption ◽  
Channel Analyzer

It is well-known that electron-beam irradiation within the electron microscope can induce a variety of surface reactions. In the particular case of maximally-valent transition-metal oxides (TMO), which are susceptible to electron-stimulated desorption (ESD) of oxygen, it is apparent that the final reduced product depends, amongst other things, upon the ionicity of the original oxide, the energy and current density of the incident electrons, and the residual microscope vacuum. For example, when TMO are irradiated in a high-resolution electron microscope (HREM) at current densities of 5-50 A/cm2, epitaxial layers of the monoxide phase are found. In contrast, when these oxides are exposed to the extreme current density probe of an EM equipped with a field emission gun (FEG), the irradiated area has been reported to develop either holes or regions almost completely depleted of oxygen. ’ In this paper, we describe the responses of three TMO (WO3, V2O5 and TiO2) when irradiated by the focussed probe of a Philips 400ST FEG TEM, also equipped with a Gatan 666 Parallel Electron Energy Loss Spectrometer (P-EELS). The multi-channel analyzer of the spectrometer was modified to take advantage of the extremely rapid acquisition capabilities of the P-EELS to obtain time-resolved spectra of the oxides during the irradiation period. After irradiation, the specimens were immediately removed to a JEM-4000EX HREM for imaging of the damaged regions.

scholarly journals Effect of Plating Current Density on the Ball-On-Disc Wear of Sn-Plated Ni Coatings on Cu Foils

Coatings ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 56
Author(s):  
Ashutosh Sharma ◽  
Byungmin Ahn
Keyword(s):  
Current Density ◽  
Wear Loss ◽  
Wear Properties ◽  
Friction Behavior ◽  
Track Geometry ◽  
Cu Substrates ◽  
Current Densities ◽  
The Impact ◽  
Sliding Distance ◽  
Ball On Disc

Metallic and alloyed coatings are used widely in several decorative and technology-based applications. In this work, we selected Sn coatings plated on Cu substrates for joining applications. We employed two different plating baths for the fabrication of Sn and Ni coatings: acidic stannous sulfate for Sn and Watts bath for Ni layer. The plating current densities were varied from 100–500 mA/cm2. Further, the wear and friction behavior of the coatings were studied using a ball-on-disc apparatus under dry sliding conditions. The impact of current density was studied on the morphology, wear, and coefficient of friction (COF) of the resultant coatings. The wear experiments were done at various loads from 2–10 N. The sliding distance was fixed to 7 m. The wear loss was quantified in terms of the volume of the track geometry (width and depth of the tracks). The results indicate that current density has an important role in tailoring the composition and morphology of coatings, which affects the wear properties. At higher loads (8–10 N), Sn coatings on Ni/Cu had higher volume loss with a stable COF due to a mixed adhesive and oxidative type of wear mechanism.

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