Process Development and Die Shear Testing in MOEMS Packaging

2007 ◽  
Author(s):  
Nikhil Lakhkar ◽  
Abiodun Fasoro ◽  
Amit Patil ◽  
Woo Ho Lee ◽  
Dan Popa ◽  
...  
Keyword(s):  
Fiber Optics ◽  
Process Development ◽  
Critical Path ◽  
Life Time ◽  
Mems Devices ◽  
Optical Mems ◽  
Mems Packaging ◽  
Die Attach ◽  
Data Rates ◽  
Operational Life

Micro-Opto-electro-Mechanical Systems (MOEMS), which are MEMS integrated with photonics, share the traditional challenges of MEMS packaging with the additional issues of optical interconnects and optical surface contamination. Optoelectronic systems require signals through a package using fiber-optics, coaxial or other interconnection approaches. Precise optical component alignment and accurate thermal management is critical to achieve component and system performance capabilities. As the requirements for higher signal speeds and higher data rates grow, and as operating frequencies move to the higher GHz regions and beyond, the choice of packaging technology becomes critical. Optical MEMS packages not only have to provide electrical connections but also support high precision optics and mechanics, vital for operation of optical MEMS devices. Analogous to MEMS, packaging is also a critical path in reliability and cost of MOEMS devices. One of the commonly observed failures is the de-lamination between the chip (die) and the die attach. The focus of this paper is the development of a reliable fluxless die attachment process suitable for MOEMS assemblies with long operational life time. The reliability assessment was carried out at the Texas Microfactory™ at UT Arlington according to the MIL-STD-883F for die shear reliability.

Developments in Microelectromechanical Systems (MEMS): A Manufacturing Perspective

2003 ◽  
Vol 125 (4) ◽  
pp. 816-823 ◽  
Author(s):  
Srinivas A. Tadigadapa ◽  
Nader Najafi
Keyword(s):  
Microelectromechanical Systems ◽  
Process Development ◽  
Reliability Testing ◽  
Mems Devices ◽  
Manufacturing Strategy ◽  
Cad Tools ◽  
Fragile State ◽  
Mems Packaging ◽  
Overall Performance

This paper presents a discussion of some of the major issues that need to be considered for the successful commercialization of MEMS products. The diversity of MEMS devices and historical reasons have led to scattered developments in the MEMS manufacturing infrastructure. A good manufacturing strategy must include the complete device plan including package as part of the design and process development of the device. In spite of rapid advances in the field of MEMS there are daunting challenges that lie in the areas of MEMS packaging, and reliability testing. CAD tools for MEMS are starting to get more mature but are still limited in their overall performance. MEMS manufacturing is currently at a fragile state of evolution. In spite of all the wonderful possibilities, very few MEMS devices have been commercialized. In our opinion, the magnitude of the difficulty of fabricating MEMS devices at the manufacturing level is highly underestimated by both the current and emerging MEMS communities. A synopsis of MEMS manufacturing issues is presented here.

Statistical modeling of drill pipes operational life-time under a regular loading

2020 ◽  
pp. 30-33
Author(s):  
V.I. Kucheryavy ◽  
◽  
A.M. Sharygin ◽  
V.L. Savich ◽  
S.N. Milkov ◽  
...  
Keyword(s):  
Statistical Modeling ◽  
Life Time ◽  
Operational Life ◽  
Drill Pipes

The IP Landscape for MEMS Packaging

2009 ◽  
Author(s):  
Charles E. Bauer ◽  
Raymond A. Fillion ◽  
Herbert J. Neuhaus ◽  
Marc Papageorge
Keyword(s):  
Citation Analysis ◽  
Strategic Alliance ◽  
Market Development ◽  
Mems Devices ◽  
Strategic Framework ◽  
Mems Packaging ◽  
Thermal Requirements ◽  
Unique Mapping ◽  
Wide Range ◽  
On Line

Early MEMS devices employed packages developed for conventional semiconductor microelectronics. Today, MEMS packages reflect the unique environment, mechanical, chemical and thermal requirements of MEMS devices themselves. A casual search of on-line databases reveals nearly 40,000 patents worldwide containing the words “MEMS” and “package.” While not all relevant, the number of IP documents easily overwhelms researchers, investors and IP practitioners. The authors systematically analyze the relevant IP and organize it by generic technology categories. A unique mapping methodology provides greater understanding of the landscape of IP in the MEMS packaging arena across a wide range of considerations including geography, IP development and ownership trends, infrastructure implications and application concepts. The authors also present a rudimentary valuation of IP within the MEMS packaging field based on citation analysis. Finally, the authors demonstrate a method to develop a strategic framework based on the IP landscape useful for investment, market development and strategic alliance planning.

Journey to Success for New Analog Technologies for Texas Instruments

2017 ◽  
Vol 2017 (1) ◽  
pp. 000491-000496
Author(s):  
Mario Magaña ◽  
Basab Chatterjee ◽  
Rey Javier
Keyword(s):  
Lower Cost ◽  
Process Development ◽  
Material Selection ◽  
Copper Wire ◽  
Frame Design ◽  
Environmental Controls ◽  
Die Attach ◽  
Higher Power ◽  
Cte Mismatch ◽  
Low K

Abstract TI's commitment to meeting customer requirements has resulted in the development of package technologies and process to improve performance and higher power at lower cost for wire-bonded packages and automotive products are requiring more stringent reliability requirements. Some of the strategies we have adopted include using thinner metal and low-K ILD for lower parasitics and higher performance, thick copper routings for higher power and larger wafer diameters and smaller scribe streets for lower cost and using Copper (Cu) wire. Cu wire is a key enabler due to higher electrical conductivity and lower cost than gold), but also poses integration challenges due to hardness, CTE mismatch and corrosion susceptibility. The hardness of the copper wire imposes significant challenges for wire-bonding on pads w thin metal and low-k ILD. This required co-design of die bond pad structure for enhanced reliability as well as Cu wire process development requires comprehensive approach encompassing multiple areas including ball and stitch parameters, capillary design, bonding processes like segmented bonding and validation of process margins using ‘hammer’ test. Copper wire also requires metrology and test/detection tools like Nomarski, stitch pull test in addition to the traditional wire pull at mid span and neck, rapid-bake test, measuring intermetallics & Al remaining under ball, and Al-splash. The susceptibility of Cu wire to corrosion required us to introduce new materials like PCC and Au-flash PCC, tight environmental controls in the form of forming gas, monitoring of Ph and ion-trappers in BOM, wire oxidation check at outgoing/incoming inspection as SERA (Sequential Electrochemical Reduction Analysis), and paying close attention to handling and non-process gases. More stringent qualification requirements like AEC-006 is driving additional changes to lead frame design and finish, selection of EMC and Die attach, to reduce delamination and epoxy bleed-out. The demands for lower cost is driving us to use larger sized wafers (like 300mm) and narrower scribe width, while packing more functionality into smaller dies thereby driving higher metal densities. Additional requirements for thinner and 3D packages requiring post backgrind thickness as low as 50–75um imposing challenges in terms of warpage and saw. The demand for higher power applications is requiring us to use thick copper routings. We have developed test structures and redesigned layout of the scribe street and scribe seal and pursuing new saw methods. We have also learned many lessons in terms of handling and corrosion risks and implemented safeguards in terms of process and material selection.

scholarly journals Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress

Sensors ◽  
2019 ◽  
Vol 19 (18) ◽  
pp. 3979
Author(s):  
Jun Eon An ◽  
Usung Park ◽  
Dong Geon Jung ◽  
Chihyun Park ◽  
Seong Ho Kong
Keyword(s):  
Thermal Stress ◽  
Silicon Wafers ◽  
Experimental Results ◽  
Mems Devices ◽  
Microelectromechanical System ◽  
Die Attach ◽  
Lack Of Control ◽  
Die Bonding ◽  
Glass Process ◽  
Typical Process

Die attach is a typical process that induces thermal stress in the fabrication of microelectromechanical system (MEMS) devices. One solution to this problem is attaching a portion of the die to the package. In such partial die bonding, the lack of control over the spreading of the adhesive can cause non-uniform attachment. In this case, asymmetric packaging stress could be generated and transferred to the die. The performance of MEMS devices, which employ the differential outputs of the sensing elements, is directly affected by the asymmetric packaging stress. In this paper, we proposed a die-attach structure with a pillar to reduce the asymmetric packaging stress and the changes in packaging stress due to changes in the device temperature. To verify the proposed structure, we fabricated four types of differential resonant accelerometers (DRA) with the silicon-on-glass process. We confirmed experimentally that the pillar can control the spreading of the adhesive and that the asymmetric packaging stress is considerably reduced. The simulation and experimental results indicated that the DRAs manufactured using glass-on-silicon wafers as handle substrates instead of conventional glass wafers have a structure that compensates for the thermal stress.

Local infiltration devices at parking sites – Experimental assessment of temporal changes in hydraulic and contaminant removal capacity

2007 ◽  
Vol 55 (4) ◽  
pp. 193-200 ◽  
Author(s):  
S. Achleitner ◽  
C. Engelhard ◽  
U. Stegner ◽  
W. Rauch
Keyword(s):  
Mass Balance ◽  
Drainage System ◽  
Life Time ◽  
Point Of View ◽  
Traffic Load ◽  
Worst Case ◽  
Parking Lots ◽  
Removal Capacity ◽  
Operational Life ◽  
Chemical Conditions

On site infiltration of stormwater is a common practice in order to avoid hydraulic overload of the urban drainage system. If hydrological conditions allow on-site infiltration – this is even mandatory from a legal point of view. Focus in this work is on surface infiltration of stormwater from parking lots. Proper operation of those devices is assumed to be appr. 15 years, as permits granted are limited to this time. Questions are raised whether this considered life expectancy is feasible. One apprehension is a possible clogging effect reducing the hydraulic capacity of the swale. The second aim was to identify magnitudes of accumulated pollutant loads with respect to limitations onto lifetime. The experimental investigation covered infiltration swales of different ages from eleven supermarket parking lots in Tyrol. Hydraulic permeabilities were assessed as well as chemical conditions of the soil material regarding hydrocarbon index (HI) and heavy metals (Cu, Zn, Pb and Cd). Further mass balance of contaminants has been performed in order to assess the operational life time based on pollutant load consideration. Calculations were based on load estimations using literature based minima and maxima concentrations from surface flows. Testing the correlation of hydraulic and pollutant measurements against site specific parameters (age, traffic load) revealed no distinct relation. In general all measured pollutants were found under limit concentrations. Mass balance calculations showed that limit concentrations are not exceeded either for worst case loading and considering 15 years of operation.

Effects of Packaging Induced Stress on MEMS Devices and Its Improvements

2006 ◽  
Vol 326-328 ◽  
pp. 529-532
Author(s):  
Sung Hoon Choa ◽  
Moon Chul Lee ◽  
Yong Chul Cho
Keyword(s):  
Silicon On Insulator ◽  
Anodic Bonding ◽  
Mems Devices ◽  
Wafer Level ◽  
Process Technology ◽  
Molding Compound ◽  
Mems Packaging ◽  
Induced Stress ◽  
Induced Structure ◽  
Glass Process

In MEMS, packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. The conventional MEMS SOI (silicon-on-insulator) gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. Therefore we propose a packaged SiOG (Silicon On Glass) process technology and more robust spring design.

Tailoring of Stress Development in MEMS Packaging Systems

2002 ◽  
Vol 741 ◽  
Author(s):  
Satyajit S. Walwadkar ◽  
Junghyun Cho ◽  
P.W. Farrell ◽  
Lawrence E. Felton
Keyword(s):  
Microelectromechanical Systems ◽  
Inertial Sensors ◽  
Thermal Exposure ◽  
Origin And Evolution ◽  
Mems Packaging ◽  
Operation Conditions ◽  
Die Attach ◽  
Device Operation ◽  
Different Levels ◽  
Good Agreement

ABSTRACTA better understanding of the origin and evolution of the stresses is a crucial step in improving reliability of packaging systems for microelectromechanical systems (MEMS). Given its importance, we examine the stresses developed in hermetically packaged MEMS inertial sensors. For this purpose, an optical surface profilometer is employed to assess the stresses by measuring the curvature of dummy silicon dies (3.5×3.5 mm2) assembled in different types of packages and die attach adhesives. We also explore a temporal evolution of stresses during thermal exposure of the test packages in an effort to emulate actual packaging processes and device operation conditions. The result shows different levels of stresses generated from various adhesives and package types, and also a stress evolution during packaging processes. The mechanical stress data also show a good agreement with MEMS performance data obtained from actual accelerometers. Therefore, the stress data will not only be useful in better understanding performance of MEMS packages, but the testing protocol can also provide a diagnostic tool for very small packaging systems.

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