Thermal Performance Evaluation and Enhancement for an Automotive Wireless Application Incorporating Multiple Dynamic Heat Sources

2007 ◽  
Author(s):  
Victor Chiriac ◽  
Tien-Yu Tom Lee
Keyword(s):  
Thermal Performance ◽  
Signal Strength ◽  
Optimal Operation ◽  
Operating Conditions ◽  
Temperature Fields ◽  
Heat Sources ◽  
Thermal Budget ◽  
Dynamic Source ◽  
Power Sequence ◽  
Transient Thermal

A detailed transient thermal study for a Remote Keyless Entry System with dynamic heat sources is performed using numerical simulations. The SmartMOS-type device is packaged in a 54 lead SOIC (small outline IC) package with an exposed copper slug. The package is attached to a 4-layer PCB with thermal vias embedded in the board. The challenge resides in the transient thermal interaction between several dynamic heat sources (channels), activated in a sequential fashion following different powering profiles and patterns. The main purpose of the device is to wirelessly provide a communication path between the remote and the receiver placed in the car, so the distance and the signal strength between the two are paramount for an optimal operation. The signal strength is directly associated with the voltage (and associated powering) levels. Several operating scenarios are evaluated by modifying the system design (thermal via pattern) and varying both power dissipation and duration levels. The study starts with just one channel dissipating power, followed by activating the entire dynamic system comprised of six channels dissipating each powers reaching up to 22W at different time intervals. The transient thermal behavior of each source is analyzed during the process. Results indicate that the system dissipating over 14V exceeds the thermal budget (150C) after only 3 powering cycles. Based on the analysis of the complex temperature fields for the multiple dynamic source system, the authors identify alternative power profiles to improve the thermal performance of the overall wireless system, by splitting the power in selective channels and by modifying the power sequence. Several additional cases are further investigated, and the optimized power profiles indicate that they satisfy the thermal budget under various operating conditions and several multiple cycles, while still maintaining the device voltage at 14V levels. A thorough study of the transient patterns and needed system improvements are included.

Advanced Cooling With Embedded Heat Pipes for High Power Microelectronics

2009 ◽  
Author(s):  
Victor Adrian Chiriac
Keyword(s):  
Heat Pipe ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Pipes ◽  
Optimal Operation ◽  
Operating Conditions ◽  
Peak Temperature ◽  
Transient Temperature ◽  
Efficient Operation ◽  
The Impact

The transient thermal behavior of a complex testing system including multiple fans, a mixing enclosure, Cu inserts and a leaded package dissipating large amounts of power over short time durations is evaluated via numerical simulations. The system performance is optimized with heat sink/fan structure for device efficient operation under constant powering. The study provides meaningful understanding and prediction of a transient powering scenario at high powering levels, evaluating the impact of alternative cooling fan/heat pipe configurations on the thermal performance of the system. One design is chosen due to its effective thermal performance and assembly simplicity, with the package embedded in heat sink base with multiple (5) heat pipes. The peak temperature reached by the modified design with 4 cooling fans is ∼95°C, with the corresponding Rja thermal resistance ∼0.58°C/W. For the transient study (with embedded heat pipes and 4 fans), after one cycle, both peak temperature (at 45 s) and the end temperature (at 49 s) decrease as compared to the previous no heat pipe/single fan case (especially the end temperature reduces by ∼16%). The temperature drop between peak and end for each cycle is ∼80.2°C, while the average power per transient cycle is ∼31.27W. With this power, the design with 5 perpendicular heat pipes, 4 fans and insert reaches a steady state peak temperature of ∼98°C. Applying the superposition principle, the maximum transient temperature after a large number of operating cycles will not exceed ∼138.1°C, satisfying the thermal budget under the current operating conditions. The benefit of the study is related to the possibility to extract the maximum/minimum temperatures for a real test involving a large number of heating-cooling cycles, yet maintaining the initial and peak temperatures within a certain range for the optimal operation of the device. The flow and heat transfer fields are thoroughly investigated: using a combination of numerical and analytical study, the thermal performance of the device undergoing large number of periodic thermal cycles is predicted. Further comparison between measurement and simulation results reveals good agreement.

System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics

2003 ◽  
Author(s):  
Victor Adrian Chiriac ◽  
Tien-Yu Tom Lee ◽  
H. S. Chen
Keyword(s):  
Thermal Performance ◽  
Performance Optimization ◽  
Numerical Study ◽  
Optimal Operation ◽  
System Level ◽  
Main Concern ◽  
Efficient Operation ◽  
Normal Test ◽  
Transient Thermal ◽  
Short Time

The increasing trend in power levels and densities leads to the need of design thermal optimization, at either module or system level. A numerical study using finite-volume software was conducted to model the transient thermal behavior of a system including a package dissipating large amounts of power over short time durations. The system is evaluated by choosing the appropriate heat sink for the efficient operation of the device under 100W of constant powering, also to enhance the thermal performance of the enclosure/box containing the test stack-up. The intent of the study is to provide a meaningful understanding and prediction of the high transient powering scenarios. The study focuses on several powering and system design scenarios, identifying the main issues encountered during a normal device operation. The power source dissipates 100W for 2 seconds then is cooled for another 2 seconds. This thermal cycle is likely to occur several times during a normal test-up, and it is the main concern of the manufacturers not to exceed a limit temperature during the device testing operation. The transient trend is further extrapolated analytically to extract the steady state peak temperature values, in order to maintain the device peak temperatures below 120°C. The benefit of the study is related to the possibility to extract the maximum/minimum temperatures for a real test involving a large number of heating-cooling cycles, yet maintaining the initial and peak temperatures within a certain range, for the optimal operation of the device. The flow and heat transfer fields are thoroughly investigated. By using a combination of numerical and analytical study, the thermal performance of the device undergoing infinity of periodic thermal cycles is further predicted.

Thermal Assessment of Cooling System Incorporating Heat Sink and Embedded Heat Pipes for Testing High Power Microelectronics

2005 ◽  
Author(s):  
Victor Adrian Chiriac ◽  
Tien-Yu Tom Lee
Keyword(s):  
Steady State ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Pipes ◽  
Optimal Operation ◽  
Operating Conditions ◽  
Peak Temperature ◽  
Testing System ◽  
The Impact

A numerical study was conducted to model the transient thermal behavior of a complex testing system including multiple fans, a mixing enclosure, copper inserts and a leaded package dissipating large amounts of power over short time durations. The system is optimized by choosing appropriate heat sink/fan structure for the efficient operation of the device under constant powering. The intent of the study is to provide a better understanding and prediction of a transient powering scenario at high powering levels, while evaluating the impact of alternative cooling fan/heat pipe designs on the thermal performance of the testing system. One design is chosen due to its effective thermal performance and assembly simplicity, with the package embedded in heat sink base with multiple (5) heat pipes. The peak temperature reached by the modified design with 4 cooling fans is ~95°C, with the corresponding Rja thermal resistance ~0.58°C/W. For the transient study (with embedded heat pipes and 4 fans), after one cycle, both peak temperature (at 45 s) and the end temperature (at 49 s) decrease as compared to the previous no heat pipe/single fan case (the end temperature reduces by ~16%). The temperature drop between peak and end for each cycle is ~80.2°C, while the average power per transient cycle is ~31.27W. With this power, the design with 5 perpendicular heat pipes, 4 fans and insert reaches a steady state peak temperature of ~98°C. Applying the superposition principle to the steady state value and 40.1°C fluctuation, the maximum transient temperature after a large number of cycles will not exceed ~138.1°C, satisfying the thermal budget under the current operating conditions. The benefit of the study is related to the possibility to extract the maximum and minimum temperatures for a real test involving a large number of heating-cooling cycles, yet maintaining the initial and peak temperatures within a certain range for the optimal operation of the device. The flow and heat transfer fields are investigated; using a combination of numerical and analytical methods, the thermal performance of the device undergoing large number of periodic thermal cycles is predicted. The comparison between measurement and simulation shows good agreement.

Development of Convective Heat Transfer Near Suddenly Heated, Vertically Aligned Horizontal Wires

1987 ◽  
Vol 109 (4) ◽  
pp. 912-918 ◽  
Author(s):  
J. R. Parsons ◽  
M. L. Arey
Keyword(s):  
Heat Transfer ◽  
Heat Source ◽  
Fluid Layer ◽  
Convective Motion ◽  
Transient Behavior ◽  
Temperature Fields ◽  
Heat Sources ◽  
Transfer Coefficients ◽  
Vertically Aligned ◽  
The Wire

Experiments have been performed which describe the transient development of natural convective flow from both a single and two vertically aligned horizontal cylindrical heat sources. The temperature of the wire heat sources was monitored with a resistance bridge arrangement while the development of the flow field was observed optically with a Mach–Zehnder interferometer. Results for the single wire show that after an initial regime where the wire temperature follows pure conductive response to a motionless fluid, two types of fluid motion will begin. The first is characterized as a local buoyancy, wherein the heated fluid adjacent to the wire begins to rise. The second is the onset of global convective motion, this being governed by the thermal stability of the fluid layer immediately above the cylinder. The interaction of these two motions is dependent on the heating rate and relative heat capacities of the cylinder and fluid, and governs whether the temperature response will exceed the steady value during the transient (overshoot). The two heat source experiments show that the merging of the two developing temperature fields is hydrodynamically stabilizing and thermally insulating. For small spacing-to-diameter ratios, the development of convective motion is delayed and the heat transfer coefficients degraded by the proximity of another heat source. For larger spacings, the transient behavior approaches that of a single isolated cylinder.

INCREASING THE RESOURCE OF DIESEL CYLINDER HEADS BY IMPROVING THE TECHNOLOGY OF THEIR RESTORATION

2020 ◽  
Vol 15 (7) ◽  
pp. 950-957
Author(s):  
G.D. Mezhetskiy ◽  
◽  
V.A. Strelnikov ◽  
Keyword(s):  
Diesel Engines ◽  
Thermal Loading ◽  
Theoretical Calculations ◽  
Operating Conditions ◽  
Advanced Technology ◽  
Temperature Fields ◽  
Cylinder Block ◽  
Diesel Cylinder ◽  
Thermal Intensity

The article presents the results of studies of the thermal fatigue strength of diesel cylinder heads and their resource under operating conditions, by using the most advanced technology for their restoration. Based on the results of theoretical calculations of durability and operational studies, a restoration technology has been proposed, which makes it possible to increase the resource of cylinder heads by 2 ÷ 2.5 times. For this purpose, the non-uniformity of the temperature field on the firing bottom of the cylinder heads of YaMZ-238NB diesel engines was theoretically determined and experimentally confirmed. On the basis of theoretical calculations, the most heatstressed sections of the plane of the cylinder heads of diesel engines bonded to the cylinder block were determined, and the appearance of cracks in them. When developing a method for calculating the temperature fields of the fire bottom, the universal finite element method (FEM) was used. This method makes it possible to take into account the geometry and conditions of thermal loading of the cylinder heads quite accurately. For the determination of temperature fields, a well-founded assignment of the boundary conditions is crucial. With this in mind, a number of surfaces were determined that characterize the durability of the entire part during operation. As a result of calculations carried out on a computer, temperature fields have been obtained that make it possible to analyze the distribution of temperatures and temperature gradients at any point of the fire bottom. The highest temperatures (620...635K) are localized in the central part of the fire bottom, which is two times higher in thermal intensity than the peripheral one and confirms the appearance of cracks in these places during the operation of diesel cylinder heads.

The Influence of Lubricant Supply Conditions and Bearing Configuration on the Performance of (Semi) Floating Ring Bearing Systems for Turbochargers

2017 ◽  
Author(s):  
Luis San Andrés ◽  
Feng Yu ◽  
Kostandin Gjika
Keyword(s):  
Heat Flow ◽  
Thermal Energy ◽  
Operating Conditions ◽  
Temperature Fields ◽  
Engine Oil ◽  
Large Temperature ◽  
Oil Viscosity ◽  
Supply Pressure ◽  
The Impact ◽  
Bearing System

Engine oil lubricated (semi) floating ring bearing (S)FRB systems in passenger vehicle turbochargers (TC) operate at temperatures well above ambient and must withstand large temperature gradients that can lead to severe thermo-mechanical induced stresses. Physical modeling of the thermal energy flow paths and an effective thermal management strategy are paramount to determine safe operating conditions ensuring the TC component mechanical integrity and the robustness of its bearing system. On occasion, the selection of one particular bearing parameter to improve a certain performance characteristic could be detrimental to other performance characteristics of a TC system. The paper details a thermohydrodynamic model to predict the hydrodynamic pressure and temperature fields and the distribution of thermal energy flows in the bearing system. The impact of the lubricant supply conditions (pressure and temperature), bearing film clearances, oil supply grooves on the ring ID surface are quantified. Lubricating a (S)FRB with either a low oil temperature or a high supply pressure increases (shear induced) heat flow. A lube high supply pressure or a large clearance allow for more flow through the inner film working towards drawing more heat flow from the hot journal, yet raises the shear drag power as the oil viscosity remains high. Nonetheless, the peak temperature of the inner film is not influenced much by the changes on the way the oil is supplied into the film as the thermal energy displaced from the hot shaft into the film is overwhelming. Adding axial grooves on the inner side of the (S)FRB improves its dynamic stability, albeit increasing the drawn oil flow as well as the drag power and heat flow from the shaft. The predictive model allows to identify a compromise between different parameters of groove designs thus enabling a bearing system with a low power consumption.

Analytical Formulation for the Temperature Profile by Duhamel’s Theorem in Bodies Subjected to an Oscillatory Heat Source

2005 ◽  
Vol 129 (2) ◽  
pp. 236-240 ◽  
Author(s):  
Jun Wen ◽  
M. M. Khonsari
Keyword(s):  
Finite Element Method ◽  
Heat Flux ◽  
Heat Source ◽  
Temperature Profile ◽  
Rectangular Domain ◽  
Temperature Fields ◽  
Heat Sources ◽  
Point Heat Source ◽  
Analytical Formulation ◽  
Analytical Technique

An analytical technique is presented for treating heat conduction problems involving a body experiencing oscillating heat flux on its boundary. The boundary heat flux is treated as a combination of many point heat sources, each of which emits heat intermittently based on the motion of the flux. The working function of the intermittent heat source with respect to time is evaluated by using the Fourier series and temperature profile of each point heat source is derived by using the Duhamel’s theorem. Finally, by superposition of the temperature fields over all the point heat sources, the temperature profile due to the original moving heat flux is determined. Prediction results and verification using finite element method are presented for an oscillatory heat flux in a rectangular domain.

scholarly journals Heat exchange between non-insulated barn and the ground in experimental research

2013 ◽  
Vol 12 (3) ◽  
pp. 035-038
Author(s):  
Wacław Bieda ◽  
Jan Radoń ◽  
Grzegorz Nawalany
Keyword(s):  
Heat Flux ◽  
Heat Exchange ◽  
Experimental Research ◽  
Operating Conditions ◽  
Temperature Fields ◽  
Final Conclusion

The paper presents the results of two-year studies conducted in real operating conditions of a non-insulated and unheated barn for 120 cows. As a result, it was possible to determine temperature fields in the ground beneath the floor and around the building, as well as to define heat flux directions. It was concluded that there is no analogy between temperature fields and heat flux directions with the heated buildings. In colder periods of the year, the heat accumulated in the ground is emitted to the inside of the building; in the summer, the ground absorbs the excess of heat from the building. The final conclusion was that the foundations should be insulated vertically.

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