Development of Lead-Free Compatible Molded Underfill (MUF) Materials for Flip Chip Stacked Packaging: Key Challenges and Learnings

2005 ◽  
Author(s):  
Vassou LeBonheur ◽  
Choong Kooi Chee
Keyword(s):  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Lead Free ◽  
Filler Concentration ◽  
Moisture Resistance ◽  
Potential Applications ◽  
Reliability Performance ◽  
Relationship Of ◽  
Package Reliability ◽  
Structure Properties

This paper reports the structure-properties-performance relationship of various molded underfill materials for potential applications in flip-chip MMAP (FCMMAP) and mixed technology (FC and WB) stacked CSP (MTsCSP) packages. Chemical, rheological, and thermo-mechanical properties of five high temperature reflow compatible materials were characterized and relationship to materials processability & package reliability performance were investigated. Materials having higher filler concentration and lower coefficient of thermal expansion tended to exhibit improved HTR compatibility due to improved moisture resistance and decreased CTE mis-match.

Development of Advanced Lead-Free Solder Based Interconnect Materials Containing Nanosized Y2O3 Particulates

2005 ◽  
Author(s):  
S. M. L. Nai ◽  
J. Wei ◽  
M. Gupta
Keyword(s):  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Thermomechanical Analysis ◽  
Lead Free ◽  
Microstructural Development ◽  
Thermal And Mechanical Properties ◽  
Average Coefficient ◽  
Density Values ◽  
Free Solder ◽  
Nanocomposite Solder

This study addresses the development of lead-free nanocomposite solders. Lead-free composite solders were successfully synthesized, with varying amount of nanosized Y2O3 particulates incorporated into 95.8 Sn - 3.5 Ag - 0.7 Cu solder. These composite materials were fabricated using the powder metallurgy technique involving blending, compaction, sintering and extrusion. The extruded materials were then characterized in terms of their physical properties, microstructural development, thermal and mechanical properties. Results revealed that with the incorporation of increasing amount of reinforcements, the density values of the composite solders decreased while their corresponding porosity levels increased. Thermomechanical analysis of the solder nanocomposites showed that the use of reinforcements lowered the average coefficient of thermal expansion of the solder materials. Moreover, the results of mechanical property characterizations revealed that the addition of reinforcements aids in improving the overall strength of the nanocomposite solder. Particular emphasis is placed in this study to correlate the effect of increasing presence of Y2O3 particulates with the properties of the resultant nanocomposite materials. These advanced interconnect materials will benefit industries like the microelectronics flip chip assembly and packaging, MEMS systems and NEMS systems.

High Reliability and Thermal Performance FCBGA Package

2007 ◽  
Author(s):  
Gino Hung ◽  
Ho-Yi Tsai ◽  
Chun An Huang ◽  
Steve Chiu ◽  
C. S. Hsiao
Keyword(s):  
Thermal Performance ◽  
High Performance ◽  
Flip Chip ◽  
Dielectric Material ◽  
High Reliability ◽  
Lead Free ◽  
Molding Process ◽  
Molding Compound ◽  
Reliability Performance ◽  
Low K

A high reliability and high thermal performance molding flip chip ball grid arrays structure which was improved from Terminator FCBGA®. (The structure are shown as Fig. 1) It has many advantages, like better coplanarity, high through put (multi pes for each shut of molding process), low stress, and high thermal performance. In conventional flip chip structure, underfill dispenses and cure processes are a bottleneck due to low through put (dispensing unit by unit). For the high performance demand, large package/die size with more integrated functions needs to meet reliability criteria. Low k dielectric material, lead free bump especially and the package coplanarity are also challenges for package development. Besides, thermal performance is also a key concern with high power device. From simulation and reliability data, this new structure can provide strong bump protection and reach high reliability performance and can be applied for low-K chip and all kind of bump composition such as tin-lead, high lead, and lead free. Comparing to original Terminator FCBGA®, this structure has better thermal performance because the thermal adhesive was added between die and heat spreader instead of epoxy molding compound (EMC). The thermal adhesive has much better thermal conductivity than EMC. Furthermore, this paper also describes the process and reliability validation result.

Advanced Simulation/Modeling and Reliability of Fine Pitch (130um) Lead-Free Flip-Chip Package

2008 ◽  
Author(s):  
Bahareh Banijamali ◽  
Ilyas Mohammed
Keyword(s):  
Fatigue Life ◽  
Life Prediction ◽  
Flip Chip ◽  
Solder Bump ◽  
Fatigue Life Prediction ◽  
Lead Free ◽  
Design Parameters ◽  
Chip Technology ◽  
Low K ◽  
Package Reliability

Flip-chip technology has been introduced in recent years which accommodate the ever increasing demands for higher performance and I/O density, while achieving smaller form factor and offering a cost effective solution. As the industry moves toward the 65nm and 45nm technology node, die sizes require a significant reduction while accommodating the need for tighter and finer pitches. For decades, the C4 process has served as the main interconnect method in the flip-chip package. But with bump pitches shrinking, the solder bump based C4 process is facing challenges in terms of reducing pitch and underfill process. At the same time, increasing challenges for flip-chip are seen by the movement toward lead-free solder bumps and low-k dielectric layers. This work conducted simulations and analyses on Tessera developmental μPILR flip chip package incorporating a 130um pitch bump array, using 3-D finite element method (FEM). This study explores the effect of various design parameters on package reliability while providing suggestions for selecting packaging materials. Based on modeling data certain set of over mold, underfill and thermal interface materials enhance overall package reliability performance. Solder fatigue life prediction was performed and solder bump reliability was compared for Tessera flip chip technology and standard flip chip solder joints using Modified Anand solder material properties and Darveaux fatigue life prediction theory. Further more, fracture mechanics approach was applied, and energy release rates were obtained in order to check reliability of low-k dielectric layer, provided passive/low-k material selection. The data presented here provides a baseline for reliability/feasibility of Tessera developmental μPILR flip chip package design for 130um bump pitch. Experimental reliability data is not complete at this time but will be available and published soon.

Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials

2005 ◽  
Vol 127 (2) ◽  
pp. 77-85 ◽  
Author(s):  
Slawomir Rubinsztajn ◽  
Donald Buckley ◽  
John Campbell ◽  
David Esler ◽  
Eric Fiveland ◽  
...  
Keyword(s):  
Cost Reduction ◽  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Organic Substrate ◽  
Operating Speed ◽  
Wafer Level ◽  
Package Design ◽  
Chip Technology ◽  
Package Size ◽  
Package Reliability

Flip chip technology is one of the fastest growing segments of electronic packaging with growth being driven by the demands such as cost reduction, increase of input/output density, package size reduction and higher operating speed requirements. Unfortunately, flip chip package design has a significant drawback related to the mismatch of coefficient of thermal expansion (CTE) between the silicon die and the organic substrate, which leads to premature failures of the package. Package reliability can be improved by the application of an underfill. In this paper, we report the development of novel underfill materials utilizing nano-filler technology, which provides a previously unobtainable balance of low CTE and good solder joint formation.

Dynamic Assessment Language Tasks and the Prediction of Performance on Year-End Language Skills in Preschool Dual Language Learners

2020 ◽  
Vol 29 (3) ◽  
pp. 1226-1240
Author(s):  
Janet L. Patterson ◽  
Barbara L. Rodríguez ◽  
Philip S. Dale
Keyword(s):  
Head Start ◽  
Language Learners ◽  
Language Impairment ◽  
Dual Language ◽  
Dynamic Assessment ◽  
Dual Language Learners ◽  
Achievement Testing ◽  
Potential Applications ◽  
Language Screening ◽  
Relationship Of

Purpose Early identification is a key element for accessing appropriate services for preschool children with language impairment. However, there is a high risk of misidentifying typically developing dual language learners as having language impairment if inappropriate tools designed for monolingual children are used. In this study of children with bilingual exposure, we explored performance on brief dynamic assessment (DA) language tasks using graduated prompting because this approach has potential applications for screening. We asked if children's performance on DA language tasks earlier in the year was related to their performance on a year-end language achievement measure. Method Twenty 4-year-old children from Spanish-speaking homes attending Head Start preschools in the southwestern United States completed three DA graduated prompting language tasks 3–6 months prior to the Head Start preschools' year-end achievement testing. The DA tasks, Novel Adjective Learning, Similarities in Function, and Prediction, were administered in Spanish, but correct responses in English or Spanish were accepted. The year-end achievement measure, the Learning Accomplishment Profile–Third Edition (LAP3), was administered by the children's Head Start teachers, who also credited correct responses in either language. Results Children's performance on two of the three DA language tasks was significantly and positively related to year-end LAP3 language scores, and there was a moderate and significant relationship for one of the DA tasks, even when controlling for age and initial LAP3 scores. Conclusions Although the relationship of performance on DA with year-end performance varies across tasks, the findings indicate potential for using a graduated prompting approach to language screening with young dual language learners. Further research is needed to select the best tasks for administration in a graduated prompting framework and determine accuracy of identification of language impairment.

NEW COMPLEXES OF 2-(1H-1, 2, 4-TRIAZOL-3-YL) PYRIDINE WITH Co(II), Cd(II), Rh(III), IONS: SYNTHESIS, STRUCTURE, PROPERTIES AND POTENTIAL APPLICATIONS

2015 ◽  
Vol 14 (2) ◽  
pp. 389-397
Author(s):  
Corneliu S. Stan ◽  
Petronela Horlescu ◽  
Daniel Sutiman ◽  
Carmen Mita ◽  
Cristian Peptu ◽  
...  
Keyword(s):  
Potential Applications ◽  
Structure Properties

Structure-properties relationship for energy storage redox polymers: a review

2020 ◽  
Vol 40 (5) ◽  
pp. 373-393 ◽  
Author(s):  
Narendra Singh Chundawat ◽  
Nishigandh Pande ◽  
Ghasem Sargazi ◽  
Mazaher Gholipourmalekabadi ◽  
Narendra Pal Singh Chauhan
Keyword(s):  
Energy Storage ◽  
Cost Efficiency ◽  
Energy Storage Materials ◽  
High Scale ◽  
Chemical Structures ◽  
Redox Active ◽  
Potential Applications ◽  
Intelligent Clothing ◽  
The Relationship ◽  
Structure Properties

AbstractRedox-active polymers among the energy storage materials (ESMs) are very attractive due to their exceptional advantages such as high stability and processability as well as their simple manufacturing. Their applications are found to useful in electric vehicle, ultraright computers, intelligent electric gadgets, mobile sensor systems, and portable intelligent clothing. They are found to be more efficient and advantageous in terms of superior processing capacity, quick loading unloading, stronger security, lengthy life cycle, versatility, adjustment to various scales, excellent fabrication process capabilities, light weight, flexible, most significantly cost efficiency, and non-toxicity in order to satisfy the requirement for the usage of these potential applications. The redox-active polymers are produced through organic synthesis, which allows the design and free modification of chemical constructions, which allow for the structure of organic compounds. The redox-active polymers can be finely tuned for the desired ESMs applications with their chemical structures and electrochemical properties. The redox-active polymers synthesis also offers the benefits of high-scale, relatively low reaction, and a low demand for energy. In this review we discussed the relationship between structural properties of different polymers for solar energy and their energy storage applications.

Structure, properties and potential applications of phytoglycogen and waxy starch subjected to carboxymethylation

2020 ◽  
Vol 234 ◽  
pp. 115908 ◽  
Author(s):  
Yao Liu ◽  
Keyu Lu ◽  
Xiuting Hu ◽  
Zhengyu Jin ◽  
Ming Miao
Keyword(s):  
Potential Applications ◽  
Waxy Starch ◽  
Structure Properties
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