Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application

2005 ◽  
Author(s):  
Masataka Mochizuki ◽  
Yuji Saito ◽  
Thang Nguyen ◽  
Vijit Wuttijumnong ◽  
Xiaoping Wu ◽  
...  
Keyword(s):  
Heat Flux ◽  
High Performance ◽  
Heat Dissipation ◽  
Air Cooling ◽  
Confined Space ◽  
Design Data ◽  
Clock Speed ◽  
Processor Performance ◽  
Design Changes ◽  
Year 2000

The trend of the processor performance and heat dissipation have been increased significantly every year. In the year 2000, the clock speed of processors used in Personal Computers (PC) was approximately 1GHz and heat dissipation approximately 20 W, but in the year 2004 the processor’s clock speed is higher than 3 GHz and the heat dissipation is approaching 100 W. Heat dissipation has increased but in contrast the size of die on the processor has reduced or remained the same size and thus the heat flux is critically high. The heat flux is about 10–15 W/cm2 in the year 2000 and could reach 100 W/cm2 in 2005. The purpose of this paper is to provide an overview of practical various cooling solutions including the use of heat pipes and vapor chambers for cooling high power processors in a confined space of PCs. This paper discusses how to extend the air cooling capability and maximize its performance. Included in this paper are the design, data, photos and discussion of various fan sink air cooling designs showing how the design changes can push the limit of the air cooling capability.

Cooling of High-Performance Server Modules Using Direct Immersion

2012 ◽  
Author(s):  
Aravind Sridhar ◽  
Sarah Styslinger ◽  
Christopher Duron ◽  
Sushil H. Bhavnani ◽  
Roy W. Knight ◽  
...  
Keyword(s):  
Heat Flux ◽  
High Speed ◽  
High Performance ◽  
Heat Dissipation ◽  
Heat Removal ◽  
Liquid Pool ◽  
Circuit Board ◽  
Air Cooling ◽  
High Speed Imaging ◽  
Close Proximity

An alternative to air-cooling of high performance computing equipment is presented. Heat removal via pool boiling in FC-72 was tested. Tests were conducted on a multichip module using 1.8 cm × 1.8 cm test die with multiple thermal test cells with temperature sensing capability. Measurements with the bare silicon die in direct contact with the fluid are reported. Additional testing included the test die directly indium-attached to copper heat spreaders having surface treatments. A screen-printed sintered boiling-enhanced surface (4 cm × 4 cm) was evaluated. Tests were conducted on an array of five die. Parameters tested include heat flux levels, dielectric liquid pool conditions (saturated or subcooled), and effect of neighboring die. Information was gathered on surface temperatures for a range of heat flux values up to 12 W/cm2. The highest heat dissipated from a circuit board with five bare die was 195 W (39 W per die). Addition of the heat spreader allowed heat dissipation of up to 740 W (from a five-die array). High-speed imaging was also acquired to help examine detailed information on the boiling process. Numerical modeling indicated that placing multiple boards in close proximity to each other did not degrade performance until board spacing was reduced to 3 mm.

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Yueguang Deng ◽  
Jing Liu
Keyword(s):  
Heat Flux ◽  
Liquid Metal ◽  
Thermal Resistance ◽  
High Performance ◽  
Heat Dissipation ◽  
High Heat ◽  
High Heat Flux ◽  
Water Cooling ◽  
Cooling Device ◽  
Liquid Metal Cooling

Broad societal needs have focused attention on technologies that can effectively dissipate huge amount of heat from high power density electronic devices. Liquid metal cooling, which has been proposed in recent years, is fast emerging as a novel and promising solution to meet the requirements of high heat flux optoelectronic devices. In this paper, a design and implementation of a practical liquid metal cooling device for heat dissipation of high performance CPUs was demonstrated. GaInSn alloy with the melting point around 10°C was adopted as the coolant and a tower structure was implemented so that the lowest coolant amount was used. In order to better understand the design procedure and cooling capability, several crucial design principles and related fundamental theories were demonstrated and discussed. In the experimental study, two typical prototypes have been fabricated to evaluate the cooling performance of this liquid metal cooling device. The compared results with typical water cooling and commercially available heat pipes show that the present device could achieve excellent cooling capability. The thermal resistance could be as low as 0.13°C/W, which is competitive with most of the latest advanced CPU cooling devices in the market. Although the cost (about 70 dollars) is still relatively high, it could be significantly reduced to less than 30 dollars with the optimization of flow channel. Considering its advantages of low thermal resistance, capability to cope with extremely high heat flux, stability, durability, and energy saving characteristic when compared with heat pipe and water cooling, this liquid metal cooling device is quite practical for future application.

CFD Analysis on Liquid Cooled Cold Plate Using Copper Nanoparticles

2020 ◽  
Author(s):  
Pardeep Shahi ◽  
Sarthak Agarwal ◽  
Satyam Saini ◽  
Amirreza Niazmand ◽  
Pratik Bansode ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Copper Nanoparticles ◽  
High Performance ◽  
Data Centers ◽  
Heat Dissipation ◽  
Great Promise ◽  
Thermal Mass ◽  
Air Cooling ◽  
Cold Plate ◽  
Cfd Analysis

Abstract In today’s world, most data centers have multiple racks with numerous servers in each of them. The high amount of heat dissipation has become the largest server-level cooling problem for the data centers. The higher dissipation required, the higher is the total energy required to run the data center. Although still the most widely used cooling methodology, air cooling has reached its cooling capabilities especially for High-Performance Computing data centers. Liquid-cooled servers have several advantages over their air-cooled counterparts, primarily of which are high thermal mass, lower maintenance. Nano-fluids have been used in the past for improving the thermal efficiency of traditional dielectric coolants in the power electronics and automotive industry. Nanofluids have shown great promise in improving the convective heat transfer properties of the coolants due to a proven increase in thermal conductivity and specific heat capacity. The present research investigates the thermal enhancement of the performance of de-ionized water-based dielectric coolant with Copper nanoparticles for a higher heat transfer from the server cold plates. Detailed 3-D modeling of a commercial cold plate is completed and the CFD analysis is done in a commercially available CFD code ANSYS CFX. The obtained results compare the improvement in heat transfer due to improvement in coolant properties with data available in the literature.

Advanced Micro-Channel Vapor Chamber for Cooling High Power Processors

2007 ◽  
Author(s):  
Masataka Mochizuki ◽  
Yuji Saito ◽  
Fumitoshi Kiyooka ◽  
Thang Nguyen ◽  
Tien Nguyen ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
Metal Plate ◽  
Working Fluid ◽  
Micro Channel ◽  
Vapor Chamber ◽  
Processor Performance ◽  
Heat Spreading

After the introduction of Pentium™ processor in 1993, the trend of the processor performance and power consumption have been increased significantly each year. Heat dissipation has been increased but in contrast the size of die on the processor has been reduced or remained the same size due to nano-size circuit technology and thus the heat flux is critically high. The heat flux was about 10–15 W/cm2 in the year 2000 and had reached 100 W/cm2 in 2006. The processor’s die surface where the heat is generated is usually small, approximately 1 cm2. For effective cooling should required least temperature gradient between the heat source and radiating components. The best known devices for effective heat transfer or heat spreading with lowest thermal resistance is heat pipe and vapor chamber. Basically, heat pipe and vapor chamber are an evacuated and sealed container which contains a small quantity of working fluid which is water. When one side of the container is heated, causing the liquid to vaporize and the vapor to move to the cold side and condensed. Since the latent heat of evaporation is large, considerable quantities of heat can be transported with a very small temperature difference from end to end. The 2-phase heat transfer device has excellent heat spreading and heat transfer characteristics, is the key element in thermal management challenge of ever power-increasing processors. In this paper, authors presented case designs using vapor chamber for cooling computer processors. Proposed ideas of using micro-channel vapor chamber for heat spreading to replace the traditional metal plate heat spreader. Also included in the paper are ideas and data that showed performance improvement of heat spreading devices.

Use of the Magnetostatic Analogue In Electromagnetic Lens Engineering

1970 ◽  
Vol 28 ◽  
pp. 360-361
Author(s):  
John W. Coleman
Keyword(s):  
Boundary Conditions ◽  
High Performance ◽  
Force Fields ◽  
Optical Design ◽  
Direct Conversion ◽  
Design Engineering ◽  
Design Data ◽  
Scalar Potentials ◽  
Geometric Elements ◽  
At Will

In the design engineering of high performance electromagnetic lenses, the direct conversion of electron optical design data into drawings for reliable hardware is oftentimes difficult, especially in terms of how to mount parts to each other, how to tolerance dimensions, and how to specify finishes. An answer to this is in the use of magnetostatic analytics, corresponding to boundary conditions for the optical design. With such models, the magnetostatic force on a test pole along the axis may be examined, and in this way one may obtain priority listings for holding dimensions, relieving stresses, etc..The development of magnetostatic models most easily proceeds from the derivation of scalar potentials of separate geometric elements. These potentials can then be conbined at will because of the superposition characteristic of conservative force fields.

Parallel Computing for Tire Simulations

2011 ◽  
Vol 39 (3) ◽  
pp. 193-209 ◽  
Author(s):  
H. Surendranath ◽  
M. Dunbar
Keyword(s):  
High Performance ◽  
Effective Means ◽  
Cost Effective ◽  
Turnaround Time ◽  
Careful Consideration ◽  
Rolling Contact ◽  
Element Analysis ◽  
Parallel Solvers ◽  
Design Changes ◽  
Highly Nonlinear

Abstract Over the last few decades, finite element analysis has become an integral part of the overall tire design process. Engineers need to perform a number of different simulations to evaluate new designs and study the effect of proposed design changes. However, tires pose formidable simulation challenges due to the presence of highly nonlinear rubber compounds, embedded reinforcements, complex tread geometries, rolling contact, and large deformations. Accurate simulation requires careful consideration of these factors, resulting in the extensive turnaround time, often times prolonging the design cycle. Therefore, it is extremely critical to explore means to reduce the turnaround time while producing reliable results. Compute clusters have recently become a cost effective means to perform high performance computing (HPC). Distributed memory parallel solvers designed to take advantage of compute clusters have become increasingly popular. In this paper, we examine the use of HPC for various tire simulations and demonstrate how it can significantly reduce simulation turnaround time. Abaqus/Standard is used for routine tire simulations like footprint and steady state rolling. Abaqus/Explicit is used for transient rolling and hydroplaning simulations. The run times and scaling data corresponding to models of various sizes and complexity are presented.

scholarly journals Pool Boiling of Nanofluids on Biphilic Surfaces: An Experimental and Numerical Study

Nanomaterials ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 125
Author(s):  
Eduardo Freitas ◽  
Pedro Pontes ◽  
Ricardo Cautela ◽  
Vaibhav Bahadur ◽  
João Miranda ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Numerical Model ◽  
Heat Dissipation ◽  
Numerical Study ◽  
Pool Boiling ◽  
Temperature Drop ◽  
Surface Cooling ◽  
Average Temperature ◽  
Gold Silver

This study addresses the combination of customized surface modification with the use of nanofluids, to infer on its potential to enhance pool-boiling heat transfer. Hydrophilic surfaces patterned with superhydrophobic regions were developed and used as surface interfaces with different nanofluids (water with gold, silver, aluminum and alumina nanoparticles), in order to evaluate the effect of the nature and concentration of the nanoparticles in bubble dynamics and consequently in heat transfer processes. The main qualitative and quantitative analysis was based on extensive post-processing of synchronized high-speed and thermographic images. To study the nucleation of a single bubble in pool boiling condition, a numerical model was also implemented. The results show an evident benefit of using biphilic patterns with well-established distances between the superhydrophobic regions. This can be observed in the resulting plot of the dissipated heat flux for a biphilic pattern with seven superhydrophobic spots, δ = 1/d and an imposed heat flux of 2132 w/m2. In this case, the dissipated heat flux is almost constant (except in the instant t* ≈ 0.9 when it reaches a peak of 2400 W/m2), whilst when using only a single superhydrophobic spot, where the heat flux dissipation reaches the maximum shortly after the detachment of the bubble, dropping continuously until a new necking phase starts. The biphilic patterns also allow a controlled bubble coalescence, which promotes fluid convection at the hydrophilic spacing between the superhydrophobic regions, which clearly contributes to cool down the surface. This effect is noticeable in the case of employing the Ag 1 wt% nanofluid, with an imposed heat flux of 2132 W/m2, where the coalescence of the drops promotes a surface cooling, identified by a temperature drop of 0.7 °C in the hydrophilic areas. Those areas have an average temperature of 101.8 °C, whilst the average temperature of the superhydrophobic spots at coalescence time is of 102.9 °C. For low concentrations as the ones used in this work, the effect of the nanofluids was observed to play a minor role. This can be observed on the slight discrepancy of the heat dissipation decay that occurred in the necking stage of the bubbles for nanofluids with the same kind of nanoparticles and different concentration. For the Au 0.1 wt% nanofluid, a heat dissipation decay of 350 W/m2 was reported, whilst for the Au 0.5 wt% nanofluid, the same decay was only of 280 W/m2. The results of the numerical model concerning velocity fields indicated a sudden acceleration at the bubble detachment, as can be qualitatively analyzed in the thermographic images obtained in this work. Additionally, the temperature fields of the analyzed region present the same tendency as the experimental results.

Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

2015 ◽  
Author(s):  
Nico Setiawan Effendi ◽  
Kyoung Joon Kim
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Computational Study ◽  
Heat Sinks ◽  
Channel Diameter ◽  
Internal Channel ◽  
Study Results ◽  
Parametric Effects

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.

Effects of Gap Geometry and Gravity on Boiling Around a Constrained Bubble in 2-Propanol/Water Mixtures

2006 ◽  
Vol 129 (2) ◽  
pp. 114-123
Author(s):  
Chen-li Sun ◽  
Van P. Carey
Keyword(s):  
Heat Flux ◽  
Heated Surface ◽  
Molar Fraction ◽  
Nucleate Boiling ◽  
Confined Space ◽  
Cold Surface ◽  
Boiling Regime ◽  
Wall Superheat ◽  
Boiling Process ◽  
Lower Heat

In this study, boiling experiments were conducted with 2-propanol/water mixtures in confined gap geometry under various levels of gravity. The temperature field created within the parallel plate gap resulted in evaporation over the portion of the vapor-liquid interface of the bubble near the heated surface, and condensation near the cold surface. Full boiling curves were obtained and two boiling regimes—nucleate boiling and pseudofilm boiling—and the transition condition, the critical heat flux (CHF), were identified. The observations indicated that the presence of the gap geometry pushed the nucleate boiling regime to a lower superheated temperature range, resulting in correspondingly lower heat flux. With further increases of wall superheat, the vapor generated by the boiling process was trapped in the gap to blanket the heated surface. This caused premature occurrence of CHF conditions and deterioration of heat transfer in the pseudo-film boiling regime. The influence of the confined space was particularly significant when greater Marangoni forces were present under reduced gravity conditions. The CHF value of x (molar fraction)=0.025, which corresponded to weaker Marangoni forces, was found to be greater than that of x=0.015 with a 6.4mm gap.

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