Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling

2005 ◽  
Author(s):  
Ioan Sauciuc ◽  
Hakan Erturk ◽  
Gregory Chrysler ◽  
Vikram Bala ◽  
Ravi Mahajan
Keyword(s):  
Power Consumption ◽  
Form Factors ◽  
Individual Performance ◽  
Uniform Heat Flux ◽  
Air Cooling ◽  
Two Phase ◽  
Current Form ◽  
Thermoelectric Modules ◽  
Passive Devices ◽  
Power Cycling

Over the past few years, the air cooling technology improvements present diminishing returns for microprocessors cooling applications. Presently most of the proposed future cooling technologies (i.e. pumped liquid cooling or vapor compressor refrigeration) may need some fluid moving device and a large remote heat exchanger which requires additional volume. Due to the complexity, reliability issues and space requirements it is preferred to extend the air cooling within the current form factors and using passive devices. This paper will show that optimized thermoelectric modules combined with two-phase (liquid/vapor) passive devices can further improve the cooling capability compared to conventional air cooling technologies at reasonable thermoelectric cooler (TEC) power consumption. Current computational fluid dynamics programs are not yet well equipped to find out the most optimized TEC geometry (for a given COP and given thermal requirements) in a reasonable amount of computation time. Therefore, two modeling steps are proposed: find out the preliminary TEC geometry using an ID analytical program (based on uniform heat flux and a given COP) and use it as an input to CFD programs (i.e. Icepak®) for detailed predictions. Using this model, we confirmed that the conventional TEC technology must use some spreading device to dissipate the CPU heat to the TEC cold side. Different spreading devices are considered: solid metal, heat pipe, vapor chambers and single/two phase pumped cooling. Their individual performance integrated with TEC will be presented. In addition, we propose that the TEC performance to be controlled as a function of instantaneous CPU power consumption, ambient temperature and other parameters. This controller offers extra flexibility which can be used for either noise reduction or TEC power reduction. However, such power cycling of the TEC may affect the TEC reliability. Power cycling accelerated test data (>500,000 accelerated cycles) have been performed together with the life predictions will be presented in the paper.

A Nondimensional Analysis of Boiling Dry a Vertical Channel with a Uniform Heat Flux

1981 ◽  
Vol 103 (4) ◽  
pp. 667-672 ◽  
Author(s):  
K. H. Sun ◽  
R. B. Duffey ◽  
C. Lin
Keyword(s):  
Heat Flux ◽  
Nuclear Power ◽  
Closed Form Solution ◽  
Vertical Channel ◽  
Form Solution ◽  
Uniform Heat Flux ◽  
Two Phase ◽  
Drift Flux ◽  
Rod Bundle ◽  
Uniform Heat

A thermal-hydraulic model has been developed for describing the phenomenon of hydrodynamically-controlled dryout, or the boil-off phenomenon, in a vertical channel with a spatially-averaged or uniform heat flux. The use of the drift flux correlation for the void fraction profile, along with mass and energy balances for the system, leads to a dimensionless closed-form solution for the predictions of two-phase mixture levels and collapsed liquid levels. The physical significance of the governing dimensionless parameters are discussed. Comparisons with data from single-tube experiments, a 3 × 3 rod bundle experiment, and the Three Mile Island nuclear power plant show good agreement.

Influence of Water Droplet Size and Temperature on Wet Compression

2007 ◽  
Author(s):  
M. Bianchi ◽  
F. Melino ◽  
A. Peretto ◽  
P. R. Spina ◽  
S. Ingistov
Keyword(s):  
Gas Turbine ◽  
Water Droplet ◽  
Droplet Diameter ◽  
Axial Compressor ◽  
Combined Cycle ◽  
Water Evaporation ◽  
Air Cooling ◽  
Compression Process ◽  
Two Phase ◽  
Wet Compression

In the last years, among all different gas turbine inlet air cooling techniques, an increasing attention to fogging approach is dedicated. The various fogging strategies seem to be a good solution to improve gas turbine or combined cycle produced power with low initial investment cost and less installation downtime. In particular, overspray fogging and interstage injection involve two-phase flow consideration and water evaporation during compression process (also known as wet compression). According to the Author’s knowledge, the field of wet compression is not completely studied and understood. In the present paper, all the principal aspects of wet compression and in particular the influence of injected water droplet diameter and surface temperature, and their effect on gas turbine performance and on the behavior of the axial compressor (change in axial compressor performance map due to the water injection, redistribution of stage load, etc.) are analyzed by using a calculation code, named IN.FO.G.T.E. (INterstage FOgging Gas Turbine Evaluation), developed and validated by the Authors.

scholarly journals Current Form Factors of Nucleon and Pion in Covariant Parton Model

1976 ◽  
Vol 55 (1) ◽  
pp. 229-242
Author(s):  
H. Kamo ◽  
A. Niegawa
Keyword(s):  
Form Factors ◽  
Parton Model ◽  
Current Form

Bc → J/ψ tensor form factors at large momentum recoil

2021 ◽  
pp. 2150135
Author(s):  
Dandan Shen ◽  
Huimin Ren ◽  
Fan Wu ◽  
Ruilin Zhu
Keyword(s):  
Form Factors ◽  
Distance Matrix ◽  
Relativistic Correction ◽  
Large Momentum ◽  
Matrix Elements ◽  
Leading Order ◽  
Lattice Data ◽  
Tensor Form ◽  
Long Distance ◽  
Current Form

We present a next-to-leading order (NLO) relativistic correction to [Formula: see text] tensor form factors within nonrelativistic QCD (NRQCD). We also consider complete Dirac bilinears [Formula: see text] with [Formula: see text] matrices [Formula: see text] in the [Formula: see text] transition. The relation among different current form factors is given and it shows that symmetries emerge in the heavy bottom quark limit. For a phenomenological extension, we propose to extract the long-distance matrix elements (LDMEs) for [Formula: see text] meson from the recent HPQCD lattice data and the NLO form factors at large momentum recoil.

Design and Application of Innovative 3DVC in AI Server System

2021 ◽  
Author(s):  
Xianguang Tan ◽  
Yongzhan He ◽  
Bin Liu ◽  
Jiang Yu ◽  
Ahuja Nishi ◽  
...  
Keyword(s):  
Artificial Intelligence ◽  
Cloud Computing ◽  
Power Consumption ◽  
Heat Dissipation ◽  
Air Cooling ◽  
Computing Power ◽  
Advanced Phase ◽  
Cooling Technology ◽  
Saving Effect ◽  
Server System

Abstract With the accelerated application of cloud computing and artificial intelligence, the computing power and power consumption of chips are greatly enhanced, which brings severe challenges to heat dissipation. Based on this, Baidu has adopted advanced phase change cooling technology and successfully developed an innovative 3dvc air cooling scheme for AI server system. This paper introduces the design, test and verification of the innovative scheme in detail. The results show that the scheme can reduce the GPU temperature by more than 5 °C compared with the traditional heat pipe cooling scheme, save 30%+ of the fan power consumption, and achieve good cooling and energy saving effect.

Состояние разработок двухфазных систем терморегулирования космических аппаратов

2021 ◽  
pp. 36-51
Author(s):  
Рустем Юсуфович Турна ◽  
Артем Михайлович Годунов
Keyword(s):  
Heat Transfer ◽  
Control System ◽  
Power Consumption ◽  
High Power ◽  
Single Phase ◽  
Thermal Control ◽  
Two Phase ◽  
Thermal Control System ◽  
Intensification Of Heat Exchange ◽  
Large Heat

The progress of space technology is leading to more and more energy-equipped spacecraft. The International Space Station already has the capacity of solar panels of more than 100 kW. Autonomous spacecrafts and satellites (including stationary ones) have the capacity of power units of kW, in the nearest future - more than 10 kW. Forced heat transfer using single-phase liquid coolants is still considered as the main method of thermal control on high-power spacecraft (SC). Single-phase mechanically pumped fluid loop is a fully proven means of thermal control of spacecraft with a moderate heat load. A significant disadvantage of such systems is that the coolant temperature varies significantly within the loop. The temperature difference can be reduced by increasing the coolant flow rate, but for this, it is necessary to increase the pump capacity, which inevitably leads to an increase in power consumption, pipeline diameters, and weight of the system as a whole. In the case of spacecraft with high power capacity (more than 5-10 kW) and large heat transfer distances (10 m and more), a two-phase mechanically pumped fluid loop for thermal control is more preferable in terms of weight, the accuracy of thermoregulation, power consumption (and other parameters). The use of a two-phase loop (2PMPL) as a spacecraft thermal control system allows to reduce significantly mass and power consumption for own needs in comparison with a single-phase thermal control system (TCS). The effect is achieved due to the accumulation of transferred heat in the form of latent heat of vaporization and intensification of heat exchange at boiling and condensation of coolant. The article provides a critical review of published works on 2PMPL for spacecraft with high power (more than 5...10 kW) and a large heat transfer distance (more than 10...100 meters) from 1980 up to nowadays. As a result, a list of the main problems on the way of practical implementation of two-phase loops is formed.

scholarly journals Outdoor Air-Cooling System for a Computer Room and Its Corresponding Energy-Saving Effect

Energies ◽  
2020 ◽  
Vol 13 (21) ◽  
pp. 5719
Author(s):  
JiHyun Hwang ◽  
Taewon Lee
Keyword(s):  
Power Consumption ◽  
Energy Saving ◽  
Data Centers ◽  
Cooling System ◽  
Stable Operation ◽  
Air Cooling ◽  
Outdoor Air ◽  
Air Conditioners ◽  
Air Cooling System ◽  
Saving Effect

The recent expansion of the internet network and rapid advancements in information and communication technology are expected to lead to a significant increase in power consumption and the number of data centers. However, these data centers consume a considerable amount of electric power all year round, regardless of working days or holidays; thus, energy saving at these facilities has become essential. A disproportionate level of power consumption is concentrated in computer rooms because air conditioners in these rooms are required to operate throughout the year to maintain a constant indoor environment for stable operation of computer equipment with high-heat release densities. Considerable energy-saving potential is expected in such computer rooms, which consume high levels of energy, if an outdoor air-cooling system and air conditioners are installed. These systems can reduce the indoor space temperature by introducing a relatively low outdoor air temperature. Therefore, we studied the energy-saving effect of introducing an outdoor air-cooling system in a computer room with a disorganized arrangement of servers and an inadequate air conditioning system in a research complex in Korea. The findings of this study confirmed that annual energy savings of up to approximately 40% can be achieved.

The Use of Ejector Refrigeration Systems for Turbine Inlet Air Cooling: A Thermodynamic and CFD Study

2007 ◽  
Author(s):  
Hany A. Al-Ansary
Keyword(s):  
Power Consumption ◽  
Power Output ◽  
Waste Heat ◽  
Evaporative Cooling ◽  
Published Data ◽  
Air Cooling ◽  
Refrigeration System ◽  
Compressor Blades ◽  
Cooling Systems ◽  
Turbine Inlet

Cooling turbine inlet air is a proven method of increasing turbine power output, especially during peak summer demand. It is estimated that turbine power output can increase by as much as 0.7% for every 1°C drop in inlet air temperature. Two inlet air cooling systems are widely used: evaporative cooling systems and chiller systems. Evaporative cooling is economical and uncomplicated, but its efficiency can significantly drop if the relative humidity is high. There is also a potential for excessive wear of compressor blades if water droplets are carried into the compressor section. On the other hand, chiller systems have the advantage of being independent of humidity and do not have the potential to cause damage to compressor blades. However, chiller systems consume power and cause a larger pressure drop than evaporative coolers. In this work, the possibility of using an ejector refrigeration system to cool turbine inlet air is explored. These systems are low-maintenance, fluid-driven, heat-operated devices that can use part of the turbine exhaust flow as the heat source for running the cycle. These systems require only pump power to feed liquid refrigerant to the vapor generator, making the power consumption potentially lower than conventional chiller systems. Using thermodynamic analysis, this paper compares the performance of ejector refrigeration systems with that of chiller systems based primarily on their power consumption. Performance characteristics for the ejector system are obtained through a CFD model that uses a real-gas model for R-134a. Published data on the performance of a commercial gas turbine is also considered. The power consumption of ejector refrigeration systems is found to be significantly smaller than that of vapor compression systems, with savings ranging from 19% to 80%. Power consumption is also found to be small compared to the boost in turbine power that is obtained. The percentage of waste heat needed to operate the ejector refrigeration system is found to be generally less than 25%.

New Thermal Management Systems for Data Centers

2012 ◽  
Vol 4 (3) ◽  
Author(s):  
Mayumi Ouchi ◽  
Yoshiyuki Abe ◽  
Masato Fukagaya ◽  
Takashi Kitagawa ◽  
Haruhiko Ohta ◽  
...  
Keyword(s):  
Heat Exchanger ◽  
Single Phase ◽  
Data Centers ◽  
Cooling System ◽  
Heat Pipes ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Cooling Jacket ◽  
Cooling Methods

Energy consumption in data centers has seen a drastic increase in recent years. In data centers, server racks are cooled down in an indirect way by air-conditioning systems installed to cool the entire server room. This air cooling method is inefficient as information technology (IT) equipment is insufficiently cooled down, whereas the room is overcooled. The development of countermeasures for heat generated by IT equipment is one of the urgent tasks to be accomplished. We, therefore, proposed new liquid cooling systems in which IT equipment is cooled down directly and exhaust heat is not radiated into the server room. Three cooling methods have been developed simultaneously. Two of them involve direct cooling; a cooling jacket is directly attached to the heat source (or CPU in this case) and a single-phase heat exchanger or a two-phase heat exchanger is used as the cooling jacket. The other method involves indirect cooling; heat generated by CPU is transported to the outside of the chassis through flat heat pipes and the condensation sections of the heat pipes are cooled down by coolant with liquid manifold. Verification tests have been conducted by using commercial server racks to which these cooling methods are applied while investigating five R&D components that constitute our liquid cooling systems: the single-phase heat exchanger, the two-phase heat exchanger, high performance flat heat pipes, nanofluid technology, and the plug-in connector. As a result, a 44–53% reduction in energy consumption of cooling facilities with the single-phase cooling system and a 42–50% reduction with the flat heat pipe cooling system were realized compared with conventional air cooling system.

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

2019 ◽  
Author(s):  
Devdatta P. Kulkarni ◽  
Priyanka Tunuguntla ◽  
Guixiang Tan ◽  
Casey Carte
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Sink ◽  
Capital Investment ◽  
Thermal Design ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Pipe Heat

Abstract In recent years, rapid growth is seen in computer and server processors in terms of thermal design power (TDP) envelope. This is mainly due to increase in processor core count, increase in package thermal resistance, challenges in multi-chip integration and maintaining generational performance CAGR. At the same time, several other platform level components such as PCIe cards, graphics cards, SSDs and high power DIMMs are being added in the same chassis which increases the server level power density. To mitigate cooling challenges of high TDP processors, mainly two cooling technologies are deployed: Liquid cooling and advanced air cooling. To deploy liquid cooling technology for servers in data centers, huge initial capital investment is needed. Hence advanced air-cooling thermal solutions are being sought that can be used to cool higher TDP processors as well as high power non-CPU components using same server level airflow boundary conditions. Current air-cooling solutions like heat pipe heat sinks, vapor chamber heat sinks are limited by the heat transfer area, heat carrying capacity and would need significantly more area to cool higher TDP than they could handle. Passive two-phase thermosiphon (gravity dependent) heat sinks may provide intermediate level cooling between traditional air-cooled heat pipe heat sinks and liquid cooling with higher reliability, lower weight and lower cost of maintenance. This paper illustrates the experimental results of a 2U thermosiphon heat sink used in Intel reference 2U, 2 node system and compare thermal performance using traditional heat sinks solutions. The objective of this study was to showcase the increased cooling capability of the CPU by at least 20% over traditional heat sinks while maintaining cooling capability of high-power non-CPU components such as Intel’s DIMMs. This paper will also describe the methodology that will be used for DIMMs serviceability without removing CPU thermal solution, which is critical requirement from data center use perspective.

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