Finite Element Parametric Analysis on Fine-Pitch BGA (FBGA) Packages

2003 ◽  
Author(s):  
Desmond Y. R. Chong ◽  
C. K. Wang ◽  
K. C. Fong ◽  
Pradeep Lall
Keyword(s):  
Finite Element ◽  
Integrated Circuit ◽  
Parametric Analysis ◽  
Substrate Thickness ◽  
Cellular Phones ◽  
Fine Pitch ◽  
Board Surface ◽  
Die Stress ◽  
Ic Package ◽  
Surface Mounting

Reduction in size of portable products such as cellular phones and camcorders has led to the miniaturization of integrated circuit packages. Fine-pitch BGA (FBGA) packages has been gaining its popularity due to compact in size and relatively low costing. With further down-sizing in package height, reliability issues like die cracking and warpage have surfaced as potential failures. Die cracks results in malfunction of an IC package, while the latter causes difficulty in board surface mounting. In this study, effects of package height on the die stress and warpage have been assessed by FEA. With overmold height ranging from 0.4∼0.6mm and substrate from 0.16∼0.32mm thick, the Overall Package Thickness coding from “T” (1.00<A< = 1.20mm) to “W” (0.65<A< = 0.80mm) are being analyzed. Results revealed that die stress and warpage decreases with increase in overmold thickness. However, an increment in the substrate thickness constituted to a rise in die stress and warpage. It was found that “top clearance” (distance between active die side and package top) of the package contributed to different trends in die stresses. Trends of results in varying the package and die sizes are also being investigated. The findings have provided guidelines for in-house designers in containing possible failures in FBGA packages.

GRID INDEPENDENT STUDY ON TETRAHEDRAL AND HEXAHEDRAL DOMINANT ELEMENTS TYPES IN FINITE ELEMENT ANALYSIS OF INTEGRATED CIRCUIT PACKAGE

2017 ◽  
Vol 79 (5-2) ◽  
Author(s):  
Khairul Fadzli Samat ◽  
Rosidah Jaafar ◽  
Muhammad Idzdihar Idris ◽  
Vincent Ong, Maidin, S. ◽  
Mohd Shahir Kasim ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Integrated Circuit ◽  
Maximum Stress ◽  
Independent Study ◽  
Von Mises Stress ◽  
Element Analysis ◽  
Tetrahedral Element ◽  
Element Type ◽  
Ic Package

The development of integrated circuit (IC) packaging is one of the important factors for the advanced production of the semi-conductor industry. With the recent rise of innovative demand of the production technology, lot of issues had been raised at the manufacturing level especially at back-end production. In order to solve the problem, finite element analysis (FEA) is one of the methods that has been broadly used to evaluate the internal stress of IC package. The performance effect of tetrahedral or hexahedral dominance elements in the meshing stage may lead to the unswerving of FEA results. In such condition, the performance of the element type needs to be analyzed in order to determine which implementation leads to result with higher confident level. This study used the quasi-static simulation of FEA to determine the performance of tetrahedral and hexahedral dominance elements in FEA of IC package strength. The monitored stress was focused on the component levels of IC package, the die and the diepad. The IC package is modelled in three-dimensional case which represented as close as the actual product by simplifying certain parts. The performance evaluation had considered the effect of grid independent study for each of the element type. The maximum stress produced by using the tetrahedral element had been compared with the stress produced by the hexahedral dominance elements. Comparison of the performance showed that the value of the maximum stress produced from hexahedral dominance element was significantly higher at 16% to 40% than the solution obtained from the tetrahedral element. It is found that by using hexahedral element in the finite element analysis, a significant higher value of Von Mises stress is produced, which is more than 505 MPa in diepad. This stress value has been established by previous study within the plastic deformation range and also has good agreement with the physical examination. 

The Reliability of Solder Joints in Fine Pitch 3-D Stack Package by Taguchi Method

2012 ◽  
Vol 229-231 ◽  
pp. 434-439
Author(s):  
Ching I Chen ◽  
Yu Zhen Liu ◽  
Jian Wei Chen
Keyword(s):  
Finite Element ◽  
Integrated Circuit ◽  
High Performance ◽  
Three Dimensional ◽  
Chip Thickness ◽  
Strain Range ◽  
Inelastic Strain ◽  
Element Model ◽  
Temperature Cycling ◽  
Substrate Thickness

To achieve high density and high performance, through-Silicon Vias (TSVs) have recently aroused much interest because it is a key enabling technology for three-dimensional (3-D) integrated circuit stacking and silicon interposer technology. In this study, a 3-D 1/8th symmetrical nonlinear finite element model of a stack die TSV package was developed using ANSYS finite element simulation. The model was used to optimize the package for robust design and to determine design rules to enhance 3-D stack package in view of bump reliability. An L8(2×7) Taguchi matrix was developed to investigate the effects of interposer thickness, TSV diameter, insulation (SiO2) thickness, chip thickness, substrate thickness, bump height, and bump diameter on bumps reliability. A temperature cycling test in the range of 0 °C to 100 °C was conducted by three cycles. The mechanical property of SAC leadless solder included time independent plastic and time dependent creep behaviors. The parameter of inelastic strain range of the third cycle was used to evaluate the bump life prediction. Two levels were chosen for each parameter to cover the ranges of interest. The results show that the smaller insulation (SiO2) and substrate thickness and the larger dimension for the other factors provide the best combination. These could be used as guides for further similar 3-D stack packages design.

Acoustic microscopy techniques for the inspection of integrated circuit devices and packages

1992 ◽  
Vol 50 (2) ◽  
pp. 966-967
Author(s):  
Thomas M. Moore
Keyword(s):  
Integrated Circuit ◽  
Acoustic Microscopy ◽  
Hybrid Technique ◽  
Frequency Scanning ◽  
Ic Packaging ◽  
Ic Package ◽  
Microscopy Techniques ◽  
Ic Package Inspection ◽  
Pulse Echo ◽  
Scanning Acoustic Microscope

In the last decade, a variety of characterization techniques based on acoustic phenomena have come into widespread use. Characteristics of matter waves such as their ability to penetrate optically opaque solids and produce image contrast based on acoustic impedance differences have made these techniques attractive to semiconductor and integrated circuit (IC) packaging researchers.These techniques can be divided into two groups. The first group includes techniques primarily applied to IC package inspection which take advantage of the ability of ultrasound to penetrate deeply and nondestructively through optically opaque solids. C-mode Acoustic Microscopy (C-AM) is a recently developed hybrid technique which combines the narrow-band pulse-echo piezotransducers of conventional C-scan recording with the precision scanning and sophisticated signal analysis capabilities normally associated with the high frequency Scanning Acoustic Microscope (SAM). A single piezotransducer is scanned over the sample and both transmits acoustic pulses into the sample and receives acoustic echo signals from the sample.

scholarly journals Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 295
Author(s):  
Pao-Hsiung Wang ◽  
Yu-Wei Huang ◽  
Kuo-Ning Chiang
Keyword(s):  
Finite Element ◽  
Thermal Cycling ◽  
Glass Substrate ◽  
High Speed ◽  
Coefficient Of Thermal Expansion ◽  
Three Dimensional ◽  
Design Parameters ◽  
Time To Failure ◽  
Wafer Level ◽  
Fine Pitch

The development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packaging (PoP) architecture. Given its inherent characteristics, glass is a good material for high-speed transmission applications. Therefore, this study proposes a fan-out wafer-level packaging (FO-WLP) with glass substrate-type PoP. The reliability life of the proposed FO-WLP was evaluated under thermal cycling conditions through finite element simulations and empirical calculations. Considering the simulation processing time and consistency with the experimentally obtained mean time to failure (MTTF) of the packaging, both two- and three-dimensional finite element models were developed with appropriate mechanical theories, and were verified to have similar MTTFs. Next, the FO-WLP structure was optimized by simulating various design parameters. The coefficient of thermal expansion of the glass substrate exerted the strongest effect on the reliability life under thermal cycling loading. In addition, the upper and lower pad thicknesses and the buffer layer thickness significantly affected the reliability life of both the FO-WLP and the FO-WLP-type PoP.

Numerical analyses on mechanical performance of flat buried approach slab and soil deformation

2021 ◽  
Author(s):  
Junqing Xue ◽  
Dong Xu ◽  
Yufeng Tang ◽  
Bruno Briseghella ◽  
Fuyun Huang ◽  
...  
Keyword(s):  
Finite Element ◽  
Tensile Stress ◽  
Parametric Analysis ◽  
Mechanical Performance ◽  
Element Model ◽  
Soil Deformation ◽  
Longitudinal Deformation ◽  
Expansion Joints ◽  
Approach Slab ◽  
Jointless Bridges

<p><br clear="none"/></p><p>The vulnerability problem of expansion joints could be fundamentally resolved using the concept of jointless bridges. The longitudinal deformation of the superstructure can be transferred to the backfill by using the approach slab. The flat buried approach slab (FBAS) has been used in many jointless bridges in European countries. In order to understand the mechanical performance of FBAS and soil deformation, a finite element model (FEM) was implemented in PLAXIS. Considering the friction between the FBAS and soil, the buried depth, the FBAS length and thickness as parameters, a parametric analysis was carried out. According to the obtained results and in order to reduce the soil deformation above the FBAS, it is suggested to increase the friction between the FBAS and sandy soil, and the buried depth of FBAS. Moreover, it should be paid attention to the vertical soil deformation and the concrete tensile stress of FBAS in pulling condition.</p>

Parametric analysis and finite element modelling for shear behavior of positive haunched RC beams

2021 ◽  
Author(s):  
Maryam H. Naser ◽  
Mayadah W. Falah ◽  
Alaa Adnan Hafedh ◽  
Fatimah H. Naser
Keyword(s):  
Finite Element ◽  
Finite Element Modelling ◽  
Parametric Analysis ◽  
Shear Behavior ◽  
Rc Beams ◽  
Element Modelling
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