The Development of a Bonded Fin Graphite/Epoxy Heat Sink for High Performance Servers

2003 ◽  
Author(s):  
E. E. Marotta ◽  
M. J. Ellsworth ◽  
J. Norley ◽  
G. Getz
Keyword(s):  
Thermal Conductivity ◽  
Heat Sink ◽  
High Performance ◽  
Structural Integrity ◽  
Copper Alloys ◽  
Temperature Drop ◽  
High Heat ◽  
Anisotropic Thermal Conductivity ◽  
Novel Approach ◽  
Weight Penalty

IBM’s has recently introduced a high performance server that utilizes multichip modules that dissipate very high heat loads. Each multichip module consists of four microprocessor chips encased by a copper cap that serves to spread the heat load over an area of roughly 113 mm × 113 mm. The module is air cooled by a single aluminum alloy bonded-fin fan sink. For applications requiring the microprocessors to operate at higher frequencies, the aluminum heat sink, with its lower thermal conductivity, cannot provide sufficient cooling; therefore, a copper heat sink must be employed. However, copper alloys have the disadvantage of a significant weight penalty (density ∼ 8.9 g/cm3), being 3.3 times heavier than aluminum (density ∼ 2.7 g/cm3), and is significantly more costly to manufacture. A novel approach for an improved heat sink has been developed using a new natural graphite-based/epoxy composite material. This material has low density (∼1.9 g/cm3) and anisotropic thermal conductivity (∼370 W/m-K in two directions, ∼ 7 W/m-K in the third direction). Bonded fin manufacturing methods have been developed to produce a heat sink that exploits the material’s high thermal conductivity when used in combination with a copper spreader module, such as used in the IBM server. Convective heat sink thermal performance approaching that of copper (e.g. 0.030 °C/W) has been achieved at a fraction of copper’s weight. Therefore, additional hardware required to allow the copper heat sinks to withstand shock and vibration standards, was not necessary with the lightweight graphite solution. Mechanical issues involved with using the lower strength graphite materials in a metal retrofit situation had to be resolved. Solutions included the use of aluminum end plates to provide edge protection to the heat sink with metal stiffeners inserted into the base for extra structural integrity. A variety of mechanical attachment methods was evaluated to join the graphite to the copper heat spreader. Lapping procedures were developed for the graphite heat sink to provide the required flatness necessary to minimize the temperature drop across the interface.

An Analytical Study of the Optimized Performance of an Impingement Heat Sink

2004 ◽  
Vol 126 (4) ◽  
pp. 528-534 ◽  
Author(s):  
S. B. Sathe ◽  
B. G. Sammakia
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Heat Sink ◽  
High Performance ◽  
Cross Flow ◽  
High Heat ◽  
Transfer Coefficients ◽  
Heat Transfer Coefficients ◽  
High Heat Transfer ◽  
Flow Through

The results of a study of a new and unique high-performance air-cooled impingement heat sink are presented. An extensive numerical investigation of the heat sink performance is conducted and is verified by experimental data. The study is relevant to cooling of high-power chips and modules in air-cooled environments and applies to workstations or mainframes. In the study, a rectangular jet impinges on a set of parallel fins and then turns into cross flow. The effects of the fin thickness, gap nozzle width and fin shape on the heat transfer and pressure drop are investigated. It is found that pressure drop is reduced by cutting the fins in the central impingement zone without sacrificing the heat transfer due to a reduction in the extent of the stagnant zone. A combination of fin thicknesses of the order of 0.5 mm and channel gaps of 0.8 mm with appropriate central cutout yielded heat transfer coefficients over 1500 W/m2 K at a pressure drop of less than 100 N/m2, as is typically available in high-end workstations. A detailed study of flow-through heat sinks subject to the same constraints as the impingement heat sink showed that the flow-through heat sink could not achieve the high heat transfer coefficients at a low pressure drop.

Experimental Study on Applied Thin Vapor Chamber and Embedded Heat Pipe Heat Sinks

2009 ◽  
Author(s):  
Garrett A. Glover ◽  
Yongguo Chen ◽  
Annie Luo ◽  
Herman Chu
Keyword(s):  
Heat Pipe ◽  
Heat Sink ◽  
High Performance ◽  
Structural Integrity ◽  
Heat Pipes ◽  
Electronic Cooling ◽  
Working Fluid ◽  
Vapor Chamber ◽  
Trade Offs ◽  
Pipe Heat

The current work is a survey of applied applications of passive 2-phase technologies, such as heat pipe and vapor chamber, in heat sink designs with thin base for electronic cooling. The latest improvements of the technologies and manufacturing processes allow achievable heat sink base thickness of 3 mm as compared to around 5 mm previously. The key technical challenge has been on maintaining structural integrity for adequate hollow space for the working fluid vapor in order to retain high performance while reducing the thickness of the overall vapor chamber or flattened heat pipe. Several designs of thin vapor chamber base heat sink and embedded heat pipe heat sink from different vendors are presented for a moderate power density application of a 60 W, 13.2 mm square heat source. Numerous works have been published by both academia and commercial applications in studying the fundamental science of passive 2-phase flow technologies; their performance has been compared to solid materials, like aluminum and copper. These works have established the merits of using heat pipes and vapor chambers in electronic cooling. The intent of this paper is to provide a methodical approach to help to accelerate the process in evaluating the arrays of different commercial designs of these devices in our product design cycle. In this paper, the trade-offs between the different types of technologies are discussed for parameters such as performance advantages, physical attributes, and some cost considerations. This is a bake-off evaluation of the complete heat sink solutions from the various vendors and not a fundamental research of vapor chambers and heat pipes — for that, it is best left to the vendors and universities.

scholarly journals Optimal design of subcooled triangular microchannel heat sink exchangers with variable heat loads for high performance cooling

2021 ◽  
Vol 2116 (1) ◽  
pp. 012052
Author(s):  
David Olugbenga Ariyo ◽  
Tunde Bello-Ochende
Keyword(s):  
Heat Sink ◽  
High Performance ◽  
Flow Boiling ◽  
High Heat ◽  
Geometric Optimization ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Subcooled Flow Boiling ◽  
Subcooled Flow ◽  
Microchannel Heat Sinks

Abstract Deionized water at a temperature of 25 °C was used as the cooling fluid and aluminium as the heat sink material in the geometric optimization and parameter modelling of subcooled flow boiling in horizontal equilateral triangular microchannel heat sinks. The thermal resistances of the microchannels were minimized subject to fixed volume constraints of the heat sinks and microchannels. A computational fluid dynamics (CFD) ANSYS code used for both the simulations and the optimizations was validated by the available experimental data in the literature and the agreement was good. Fixed heat fluxes between 100 and 500 W/cm2 and velocities between 0.1 and 7.0 m/s were used in the study. Despite the relatively high heat fluxes in this study, the base temperatures of the optimal microchannel heat sinks were within the acceptable operating range for modern electronics. The pumping power requirements for the optimal microchannels are low, indicating that they can be used in the cooling of electronic devices.

Use of a Two-Phase Thermosyphon as a Low-Cost, High-Performance Economizer for Refrigeration Systems

2013 ◽  
Author(s):  
Tao He ◽  
Chunlei Mei ◽  
Tom Butcher ◽  
Jon P. Longtin
Keyword(s):  
High Performance ◽  
Low Cost ◽  
Temperature Drop ◽  
Electricity Consumption ◽  
The United States ◽  
High Heat ◽  
Cold Season ◽  
Two Phase ◽  
Working Fluids ◽  
Applicable Range

The electricity consumption of residential and commercial refrigerators is significant in the United States. A natural choice then is to use the low outside temperatures for cooling to reduce electricity usage for residential refrigerators. Our solution is to use two phase close thermosyphon as an economizer during the cold season to take advantage of colder outside temperatures. Benefits of the thermosyphon include a high heat carrying capability with a small temperature drop, low cost, and the ability to behave as a thermal diode. In this work, a model is adapted from the literature to investigate the effect of working fluids, filling ratio and heat input on the performance of thermosyphon for refrigeration applications. Among the working fluids explored ammonia provided the best performance, followed by methanol. Experimental results are also presented for a thermosyphon residing in a simulated refrigeration configuration. The measured temperatures agree well with model predictions. The result demonstrates it is able to maintain temperature drop with applicable range.

An Analytical Study of the Optimized Performance of an Impingement Heat Sink

2003 ◽  
Author(s):  
S. B. Sathe ◽  
B. G. Sammakia
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Heat Sink ◽  
High Performance ◽  
Cross Flow ◽  
High Heat ◽  
Transfer Coefficients ◽  
Heat Transfer Coefficients ◽  
High Heat Transfer ◽  
Flow Through

The results of a study of a new and unique high performance air-cooled impingement heat sink are presented. An extensive numerical investigation of the heat sink performance is conducted and is verified by experimental data. The study is relevant to cooling of high power chips and modules in air-cooled environments and applies to workstations or mainframes. In the study, a rectangular jet impinges on a set of parallel fins and then turns into cross-flow. The effects of the fin thickness and gap nozzle width and fin shape on the heat transfer and pressure drop are investigated. It is found that pressure drop is reduced by cutting the fins in the central impingement zone without sacrificing the heat transfer due to a reduction in the extent of the stagnant zone. A combination of fin thicknesses of the order of 0.5 mm and channel-gaps of 0.8 mm with appropriate central cut-out yielded heat transfer coefficients over 1500 W/m2K at a pressure drop of less than 100 N/m2, as is typically available in high-end workstations. A detailed study of flow-through heat sinks, subject to the same constraints as the impingement heat sink showed that the flow-through heat sink could not achieve the high heat transfer coefficients at a low pressure drop.

A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes

2005 ◽  
Vol 128 (1) ◽  
pp. 92-97 ◽  
Author(s):  
Anand Desai ◽  
Sanket Mahajan ◽  
Ganesh Subbarayan ◽  
Wayne Jones ◽  
James Geer ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
High Performance ◽  
Numerical Study ◽  
Temperature Drop ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
The Impact ◽  
Interface Materials

Power dissipation in electronic devices is projected to increase over the next 10years to the range of 150-250W per chip for high performance applications. One of the primary obstacles to the thermal management of devices operating at such high powers is the thermal resistance between the device and the heat spreader or heat sink that it is attached to. Typically the in situ thermal conductivity of interface materials is in the range of 1-4W∕mK, even though the bulk thermal conductivity of the material may be significantly higher. In an attempt to improve the effective in situ thermal conductivity of interface materials nanoparticles and nanotubes are being considered as a possible addition to such interfaces. This paper presents the results of a numerical study of transport in a thermal interface material that is enhanced with carbon nanotubes. The results from the numerical solution are in excellent agreement with an analytical model (Desai, A., Geer, J., and Sammakia, B., “Models of Steady Heat Conduction in Multiple Cylindrical Domains,” J. Electron. Packaging (to be published)) of the same geometry. Wide ranges of parametric studies were conducted to examine the effects of the thermal conductivity of the different materials, the geometry, and the size of the nanotubes. An estimate of the effective thermal conductivity of the carbon nanotubes was used, obtained from a molecular dynamics analysis (Mahajan, S., Subbarayan, G., Sammakia, B. G., and Jones, W., 2003, Proceedings of the 2003 ASME International Mechanical Engineering Congress and Exposition, Washington, D.C., Nov. 15–21). The numerical analysis was used to estimate the impact of imperfections in the nanotubes upon the overall system performance. Overall the nanotubes are found to significantly improve the thermal performance of the thermal interface material. The results show that varying the diameter of the nanotube and the percentage of area occupied by the nanotubes does not have any significant effect on the total temperature drop.

Porous reaction-sintered AlN tapes for high-performance microelectronics application

2002 ◽  
Vol 17 (2) ◽  
pp. 306-314 ◽  
Author(s):  
F. Y. C. Boey ◽  
A. I. Y. Tok ◽  
W. J. Clegg
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
High Performance ◽  
Coefficient Of Thermal Expansion ◽  
Linear Trend ◽  
Dielectric Constants ◽  
Sintering Behavior ◽  
Low Dielectric ◽  
Novel Approach ◽  
Controlled Porosity

A novel approach was undertaken in producing porous AlN microelectronics tapes with high thermal conductivity and low dielectric constant. This method involved polymer microspherical powders used as a sacrificial mold to introduce controlled porosity into the green tapes during pyrolysis. The Al2O3-rich porous green tapes were then reaction sintered at 1680 °C for 12 h to create porous AlN tapes. This work builds upon a previously developed novel reaction sintering process that densified and converted Al2O3-rich tapes (Al2O3–20 wt% AlN–5 wt% Y2O3) to AlN tapes at a relatively low sintering temperature of 1680 °C. The sintering behavior of the porous tapes was investigated, and the effects of the microsphere particle size and volume addition were studied. The microspheres successfully contributed to the significant reduction of tape density by porosity, and this contributed to lowering its dielectric constant. Dielectric constants of the AlN tapes were reduced to about 6.8 to 7.7 while thermal conductivity values were reasonable at about 46 to 60 W/mK. Coefficient of thermal expansion (CTE) values showed a linear trend according to phase composition, with the porous AlN tapes exhibiting CTE values of 4.4 × 10−6 to 4.8 × 10−6/°C, showing good CTE compatibility with silicon at 4.0 × 10−6/°C. The added porosity did not significantly affect the CTE values.

Anisotropic Thermal Conductivity of A Si/Ge Superlattice

1998 ◽  
Vol 545 ◽  
Author(s):  
T. Borca-Tasciuc ◽  
D. Song ◽  
J. L. Liu ◽  
G. Chen ◽  
K. L. Wang ◽  
...  
Keyword(s):  
Thin Film ◽  
Thermal Conductivity ◽  
Temperature Drop ◽  
Differential Method ◽  
Conductivity Measurements ◽  
3Ω Method ◽  
Anisotropic Thermal Conductivity ◽  
Plane Direction ◽  
Narrow Width ◽  
Heat Spreading

AbstractExperimental evidence for a significant thermal conductivity reduction have been reported in recent years for GaAs/AlAs, Si/Ge, and Bi 2Te3/Sb2Te3 superlattices. In this work, we present preliminary experimental results on the reduction of the in-plane and cross-plane thermal conductivity for a symmetric Si/Ge superlattice. A differential 2-wire 3ω method is developed to perform the anisotropic thermal conductivity measurements. In this technique, a patterned heater with a width much larger than the film thickness yields the cross-plane thermal conductivity of the film. The in-plane thin film thermal conductivity is inferred from the temperature rise of a narrow width heater that can create more heat spreading in the in-plane direction of the thin film. A differential method to measure the temperature drop across the film is employed in order to increase the accuracy of the measurement.

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