Anisotropic Thermal Conductivity of A Si/Ge Superlattice

1998 ◽  
Vol 545 ◽  
Author(s):  
T. Borca-Tasciuc ◽  
D. Song ◽  
J. L. Liu ◽  
G. Chen ◽  
K. L. Wang ◽  
...  

AbstractExperimental evidence for a significant thermal conductivity reduction have been reported in recent years for GaAs/AlAs, Si/Ge, and Bi 2Te3/Sb2Te3 superlattices. In this work, we present preliminary experimental results on the reduction of the in-plane and cross-plane thermal conductivity for a symmetric Si/Ge superlattice. A differential 2-wire 3ω method is developed to perform the anisotropic thermal conductivity measurements. In this technique, a patterned heater with a width much larger than the film thickness yields the cross-plane thermal conductivity of the film. The in-plane thin film thermal conductivity is inferred from the temperature rise of a narrow width heater that can create more heat spreading in the in-plane direction of the thin film. A differential method to measure the temperature drop across the film is employed in order to increase the accuracy of the measurement.

2000 ◽  
Author(s):  
Theodorian Borca-Tasciuc ◽  
Weili Liu ◽  
Jianlin Liu ◽  
Kang L. Wang ◽  
Gang Chen

Abstract In this work, we present experimental results on the in-plane and cross-plane thermal conductivity characterization of a Si/Ge quantum-dots superlattice structure. The quantum-dots superlattice was grown by molecular-beam-epitaxy and self-organization. The anisotropic thermal conductivity measurements are performed by a differential two-wire 3ω method. The measured in-plane and cross-plane thermal conductivity values show a different temperature behavior. The results are compared and explained with heat transport models in superlattices.


Author(s):  
Jun-ichi Miyamoto ◽  
Junpei Ooyama ◽  
Yoshiaki Yamamoto

In this work, thermal conductivities of gas diffusion layer (GDL) under controlled temperature, humidity and stress are measured. Additionally, we investigated the anisotropic thermal conductivity of GDLs. The experimental results showed that thermal conductivity of in-plane direction was much higher than that of trough-plane direction for all the samples that were measured. This result indicated thermal conductivity of GDLs to be strongly anisotropic since GDL is a highly porous material which contains large amount of air inside the GDL. Moreover, we found that thermal conductivity of GDL in the through-plane direction increased as the compression on the GDL was increased.


2021 ◽  
Vol 92 (3) ◽  
pp. 034902
Author(s):  
Shingi Yamaguchi ◽  
Takuma Shiga ◽  
Shun Ishioka ◽  
Tsuguyuki Saito ◽  
Takashi Kodama ◽  
...  

2018 ◽  
Vol 193 (3-4) ◽  
pp. 380-386 ◽  
Author(s):  
J. P. Allmaras ◽  
A. G. Kozorezov ◽  
A. D. Beyer ◽  
F. Marsili ◽  
R. M. Briggs ◽  
...  

2012 ◽  
Vol 2012.65 (0) ◽  
pp. 139-140
Author(s):  
Harutoshi HAGINO ◽  
Yosuke KAWAHARA ◽  
Aimi GOTO ◽  
Toru HIWADA ◽  
Koji Miyazaki

Author(s):  
E. E. Marotta ◽  
M. J. Ellsworth ◽  
J. Norley ◽  
G. Getz

IBM’s has recently introduced a high performance server that utilizes multichip modules that dissipate very high heat loads. Each multichip module consists of four microprocessor chips encased by a copper cap that serves to spread the heat load over an area of roughly 113 mm × 113 mm. The module is air cooled by a single aluminum alloy bonded-fin fan sink. For applications requiring the microprocessors to operate at higher frequencies, the aluminum heat sink, with its lower thermal conductivity, cannot provide sufficient cooling; therefore, a copper heat sink must be employed. However, copper alloys have the disadvantage of a significant weight penalty (density ∼ 8.9 g/cm3), being 3.3 times heavier than aluminum (density ∼ 2.7 g/cm3), and is significantly more costly to manufacture. A novel approach for an improved heat sink has been developed using a new natural graphite-based/epoxy composite material. This material has low density (∼1.9 g/cm3) and anisotropic thermal conductivity (∼370 W/m-K in two directions, ∼ 7 W/m-K in the third direction). Bonded fin manufacturing methods have been developed to produce a heat sink that exploits the material’s high thermal conductivity when used in combination with a copper spreader module, such as used in the IBM server. Convective heat sink thermal performance approaching that of copper (e.g. 0.030 °C/W) has been achieved at a fraction of copper’s weight. Therefore, additional hardware required to allow the copper heat sinks to withstand shock and vibration standards, was not necessary with the lightweight graphite solution. Mechanical issues involved with using the lower strength graphite materials in a metal retrofit situation had to be resolved. Solutions included the use of aluminum end plates to provide edge protection to the heat sink with metal stiffeners inserted into the base for extra structural integrity. A variety of mechanical attachment methods was evaluated to join the graphite to the copper heat spreader. Lapping procedures were developed for the graphite heat sink to provide the required flatness necessary to minimize the temperature drop across the interface.


Author(s):  
Dachen Chu ◽  
Maxat Touzelbaev ◽  
Kenneth E. Goodson ◽  
Sergey Babin ◽  
R. Fabian Pease

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