A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes

2005 ◽  
Vol 128 (1) ◽  
pp. 92-97 ◽  
Author(s):  
Anand Desai ◽  
Sanket Mahajan ◽  
Ganesh Subbarayan ◽  
Wayne Jones ◽  
James Geer ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
High Performance ◽  
Numerical Study ◽  
Temperature Drop ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
The Impact ◽  
Interface Materials

Power dissipation in electronic devices is projected to increase over the next 10years to the range of 150-250W per chip for high performance applications. One of the primary obstacles to the thermal management of devices operating at such high powers is the thermal resistance between the device and the heat spreader or heat sink that it is attached to. Typically the in situ thermal conductivity of interface materials is in the range of 1-4W∕mK, even though the bulk thermal conductivity of the material may be significantly higher. In an attempt to improve the effective in situ thermal conductivity of interface materials nanoparticles and nanotubes are being considered as a possible addition to such interfaces. This paper presents the results of a numerical study of transport in a thermal interface material that is enhanced with carbon nanotubes. The results from the numerical solution are in excellent agreement with an analytical model (Desai, A., Geer, J., and Sammakia, B., “Models of Steady Heat Conduction in Multiple Cylindrical Domains,” J. Electron. Packaging (to be published)) of the same geometry. Wide ranges of parametric studies were conducted to examine the effects of the thermal conductivity of the different materials, the geometry, and the size of the nanotubes. An estimate of the effective thermal conductivity of the carbon nanotubes was used, obtained from a molecular dynamics analysis (Mahajan, S., Subbarayan, G., Sammakia, B. G., and Jones, W., 2003, Proceedings of the 2003 ASME International Mechanical Engineering Congress and Exposition, Washington, D.C., Nov. 15–21). The numerical analysis was used to estimate the impact of imperfections in the nanotubes upon the overall system performance. Overall the nanotubes are found to significantly improve the thermal performance of the thermal interface material. The results show that varying the diameter of the nanotube and the percentage of area occupied by the nanotubes does not have any significant effect on the total temperature drop.

Analytical Model of Heat Conduction in a Tubular Geometry With Application to a Nano-Structured Thermal Interface

2005 ◽  
Author(s):  
Anand Desai ◽  
James Geer ◽  
Bahgat Sammakia
Keyword(s):  
Thermal Conductivity ◽  
Power Dissipation ◽  
High Performance ◽  
Analytical Study ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Inner Diameter ◽  
Parametric Analyses ◽  
Interface Materials

Power dissipation in electronic devices is projected to increase significantly over the next ten years to the range of 50-150 Watts per cm2 for high performance applications [1]. This increase in power represents a major challenge to systems integration since the maximum device temperature needs to be around 100 C. One of the primary obstacles to the thermal management of devices operating at such high powers is the thermal resistance between the device and the heat spreader or heat sink that it is attached to. Typically the in situ thermal conductivity of interface materials is in the range of 1 to 4 W/mK, even though the bulk thermal conductivity of the material may be significantly higher. In order to improve the effective in-situ thermal conductivity of interface materials nanotubes are being considered as a possible addition to such interfaces. The primary approach taken in the current study is to analyze the enhancement of the thermal interface by adding carbon nano tubular cylinders that are oriented in the direction of transport. This paper presents the results of an analytical study of transport in a thermal interface material that is enhanced with carbon nanotubes. A variety of parametric analyses are carried out, such as by varying the inner diameter of the nanotube and the power dissipation, and the effect on spreading resistance is calculated. The results indicate that for high thermal conductivity nanotubes there is a significant increase in the effective thermal conductivity of the thermal interface material.

Bond Line Thickness of Thermal Interface Materials With Carbon Nanotubes

2005 ◽  
Author(s):  
Senthil A. G. Singaravelu ◽  
Xuejiao Hu ◽  
Kenneth E. Goodson
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Volume Fraction ◽  
Bond Line ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Line Thickness ◽  
Bond Line Thickness ◽  
The Impact ◽  
Interface Materials

Increasing power dissipation in today’s microprocessors demands thermal interface materials (TIMs) with lower thermal resistances. The TIM thermal resistance depends on the TIM thermal conductivity and the bond line thickness (BLT). Carbon Nanotubes (CNTs) have been proposed to improve the TIM thermal conductivity. However, the rheological properties of TIMs with CNT inclusions are not well understood. In this paper, the transient behavior of the BLT of the TIMs with CNT inclusions has been measured under controlled attachment pressures. The experimental results show that the impact of CNT inclusions on the BLT at low volume fractions (up to 2 vol%) is small; however, higher volume fraction of CNT inclusions (5 vol%) can cause huge increase in TIM thickness. Although thermal conductivities are higher for higher CNT fractions, a minimum TIM resistance exists at some optimum CNT fraction for a given attachment pressure.

Comparison between CNT Thermal Interface Materials with Graphene Thermal Interface Material in Term of Thermal Conductivity

2020 ◽  
Vol 1010 ◽  
pp. 160-165
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Nor Zaiazmin Yahaya ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Mixed Material ◽  
Interface Materials ◽  
Main Material

Thermal interface material (TIM) had been well conducted and developed by using several material as based material. A lot of combination and mixed material were used to increase thermal properties of TIM. Combination between materials for examples carbon nanotubes (CNT) and epoxy had had been used before but the significant of the studied are not exactly like predicted. In this studied, thermal interface material using graphene and CNT as main material were used to increase thermal conductivity and thermal contact resistance. These two types of TIM had been compare to each other in order to find wich material were able to increase the thermal conductivity better. The sample that contain 20 wt. %, 40 wt. % and 60 wt. % of graphene and CNT were used in this studied. The thermal conductivity of thermal interface material is both measured and it was found that TIM made of graphene had better thermal conductivity than CNT. The highest thermal conductivity is 23.2 W/ (mK) with 60 w. % graphene meanwhile at 60 w. % of CNT only produce 12.2 W/ (mK thermal conductivity).

scholarly journals Graphene-Based Thermal Interface Materials: An Application-Oriented Perspective on Architecture Design

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1201 ◽  
Author(s):  
Le Lv ◽  
Wen Dai ◽  
Aijun Li ◽  
Cheng-Te Lin
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Electronic Devices ◽  
Point Of View ◽  
Future Research ◽  
Thermal Interface Materials ◽  
Research Directions ◽  
Thermal Interface ◽  
Future Research Directions ◽  
Interface Materials

With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of thermal management. Graphene exhibited significant potential for the development of TIMs, due to its ultra-high intrinsic thermal conductivity. In this perspective, we introduce three state-of-the-art graphene-based TIMs, including dispersed graphene/polymers, graphene framework/polymers and inorganic graphene-based monoliths. The advantages and limitations of them were discussed from an application point of view. In addition, possible strategies and future research directions in the development of high-performance graphene-based TIMs are also discussed.

scholarly journals Thermal Properties of the Graphene Composites: Application of Thermal Interface Materials

2018 ◽  
Vol 7 (4.33) ◽  
pp. 530
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Zaiazmin Y.N ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Matrix Material ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Uniform Thickness ◽  
Thermal Interface ◽  
Interface Materials ◽  
Main Material

Epoxy mixed with others filler for thermal interface material (TIM) had been well conducted and developed. There are problem occurs when previous material were used as matrix material likes epoxy that has non-uniform thickness of thermal interface material produce, time taken for solidification and others. Thermal pad or thermal interface material using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity and thermal contact resistance. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10 wt. %, 20 wt. % and 30 wt. % of graphene was used with different contain of graphene oxide (GO).  The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/ (mK) with 30 w. % graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene-epoxy is an excellent thermal interface material in increasing thermal conductivity.  

Development of a Compliant Nanothermal Interface Material

2011 ◽  
Author(s):  
David Shaddock ◽  
Stanton Weaver ◽  
Ioannis Chasiotis ◽  
Binoy Shah ◽  
Dalong Zhong
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Stresses ◽  
Performance Testing ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bondline Thickness ◽  
Interface Materials

The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance. High thermal conductivity materials, such as solders, have been used as thermal interface materials. However, there is a limit to minimum bondline thickness in reducing resistance due to increased fatigue stress. A compliant thermal interface material is proposed that allows for thin solder bondlines using a compliant structure within the bondline to achieve thermal resistance <0.01 cm2C/W. The structure uses an array of nanosprings sandwiched between two plates of materials to match thermal expansion of their respective interface materials (ex. silicon and copper). Thin solder bondlines between these mating surfaces and high thermal conductivity of the nanospring layer results in thermal resistance of 0.01 cm2C/W. The compliance of the nanospring layer is two orders of magnitude more compliant than the solder layers so thermal stresses are carried by the nanosprings rather than the solder layers. The fabrication process and performance testing performed on the material is presented.

scholarly journals RGO-Coated Polyurethane Foam/Segmented Polyurethane Composites as Solid–Solid Phase Change Thermal Interface Material

Polymers ◽  
2020 ◽  
Vol 12 (12) ◽  
pp. 3004
Author(s):  
Cong Zhang ◽  
Zhe Shi ◽  
An Li ◽  
Yang-Fei Zhang
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Phase Change ◽  
High Performance ◽  
In Situ Polymerization ◽  
Solid Phase ◽  
Thermal Interface Material ◽  
Segmented Polyurethane ◽  
Thermal Interface ◽  
Self Assembling

Thermal interface material (TIM) is crucial for heat transfer from a heat source to a heat sink. A high-performance thermal interface material with solid–solid phase change properties was prepared to improve both thermal conductivity and interfacial wettability by using reduced graphene oxide (rGO)-coated polyurethane (PU) foam as a filler, and segmented polyurethane (SPU) as a matrix. The rGO-coated foam (rGOF) was fabricated by a self-assembling method and the SPU was synthesized by an in situ polymerization method. The pure SPU and rGOF/SPU composite exhibited obvious solid–solid phase change properties with proper phase change temperature, high latent heat, good wettability, and no leakage. It was found that the SPU had better heat transfer performance than the PU without phase change properties in a practical application as a TIM, while the thermal conductivity of the rGOF/SPU composite was 63% higher than that of the pure SPU at an ultra-low rGO content of 0.8 wt.%, showing great potential for thermal management.

scholarly journals A Meta-study on the Thermal Properties of Carbon Nanotubes in Thermal Interface Materials

2019 ◽  
Vol 6 ◽  
pp. 16-27
Author(s):  
Scott Clarkson ◽  
Asah H Khan ◽  
Dipendra Singh
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Integrated Circuit ◽  
Operation Time ◽  
Transfer Efficiency ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Thermal Paste ◽  
Thermal Transfer ◽  
Interface Materials

Computer Integrated Circuit (IC) microprocessors are becoming more powerful and densely packed while cooling mechanisms are seeing an equivalent improvement to compensate. A significant limit to cooling performance is thermal transfer between die and heatsink. In this meta study we evaluate carbon nanotube (CNT) thermal interface materials (TIMs) in order to determine how to maximise thermal transfer efficiency. We gathered information from over 15 articles focused on the thermodynamic parameters of CNT TIMs from databases such as Scopus, IEEE Xplore and ScienceDirect. Articles were filtered by key words including ‘carbon nanotubes’ and ‘thermal interface materials’ to identify scientific articles relevant to our research on TIMs. From our meta study we have found that enhancing CNTs will provide the best improvement in TIMs. The parameters analysed to determine TIM performance included thermal resistance, thermal conductivity and the effect of CNT concentration on computer operation time. Through our investigation we understood that increasing the concentration of CNT from 0 to 2 wt % increases the operation time from 75 seconds at 66°C to 200s at 63°C as well as increasing the thermal conductivity by 1.82 times for the AS5 thermal paste with 2 wt % CNT. Furthermore, CNT TIM pastes with less thickness have a lower thermal resistance of 0.4 K/W. However not all these parameters have been tested with computer chips. This means that in order to increase current heat transfer efficiency limit, we must integrate these parameters into experimental models. Keywords: Thermal Interface Material; Thermal Paste; Carbon Nanotubes; Thermal Transfer Efficiency; Integrated Circuit; Heat Sink; Heat Dissipation.

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