Understanding Longitudinal Fin Heat Sink Orientation Sensitivity for Light Emitting Diode (LED) Lighting Applications

2003 ◽  
Author(s):  
James Petroski
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Radiant Energy ◽  
Cylindrical Tube ◽  
Heat Sinks ◽  
Radiant Heat Transfer ◽  
Light Sources ◽  
Light Emitting

Light Emitting Diodes (LEDs) have progressed in recent years from emitting indicator level lighting to emitting enough light for illumination applications. This has opened a new field for LED applications, resulting in significant advantages over conventional light sources and creating some application challenges unique to LEDs. Conventional lighting methods provide little guidance for LED thermal problems since these usually involve a very high temperature source, such as a filament or an arc, and radiant heat transfer dissipates the thermal energy. LED junction temperatures are limited to much lower values and hence the heat transfer system cannot depend upon radiant energy transfer. This means the cooling methods for lighting now shift from primarily radiation to conduction and natural convection, and this paradigm shift lighting designers must recognize when moving to LEDs. In this paper, the development of a LED-based spot module heat sink in a free convective cooling system is discussed. The rationale for choosing a cylindrical tube, longitudinal fin (CTLF) heat sink is shown, as is the performance of five different configurations of the heat sink in various orientations. The requirement for using heat sinks in various orientations comes from lighting applications, where the light may be installed in various directions, such as vertical up, vertical down, horizontal, or at almost any other angle. Heat sink test results are plotted for Nussult number versus standard and modified channel Rayleigh number, showing a similar correlation to the parallel plate heat sinks investigated first by Elenbaas. A different correlation for the isolated-plate limit section is proposed for CTLF heat sinks, as well as a proposed area of operation on these Nu-Ra curves for orientation-insensitive heat sinks. Finally, explanations for the different levels of sensitivities observed in different areas of the Nu-Ra curves are offered.

Cooling Performances of Perforated-Finned Heat Sinks

2016 ◽  
Author(s):  
Mohammad Reza Shaeri ◽  
Bradley Richard ◽  
Richard Bonner
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Cooling System ◽  
Thermal Characteristics ◽  
Heat Sinks ◽  
Pumping Power ◽  
Maximum Heat ◽  
Maximum Heat Transfer

Cooling performances of perforated-finned heat sinks (PFHS) are investigated in the laminar forced convection heat transfer mode, through detailed experiments. Perforations like windows with square cross sections are placed on the lateral surfaces of the fins. Cooling performances are evaluated due to changes in both porosities and perforation sizes. Thermal characteristics are reported based on pumping power, in order to provide more practical insight about performances of PFHSs in real applications. It is found that at a constant perforation size, there is an optimum porosity that results in the largest heat transfer coefficient. For a fixed porosity, increasing the number of perforations (reducing the perforation size) results in an enhancement of heat transfer rate due to repeated interruption of the thermal boundary layer. The opposite trend is observed for PFHSs with larger perforation sizes. This indicates that there is an optimum perforation size and distance between perforations in order to achieve the maximum heat transfer coefficients at a constant porosity. Also, a PFHS results in a smaller temperature non-uniformity across the heat sink base, as well as a more rapid reduction in temperature non-uniformity on the heat sink base by increasing pumping power. In addition, the advantage of a PFHS to reduce the overall weight of the cooling system is incorporated into thermal characteristics of the heat sinks, and demonstrated by the mass specific heat transfer coefficient.

scholarly journals Modelling and Numerical Simulations of Heat Distribution for LED Heat Sink

2016 ◽  
Vol 2016 ◽  
pp. 1-8 ◽  
Author(s):  
Jianxin Zhu ◽  
Lixia Sun
Keyword(s):  
Heat Sink ◽  
Optimization Design ◽  
Evaluation Method ◽  
Light Emitting Diode ◽  
Vertical Direction ◽  
Heat Sinks ◽  
Heat Distribution ◽  
Spherical Coordinate ◽  
Light Emitting ◽  
Implicit Finite Difference

Light-emitting diode (LED) has higher efficiency and longer lifetime when compared with the conventional lighting. However, the efficiency and lifetime will be degraded greatly when it is operated at a high temperature. Now, both previous simulation and experimental results have already indicated that the heat transfer in vertical direction of the LED lamp by conduction is the most critical component. In this paper, a simplified numerical simulation model is built to estimate the heat distribution of the LED heat sink in the spherical coordinate system, which would be useful for its shape optimization design. With this model, some mathematical treatments are provided to a heat conduction equation, in order to rapidly compute the static heat distribution and the temperature of different designs of LED heat sinks. The built rapid heat sink evaluation method, implicit finite difference method (IFDM), is unconditionally stable. Several heat distribution simulations could demonstrate that our built mathematical model conforms well to the reality and our method is full of feasibility and effectiveness.

scholarly journals A Novel Heat Sink Design and Prototyping for LED Desk Lamps

2015 ◽  
Vol 2015 ◽  
pp. 1-8
Author(s):  
Li-Ming Chu ◽  
Wei-Chin Chang ◽  
Ting Hsuan Huang
Keyword(s):  
Heat Sink ◽  
Light Emitting Diode ◽  
Base Plate ◽  
Life Time ◽  
Heat Sinks ◽  
Light Emitting ◽  
Lighting Device ◽  
Different Types ◽  
Heat Sink Design ◽  
Chimney Effect

Light-emitting diode (LED) is a modern lighting device. If the heat dissipating mechanism of LED desk lamp is not well designed, the induced high temperature will cause the reduction of illumination and life time of lamp. Therefore, the heat sink design becomes a key technology for LED lighting device. This study developed a methodology to design and analyze a heat sink for LED cooling. Four different types of heat sinks with fins in longitudinal or transverse directions and with or without vents on the base plate were compared. By using the CFD software FLUENT, heat flux and temperature around the heat sink were analyzed, and the surface temperature distribution was also investigated. The simulation outcomes were compared with experiments results to verify analysis accuracy. The comparisons show only slight differences, and the deviations were less than 4.0%. For cooling LED desk lamp, the design of using 12 vents on both sides of heat sink through natural convection to create the chimney effect was adopted; consequently, the temperature dropped 5°C in average. This design can also reduce the material of heat sink, LED lamp weight, and production cost.

Improved Radial Plane Fins Heat Sink for Light-Emitting Diode Lamps Cooling

2019 ◽  
Vol 12 (4) ◽  
Author(s):  
António M. G. Lopes ◽  
Vítor A. F. Costa
Keyword(s):  
Heat Sink ◽  
Numerical Study ◽  
Light Emitting Diode ◽  
Heat Sinks ◽  
Electronic Components ◽  
Turning Operation ◽  
Light Emitting ◽  
Radial Plane ◽  
Convection Cooling ◽  
Main Ideas

Abstract A numerical study is conducted concerning the improvement of radial plane fins heat sinks for natural convection cooling of light-emitting diode (LED) lamps. The main objective is to maintain the temperature of the heat sink base below a prescribed threshold for a given released heat flux at the heat sink, minimizing its mass and maintaining at a reasonably simple level the manufacturing processes and operations required for its production. Starting from a previously optimized heat sink for the same purpose, constituted by complete rectangular radial plane fins, the present study aims at further improvements by considering incomplete rectangular radial plane fins. The main objective of this study is to find the best profile for the turning operation to obtain the radial plane fins lighter configuration. It is found that this can be achieved by removing part of the upper internal corners of the rectangular fins, more specifically shaping a curved cut, leading to heat sink mass reduction up to 32.4%. The geometry of the improved heat sink is of cylindrical nature, obtained from cutting an aluminum extruded bar comprising a cylindrical central core and a number of uniformly distributed rectangular radial plane fins, followed by a simple turning operation to remove their upper internal corners. Even if results concern a particular LED lamp, the main ideas and approach prevail to improve other types of heat sinks for general light and/or electronic components cooling.

Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb Systems

2014 ◽  
Vol 136 (4) ◽  
Author(s):  
James Petroski
Keyword(s):  
Natural Convection ◽  
Heat Sink ◽  
Energy Savings ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Point Of View ◽  
Light Bulb ◽  
Light Emitting ◽  
Size And Shape ◽  
Liquid Cooling System

The movement to light-emitting diode (LED) lighting systems worldwide is accelerating quickly as energy savings and reduction in hazardous materials increase in importance. Government regulations and rapidly lowering prices help to further this trend. Today's strong drive is to replace light bulbs of common outputs (60 W, 75 W, and 100 W) without resorting to compact fluorescent (CFL) bulbs containing mercury while maintaining the standard industry bulb size and shape referred to as A19. For many bulb designs, this A19 size and shape restriction forces a small heat sink which is barely capable of dissipating heat for 60 W equivalent LED bulbs with natural convection for today's LED efficacies. 75 W and 100 W equivalent bulbs require larger sizes, some method of forced cooling, or some unusual liquid cooling system; generally none of these approaches are desirable for light bulbs from a consumer point of view. Thus, there is interest in developing natural convection cooled A19 light bulb designs for LEDs that cool far more effectively than today's current designs. Current A19 size heat sink designs typically have thermal resistances of 5–7 °C/W. This paper presents designs utilizing the effects of chimney cooling, well developed for other fields that reduce heat sink resistances by significant amounts while meeting all other requirements for bulb system design. Numerical studies and test data show performance of 3–4 °C/W for various orientations including methods for keeping the chimney partially active in horizontal orientations. Significant parameters are also studied with effects upon performance. The simulations are in good agreement with the experimental data. Such chimney-based designs are shown to enable 75 W and 100 W equivalent LED light bulb designs critical for faster penetration of LED systems into general lighting applications.

A three-dimensional thermal analysis for cooling a square Light Emitting Diode by Multiwalled Carbon Nanotube-nanofluid-filled in a rectangular microchannel

2021 ◽  
Vol 13 (11) ◽  
pp. 168781402110599
Author(s):  
Mohamed Bechir Ben Hamida ◽  
Mohammed A. Almeshaal ◽  
Khalil Hajlaoui
Keyword(s):  
Heat Sink ◽  
Heat Dissipation ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Three Dimensional ◽  
Junction Temperature ◽  
Engine Oil ◽  
Inlet Temperature ◽  
Rectangular Microchannel ◽  
Light Emitting

The aim of this paper is to ensure proper thermal management in order to remove and dissipate the heat produced by a square Light Emitting Diode (LED), as well as to ensure stable and safe operation by reducing the junction temperature. For this, we developed a three-dimensional code, time-dependent that solves the systems of equations for the mass, momentum, and energy using Comsol Multiphysics. After validation of this numerical 3D code, the thermal performance of a LED cooling system with three nanofluids such as MWCNT-Water, MWCNT-Ethylene Glycol, and MWCNT-Engine oil is studied numerically into account of aggregation effect. Several parameters such as: the power of the LED lamp, the inlet temperature and velocity of nanofluid, the length of the heat sink, and the length of the microchannel have been varied in order to find an optimal condition allowing a good heat dissipation from the LED chip to the heat sink. It was concluded that the use of MWCNT-Water in the microchannel is the best nanofluid that can cool the heat sink. In addition, the increase of velocity inlet of the coolant in the microchannel, the length of the heat sink, and the microchannel length while the decrease of the inlet temperature of nanofluid in the microchannel are an important factors allowing the decrease of the junction temperature of the square LED lamp.

scholarly journals Cooling analysis of a light emitting diode automotive fog lamp

2017 ◽  
Vol 21 (1 Part B) ◽  
pp. 757-766
Author(s):  
Matej Zadravec ◽  
Matjaz Ramsak ◽  
Jure Ravnik ◽  
Matjaz Hribersek ◽  
Jernej Slanovec
Keyword(s):  
Heat Transfer ◽  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Heat Sink ◽  
Stokes Equations ◽  
Light Emitting Diode ◽  
Navier Stokes ◽  
Radiation Model ◽  
Navier Stokes Equations ◽  
Light Emitting

Efficiency of cooling fins inside of a light emitting diode fog lamp is studied using computational fluid dynamics. Diffusion in heat sink, natural convection and radiation are the main principles of the simulated heat transfer. The Navier-Stokes equations were solved by the computational fluid dynamics code, including Monte Carlo radiation model and no additional turbulence model was needed. The numerical simulation is tested using the existing lamp geometry and temperature measurements. The agreement is excellent inside of few degrees at all measured points. The main objective of the article is to determine the cooling effect of various heat sink parts. Based on performed simulations, some heat sink parts are found to be very ineffective. The geometry and heat sink modifications are proposed. While radiation influence is significant, compressible effects are found to be minor.

Electrically driven single microribbon based near-infrared exciton-polariton light-emitting diode

CrystEngComm ◽  
2021 ◽  
Author(s):  
Mingming Jiang ◽  
Fupeng Zhang ◽  
Kai Tang ◽  
Peng Wan ◽  
Caixia Kan
Keyword(s):  
High Performance ◽  
Near Infrared ◽  
Light Emitting Diodes ◽  
Light Emitting Diode ◽  
Light Sources ◽  
Coherent Light ◽  
Light Emitting ◽  
Exciton Polaritons ◽  
Laser Devices

Achieving electrically-driven exciton-polaritons has drawn substantial attention toward developing ultralow-threshold coherent light sources, containing polariton laser devices and high-performance light-emitting diodes (LEDs). In this work, we demonstrate an electrically driven...

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Temperature Cycling ◽  
Fluorescent Light ◽  
Light Sources ◽  
Light Emitting ◽  
Die Attach ◽  
Nanosilver Paste ◽  
Interconnection Material

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

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