Advanced Integrated Cooling Systems for Thermal Management in Data Centers

2009 ◽  
Author(s):  
Yoshiyuki Abe ◽  
Masato Fukagaya ◽  
Takashi Kitagawa ◽  
Haruhiko Ohta ◽  
Yasuhisa Shinmoto ◽  
...  
Keyword(s):  
Thermal Management ◽  
Heat Exchangers ◽  
Single Phase ◽  
Heat Pipes ◽  
Narrow Channel ◽  
Working Fluid ◽  
Two Phase ◽  
Thermal Network ◽  
Flat Type ◽  
Nano Fluids

For a drastic energy conservation in data centers (more than 30%), a new advanced concept of thermal management systems of integrated cooling network in server racks is proposed, and a series of developmental studies toward the realization of the concept have been conducted. The concept consists of the following technological items: - Plug-in thermal network cables, - Narrow channel heat exchangers (single-phase and two-phase), - Thin flat-type heat pipes, - Development of nano-fluids for heat transfer enhancement. In this concept, CPUs in server racks are directly cooled with the aid of advanced 1.5 mm thick flat-type heat pipes or 3 mm thick narrow channel heat exchangers, though CPUs in server racks, at present, are cooled down with massive heat sinks by forced air flow in the racks. In the case of heat pipes, condensation regions are cooled by either single-phase or two-phase narrow channel heat sink instead of air-cooled finned heat sink. These cooling units are accommodated in server racks. In addition, plug-in thermal network cables, in which a working fluid for narrow channel heat exchangers is running, are integrated among server racks, and thermal energy dissipated in server racks are inclusively merged and managed by the thermal network cables. The working fluid heated up by the dissipated heat is recuperated in an outdoor cooling system. An attempt at the applications of silver nano-fluids as a working fluid in heat pipes and thermal network is also conducted in the present study. Silver nano-fluids are thermochemically synthesized by a microwave heating technique, which allows for superior stable suspension characteristics.

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

2010 ◽  
Vol 132 (4) ◽  
Author(s):  
Yoon Jo Kim ◽  
Yogendra K. Joshi ◽  
Andrei G. Fedorov ◽  
Young-Joon Lee ◽  
Sung-Kyu Lim
Keyword(s):  
Integrated Circuits ◽  
Mass Flow Rate ◽  
Thermal Management ◽  
Mass Flow ◽  
Flow Rate ◽  
Single Phase ◽  
Hot Spot ◽  
Three Dimensional ◽  
Two Phase ◽  
Two Phase Cooling

It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked ICs, the interlayer microfluidic cooling scheme is adopted and analyzed in this study focusing on a single cooling layer performance. The effects of cooling mode (single-phase versus phase-change) and stack/layer geometry on thermal management performance are quantitatively analyzed, and implications on the through-silicon-via scaling and electrical interconnect congestion are discussed. Also, the thermal and hydraulic performance of several two-phase refrigerants is discussed in comparison with single-phase cooling. The results show that the large internal pressure and the pumping pressure drop are significant limiting factors, along with significant mass flow rate maldistribution due to the presence of hot-spots. Nevertheless, two-phase cooling using R123 and R245ca refrigerants yields superior performance to single-phase cooling for the hot-spot fluxes approaching ∼300 W/cm2. In general, a hybrid cooling scheme with a dedicated approach to the hot-spot thermal management should greatly improve the two-phase cooling system performance and reliability by enabling a cooling-load-matched thermal design and by suppressing the mass flow rate maldistribution within the cooling layer.

Two-Phase Flow in Microchannels

2001 ◽  
Author(s):  
G. Hetsroni ◽  
A. Mosyak ◽  
Z. Segal
Keyword(s):  
Heat Sink ◽  
High Speed ◽  
Single Phase ◽  
Flow Boiling ◽  
Electronics Cooling ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Two Phase ◽  
Infrared Radiometry ◽  
Phase Water

Abstract Experimental investigation of a heat sink for electronics cooling is performed. The objective is to keep the operating temperature at a relatively low level of about 323–333K, while reducing the undesired temperature variation in both the streamwise and transverse directions. The experimental study is based on systematic temperature, flow and pressure measurements, infrared radiometry and high-speed digital video imaging. The heat sink has parallel triangular microchannels with a base of 250μm. According to the objectives of the present study, Vertrel XF is chosen as the working fluid. Experiments on flow boiling of Vertrel XF in the microchannel heat sink are performed to study the effect of mass velocity and vapor quality on the heat transfer, as well as to compare the two-phase results to a single-phase water flow.

Experimental Study of Linear and Radial Two-Phase Heat Transport Devices Driven by Electrohydrodynamic Conduction Pumping

2015 ◽  
Vol 137 (2) ◽  
Author(s):  
Matthew R. Pearson ◽  
Jamal Seyed-Yagoobi
Keyword(s):  
Heat Source ◽  
Capillary Pressure ◽  
Heat Transport ◽  
Radial Direction ◽  
Heat Pipes ◽  
Working Fluid ◽  
Phase Flow ◽  
Transport Capacity ◽  
Two Phase ◽  
Capillary Phenomenon

Heat pipes are well known as simple and effective heat transport devices, utilizing two-phase flow and the capillary phenomenon to remove heat. However, the generation of capillary pressure requires a wicking structure and the overall heat transport capacity of the heat pipe is generally limited by the amount of capillary pressure generation that the wicking structure can achieve. Therefore, to increase the heat transport capacity, the capillary phenomenon must be either augmented or replaced by some other pumping technique. Electrohydrodynamic (EHD) conduction pumping can be readily used to pump a thin film of a dielectric liquid along a surface, using electrodes that are embedded into the surface. In this study, two two-phase heat transport devices are created. The first device transports the heat in a linear direction. The second device transports the heat in a radial direction from a central heat source. The radial pumping configuration provides several advantages. Most notably, the heat source is wetted with fresh liquid from all directions, thereby reducing the amount of distance that must be travelled by the working fluid. The power required to operate the EHD conduction pumps is a trivial amount relative to the heat that is transported.

scholarly journals Heat transfer and entropy generation in a microchannel with longitudinal vortex generators using Nanofluids

2020 ◽  
Author(s):  
Amin Ebrahimi ◽  
Farhad Rikhtegar Nezami ◽  
Amin Sabaghan ◽  
Ehsan Roohi
Keyword(s):  
Heat Transfer ◽  
Entropy Generation ◽  
Single Phase ◽  
Pure Water ◽  
Vortex Generators ◽  
Longitudinal Vortex ◽  
Working Fluid ◽  
Two Phase ◽  
Rectangular Microchannel ◽  
Important Conclusion

Conjugated heat transfer and hydraulic performance for nanofluid flow in a rectangular microchannel heat sink with LVGs (longitudinal vortex generators) are numerically investigated using at different ranges of Reynolds numbers. Three-dimensional simulations are performed on a microchannel heated by a constant heat flux with a hydraulic diameter of 160 μm and six pairs of LVGs using a single-phase model. Coolants are selected to be nanofluids containing low volume-fractions (0.5%–3.0%) of Al2O3 or CuO nanoparticles with different particle sizes dispersed in pure water. The employed model is validated and compared by published experimental, and single-phase and two-phase numerical data for various geometries and nanoparticle sizes. The results demonstrate that heat transfer is enhanced by 2.29–30.63% and 9.44%–53.06% for water-Al2O3 and water-CuO nanofluids, respectively, in expense of increasing the pressure drop with respect to pure-water by 3.49%–16.85% and 6.5%–17.70%, respectively. We have also observed that the overall efficiency is improved by 2.55%–29.05% and 9.78%–50.64% for water-Al2O3 and water-CuO nanofluids, respectively. The results are also analyzed in terms of entropy generation, leading to the important conclusion that using nanofluids as the working fluid could reduce the irreversibility level in the rectangular microchannel heat sinks with LVGs. No exterma (minimums) is found for total entropy generation for the ranges of parameters studied.

Hydrodynamic and Thermal Performance of a Vapor-Venting Microchannel Copper Heat Exchanger

2008 ◽  
Author(s):  
Milnes P. David ◽  
Amy Marconnet ◽  
Kenneth E. Goodson
Keyword(s):  
Heat Exchanger ◽  
Carbon Fiber ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Heat Exchangers ◽  
Single Phase ◽  
Two Phase ◽  
Microchannel Heat Exchanger ◽  
Large Pressure ◽  
Dry Out

Two-phase microfluidic cooling has the potential to achieve low thermal resistances with relatively small pumping power requirements compared to single-phase heat exchanger technology. Two-phase cooling systems face practical challenges however, due to the instabilities, large pressure drop, and dry-out potential associated with the vapor phase. Our past work demonstrated that a novel vapor-venting membrane attached to a silicon microchannel heat exchanger can reduce the pressure drop for two-phase convection. This work develops two different types of vapor-venting copper heat exchangers with integrated hydrophobic PTFE membranes and attached thermocouples to quantify the thermal resistance and pressure-drop improvement over a non-venting control. The first type of heat exchanger, consisting of a PTFE phase separation membrane and a 170 micron thick carbon-fiber support membrane, shows no improvement in the thermal resistance and pressure drop. The results suggest that condensation and leakage into the carbon-fiber membrane suppresses venting and results in poor device performance. The second type of heat exchanger, which evacuates any liquid water on the vapor side of the PTFE membrane using 200 ml/min of air, reduces the thermal resistance by almost 35% in the single-phase regime in comparison. This work shows that water management, mechanical and surface properties of the membrane as well as its attachment and support within the heat exchanger are all key elements of the design of vapor-venting heat exchangers.

scholarly journals An investigation on effect of EDL on heat transfer of micro heat pipe with square and triangular cross section

2020 ◽  
Vol 21 (3) ◽  
pp. 309
Author(s):  
Maryam Fallah Abbasi ◽  
Hossein Shokouhmand ◽  
Morteza Khayat
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Double Layer ◽  
Electric Double Layer ◽  
Heat Pipes ◽  
The Body ◽  
Working Fluid ◽  
Two Phase ◽  
Micro Heat Pipe ◽  
Micro Heat Pipes

Electronic industries have always been trying to improve the efficiency of electronic devices with small dimensions through thermal management of this equipment, thus increasing the use of small thermal sinks. In this study micro heat pipes with triangular and square cross sections have been manufactured and tested. One of the main objectives is to obtain an understanding of micro heat pipes and their role in energy transmission with electrical double layer (EDL). Micro heat pipes are highly efficient heat transfer devices, which use the continuous evaporation/condensation of a suitable working fluid for two-phase heat transport in a closed system. Since the latent heat of vaporization is very large, heat pipes transport heat at small temperature difference, with high rates. Because of variety of advantage features these devices have found a number of applications both in space and terrestrial technologies. The theory of operation micro heat pipes with EDL is described and the micro heat pipe has been studied. The temperature distribution have achieved through five thermocouples installed on the body. Water and different solution mixture of water and ethanol have used to investigate effect of the electric double layer heat transfer. It was noticed that the electric double layer of ionized fluid has caused reduction of heat transfer.

New Thermal Management Systems for Data Centers

2012 ◽  
Vol 4 (3) ◽  
Author(s):  
Mayumi Ouchi ◽  
Yoshiyuki Abe ◽  
Masato Fukagaya ◽  
Takashi Kitagawa ◽  
Haruhiko Ohta ◽  
...  
Keyword(s):  
Heat Exchanger ◽  
Single Phase ◽  
Data Centers ◽  
Cooling System ◽  
Heat Pipes ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Cooling Jacket ◽  
Cooling Methods

Energy consumption in data centers has seen a drastic increase in recent years. In data centers, server racks are cooled down in an indirect way by air-conditioning systems installed to cool the entire server room. This air cooling method is inefficient as information technology (IT) equipment is insufficiently cooled down, whereas the room is overcooled. The development of countermeasures for heat generated by IT equipment is one of the urgent tasks to be accomplished. We, therefore, proposed new liquid cooling systems in which IT equipment is cooled down directly and exhaust heat is not radiated into the server room. Three cooling methods have been developed simultaneously. Two of them involve direct cooling; a cooling jacket is directly attached to the heat source (or CPU in this case) and a single-phase heat exchanger or a two-phase heat exchanger is used as the cooling jacket. The other method involves indirect cooling; heat generated by CPU is transported to the outside of the chassis through flat heat pipes and the condensation sections of the heat pipes are cooled down by coolant with liquid manifold. Verification tests have been conducted by using commercial server racks to which these cooling methods are applied while investigating five R&D components that constitute our liquid cooling systems: the single-phase heat exchanger, the two-phase heat exchanger, high performance flat heat pipes, nanofluid technology, and the plug-in connector. As a result, a 44–53% reduction in energy consumption of cooling facilities with the single-phase cooling system and a 42–50% reduction with the flat heat pipe cooling system were realized compared with conventional air cooling system.

Mini- and Microchannel Research in Sweden

2003 ◽  
Author(s):  
Bjo¨rn Palm
Keyword(s):  
Heat Exchangers ◽  
Single Phase ◽  
Single Channels ◽  
Phase Flow ◽  
Single Phase Flow ◽  
Two Phase ◽  
Compact Heat Exchangers ◽  
Micro Channels ◽  
Parallel Channels ◽  
Institute Of Technology

The purpose of the present paper is to present research and development within the area of mini- and micro channels in Sweden. A review is made of the historical development of highly compact heat exchangers within the country, starting with plate heat exchangers. The main focus is on the research performed at the Royal Institute of Technology, where mini-channel research has been going on since more than ten years. Single-phase flow as well as two-phase flow is treated, both in single channels and in full-size heat exchangers with multiple parallel channels.

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