Effect of Process Parameters on the Electrically-Assisted Sintered Iron-Copper Powder Metals

Author(s):  
Ihab Ragai ◽  
Matt Schwabenbauer ◽  
Seray Eser ◽  
Michael Müller

Electric-current-assisted sintering (ECAS) is a novel process that can potentially replace the conventional sintering method. It is hypothesized that the process can reduce the sintering time and can be used in situ; thus, can be more cost effective. The purpose of this research is to investigate the effect of direct current on the sintered properties of iron-copper powder metal. Experiments were conducted at various conditions to determine the optimal process parameters for this particular powder metal. The parameters investigated were electric current levels and energizing time. Experiments also included sintering the powder using a conventional furnace. Samples from both types of experiments were compared to determine the metallurgical differences due to the sintering process. Mechanical and microstructure examination were conducted to aid in determining the feasibility of ECAS.

Materials ◽  
2020 ◽  
Vol 13 (18) ◽  
pp. 4128
Author(s):  
Xin Li Phuah ◽  
Han Wang ◽  
Bruce Zhang ◽  
Jaehun Cho ◽  
Xinghang Zhang ◽  
...  

In situ utilization of available resources in space is necessary for future space habitation. However, direct sintering of the lunar regolith on the Moon as structural and functional components is considered to be challenging due to the sintering conditions. To address this issue, we demonstrate the use of electric current-assisted sintering (ECAS) as a single-step method of compacting and densifying lunar regolith simulant JSC-1A. The sintering temperature and pressure required to achieve a relative density of 97% and microhardness of 6 GPa are 700 °C and 50 MPa, which are significantly lower than for the conventional sintering technique. The sintered samples also demonstrated ferroelectric and ferromagnetic behavior at room temperature. This study presents the feasibility of using ECAS to sinter lunar regolith for future space resource utilization and habitation.


2014 ◽  
Vol 46 (2) ◽  
pp. 195-203 ◽  
Author(s):  
U. Çavdar ◽  
E. Atik ◽  
A. Ataç

In this study; iron based powder metal (PM) bushing compacts were sintered via medium frequency induction heating system. Iron based powders were mixed with 2 wt.% copper (Cu), 0.3 wt.% carbon (C) and 1 wt.% zinc stearat (Zn-st) via V-Type mixer. PM compacts were sintered by 2 different sintering processes. One of them was conventional sintering method other was medium frequency induction sintering method. In conventional sintering process, PM bushing compacts were sintered under inert environmental at 1120?C for 30 minutes. In medium frequency induction sintering process, PM bushing compacts were sintered between 30-50 kHz frequency (Medium frequency) at 2 kW, 1120?C for 1 or 3 minutes under atmospheric environmental. Mechanical properties, densities and micro hardness? were investigated for all sintered processes. SEM and micro structural images were taken from polished broken surface of the sintered PM bushing compacts. 3 minutes induction sintered compacts were reached the compressive strength, microhardness and density values of the conventional sintered PM bushing compact.


2016 ◽  
Vol 2016 (1) ◽  
pp. 000475-000477 ◽  
Author(s):  
R. Kahle ◽  
T. Braun ◽  
J. Bauer ◽  
K.-F. Becker ◽  
M. Schneider-Ramelow ◽  
...  

Abstract While Moore's Law is slowing down heterogeneous integration and System-in-Package (SiP) are taking up the challenge towards further miniaturization. To ensure reliability of these packages often encapsulation by transfer molding is used – providing a highly productive and cost effective device housing. Though transfer molding is the dominant process for microelectronics encapsulation, the process details are typically not accessible directly but only via machine settings. To understand more of the mold process further research needs to be conducted to get inside information from the process. A sensor based system was developed to in-situ measure transient material data and process parameters. The temperature of the tool and melt front, the cavity pressure and cure related dielectric material data was measured with a first prototype. Summarized this paper presents the development of a sensor based system to in-situ measure characteristic material properties and process parameters in a transfer mold machine. The in-situ measurement tool allows a live documentation, optimization and knowledge extension of transfer mold processes parallel to FEM simulation and external measuring like DSC analysis. The sensor approach can lead to material driven self-adjusting transfer mold machines with an economized process.


Alloy Digest ◽  
2009 ◽  
Vol 58 (11) ◽  

Abstract Ancorsteel 4300 alloy ferrous powder simulates wrought steel compositions and is a cost-effective alternative to alloys requiring secondary processing. This datasheet provides information on composition, physical properties, hardness, and tensile properties as well as fracture toughness. It also includes information on heat treating and powder metal forms. Filing Code: SA-611. Producer or source: Hoeganaes Corporation.


Microscopy ◽  
2020 ◽  
Author(s):  
Xiaoguang Li ◽  
Kazutaka Mitsuishi ◽  
Masaki Takeguchi

Abstract Liquid cell transmission electron microscopy (LCTEM) enables imaging of dynamic processes in liquid with high spatial and temporal resolution. The widely used liquid cell (LC) consists of two stacking microchips with a thin wet sample sandwiched between them. The vertically overlapped electron-transparent membrane windows on the microchips provide passage for the electron beam. However, microchips with imprecise dimensions usually cause poor alignment of the windows and difficulty in acquiring high-quality images. In this study, we developed a new and efficient microchip fabrication process for LCTEM with a large viewing area (180 µm × 40 µm) and evaluated the resultant LC. The new positioning reference marks on the surface of the Si wafer dramatically improve the precision of dicing the wafer, making it possible to accurately align the windows on two stacking microchips. The precise alignment led to a liquid thickness of 125.6 nm close to the edge of the viewing area. The performance of our LC was demonstrated by in situ transmission electron microscopy imaging of the dynamic motions of 2-nm Pt particles. This versatile and cost-effective microchip production method can be used to fabricate other types of microchips for in situ electron microscopy.


2021 ◽  
pp. 100773
Author(s):  
Kamoldara Reansuwan ◽  
Rotsukon Jawana ◽  
Saoharit Nitayavardhana ◽  
Sirichai Koonaphapdeelert
Keyword(s):  

2006 ◽  
Vol 47 ◽  
pp. 7-16 ◽  
Author(s):  
Giovanni Giunchi ◽  
Giovanni Ripamonti ◽  
Elena Perini ◽  
Stefano Ginocchio ◽  
Enrico Bassani ◽  
...  

The issues in the conventional sintering of the MgB2 superconductors have conducted to the discovery of a new way to densify this material. The new process is an “in situ” method that relies on the reactive liquid infiltration (RLI) of liquid Magnesium into Boron powders packed preform. The RLI process allows to obtain highly dense manufacts without the use of hot pressing apparatus and can be applied to the manufacture of large superconducting pieces. One of the peculiarities of the MgB2 superconductivity, that withstand up to 39 K, is represented by the relative insensitiveness of the supercurrent percolation to the orientation of the grain boundaries. This property allows to use polycrystalline material without loosing superconducting performance, granted that a good connectivity between the crystalline grains must be realized, as the RLI process allows to do. The microstructure of the bulk material obtained by RLI shows a variety of morphologies, according to the kind of the used Boron powders and to the process variables. A detailed analysis of the microstructure of the MgB2 obtained by RLI will be presented, as well as its analytical description and the correlation with the superconducting characteristics.


Author(s):  
Yi Ren ◽  
Jinyan Yu ◽  
Jingyue Zhang ◽  
Lu Lv ◽  
Weiming Zhang
Keyword(s):  

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