Cavity Filling Analysis for the Fabrication of an Alignment Structure in Micro Hot Embossing

2012 ◽  
Author(s):  
J. A. Gomez ◽  
T. G. Conner ◽  
I.-H. Song ◽  
D.-H. Chun ◽  
Y.-J. Kim ◽  
...  
Keyword(s):  
Flow Behavior ◽  
Mold Insert ◽  
Hot Embossing ◽  
Polymer Flow ◽  
Finite Element Software ◽  
Complete Filling ◽  
Alignment Structure ◽  
Filling Analysis ◽  
Cavity Filling ◽  
Deform 2D

The flow behavior of polymers was analyzed using a commercial finite element software, DEFORM-2D, for the replication of microstructures. An alignment structure for microassembly, a hemisphere-tipped post, was modeled to demonstrate the polymer flow in hot embossing. The mold filling with polymer was evaluated by the heights of molded posts. The results of simulation showed better replication fidelity of the post with the increase of the molding temperature and displacement of the mold insert. The complete filling of a mold cavity was achieved at the molding temperatures of 112.5, 125, 137.5, and 150°C when the displacements were 1.5, 2.0 and 2.5 mm. The model can be used to design the process parameters for the reliable replication of microstructures.

Finite Element Analysis for Reliable Replication of Alignment Structures in Micro Hot Embossing

2013 ◽  
Author(s):  
Juan A. Gomez ◽  
Glenn Conner ◽  
In-Hyouk Song ◽  
Yoo-Jae Kim ◽  
Byoung Hee You ◽  
...  
Keyword(s):  
Finite Element ◽  
Flow Behavior ◽  
High Fidelity ◽  
Element Analysis ◽  
Molding Temperature ◽  
Finite Element Software ◽  
Alignment Structure ◽  
Polymer Microstructures ◽  
Cavity Filling ◽  
Deform 2D

Numerical analysis to predict the flow behavior of polymers was conducted using commercial finite element software, DEFORM-2D. An alignment structure, a hemisphere-tipped post with an annular ring, was modeled to demonstrate the flow front of the polymer during molding. The cavity filling process was evaluated by measuring the heights of the molded posts and confirmed and validated by experimental data. Estimated and measured heights showed better replication accuracy with the increase of molding temperature and embossing force. Results exposed complete cavity filling at embossing forces of 600 and 900 N at a molding temperature of 137.5°C. The FEM prediction tool can be used to select the adequate process parameters for a high fidelity replication of polymer microstructures.

Finite Element Modeling of Polymer Flow during Hot Embossing with Different Mold Structures and Embossing Conditions

2011 ◽  
Vol 305 ◽  
pp. 144-148 ◽  
Author(s):  
Ting Zhang ◽  
Yong He ◽  
Jian Zhong Fu
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Simulation Study ◽  
Flow Behavior ◽  
Hot Embossing ◽  
Duty Ratio ◽  
Squeezing Flow ◽  
Polymer Flow ◽  
Common Substrate ◽  
Present Simulation

The geometric structures of the mold and embossing conditions can obviously influence the filling flows in the polymeric patterns. In this study, embossing stamp and substrate with different geometries are used to investigate the flow behavior under both isothermal and non-isothermal conditions. In general, for the stamp, small duty ratio cavity fills more sufficiently than large duty ratio cavity. With the same cavity duty ratio, inner cavity fills more quickly and sufficient than outer cavity. Compared to multiple cavities stamp, individual cavity fills more slowly, especially embossed with the stamp having small duty ratio cavity. Under non-isothermal embossing, the filling flow indicates a wall climbing flow and the polymer flow replaces the outer cavity better. Uncommon substrate provides a limitation of out-squeezing flow from polymer layers, so the polymer pick reaches the mold faster than common substrate like the flat. The present simulation study provides an analysis of the mold geometry especially the substrate geometry to govern filling flow and replication fidelity.

Mold filling analysis of an alignment structure in micro hot embossing

2014 ◽  
Vol 15 (6) ◽  
pp. 1197-1201 ◽  
Author(s):  
Juan A. Gomez ◽  
Glenn T. Conner ◽  
Du Hwan Chun ◽  
Yoo-Jae Kim ◽  
In-Hyouk Song ◽  
...  
Keyword(s):  
Hot Embossing ◽  
Mold Filling ◽  
Alignment Structure ◽  
Filling Analysis

Flow behavior of polymers during the roll-to-roll hot embossing process

2015 ◽  
Vol 25 (6) ◽  
pp. 065004 ◽  
Author(s):  
Yujun Deng ◽  
Peiyun Yi ◽  
Linfa Peng ◽  
Xinmin Lai ◽  
Zhongqin Lin
Keyword(s):  
Flow Behavior ◽  
Hot Embossing ◽  
Roll To Roll

scholarly journals Numerical Investigation of Tool Parameters Influence on the Interlock Forming During Flat Clinching Process

2021 ◽  
Author(s):  
Zhiyong Wang ◽  
Shanling Han ◽  
Zhiyong Li ◽  
Yong Li
Keyword(s):  
Finite Element ◽  
Numerical Model ◽  
Linear Relationship ◽  
Numerical Investigation ◽  
Vital Role ◽  
Blank Holder ◽  
Finite Element Software ◽  
Punch Radius ◽  
Deform 2D ◽  
The Relationship

Abstract Tool parameters play a vital role in the mechanical interlock formation during the flat clinching process, to understand the influence of tool parameters on the interlock formation, the finite element software DEFORM-2D was used to build the numerical model of the flat clinching process, and the numerical model was verified by the experiment. The influences of the punch radius, punch fillet radius, and blank holder radius on the interlock formation of the clinched joint were investigated using the numerical model. Then, the relationship between the punch radius and blank holder radius was studied. The results showed that the interlock gradually increases with the increase of the blank holder radius, after that, the interlock begins to decrease. To maximize the interlock, the punch radius and the blank holder radius should be increased simultaneously. It can be concluded that the blank holder radius and the punch radius should keep in a linear relationship when designing the geometric dimensions of the flat clinch tools, which can promote the application of flat clinching process in car body manufacturing.

scholarly journals Evaluation of the sinking processes for high-pressure-gas cylinders

2018 ◽  
Vol 185 ◽  
pp. 00007
Author(s):  
Heng-Sheng Lin ◽  
Chien-Yu Lee ◽  
Chia-Jung Lin ◽  
Ho-Chung Fu
Keyword(s):  
High Pressure ◽  
Load Level ◽  
Die Design ◽  
Alternative Scheme ◽  
Design Concepts ◽  
Finite Element Software ◽  
Stage Scheme ◽  
Deform 2D ◽  
Forming Defects ◽  
Gas Cylinders

High-pressure-gas cylinders are used in broad applications. Cracks on the open end would occur during the riveting stage. Such forming defects are caused by excessive hardening, although the open end has been annealed with induction heating prior to the sinking operation. Therefore, a proper design for the sinking dies is essential to the forming production of the HPG cylinders. In this paper, two die-design concepts were examined which included the conventional design for six-stage sinking with fixed die radius, and the economic design for five-stage sinking with incremental die radii. Finite element software DEFORM 2D was used to investigate the two sinking schemes. The effect of the sinking schemes on the sinking load, strain distribution, and lip thickness were analysed. The results show that the economic five-stage sinking with a large increment of die radii can provide less strain hardening as compared to other sinking schemes. Although the forming load level is acceptable and the change of lip thickness is insignificant, the production cost of the five-stage scheme is still high. A more economic measure by sinking with one-stage rotary swaging can provide an alternative scheme with advantages of simple die design and saving the lead for annealing.

Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology

2010 ◽  
Vol 2010 (1) ◽  
pp. 000192-000196 ◽  
Author(s):  
R.K. Trichur ◽  
M. Fowler ◽  
J.W. McCutcheon ◽  
M. Daily
Keyword(s):  
Polymeric Material ◽  
Spray Coating ◽  
Through Silicon Via ◽  
Polymer Flow ◽  
Complete Filling ◽  
Isolation Layer ◽  
Device Reliability ◽  
Device Integration ◽  
Key Driver ◽  
Initial Results

A key driver for 3-D device integration has been through-silicon via (TSV) technology that enables through-chip communication between vertically integrated layers. The TSVs typically have an electrical isolation using a dielectric layer between the silicon and the interconnect metal (e.g., copper). Recently, polymers have been proposed for use as the dielectric isolation layer, and polymers have been shown to increase device reliability by reducing “copper pumping,' where copper pops out from the TSV holes during thermal cycling. Traditionally, spinor spray-coating techniques have been used to fill TSVs with polymer material. However, using those techniques to fill and planarize very deep trenches (∼ 400 μm) and high-aspect-ratio structures has many limitations and usually results in voids, nonplanar surfaces, and lack of polymer flow to the requisite depths. Here, we present a novel process and a tool to completely fill and planarize deep trenches with a polymeric material. We use a combination of a traditional spin-coating process together with a physical planarization and fill process using the contact planarization tool to evacuate the trenches or vias on the wafer and then force the polymeric material inside the features. Using this process, we successfully filled and planarized trenches and vias 180 μm deep with 50-μm wide patterns as well as 400-μm deep trenches with ∼ 400-μm wide patterns. Initial results show complete filling and planarization of the material in the trenches without any voids.

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