Liquid Metal Based Miniaturized Chip-Cooling Device Driven by Electromagnetic Pump

2005 ◽  
Author(s):  
Jing Liu ◽  
Yi-Xin Zhou ◽  
Yong-Gang Lv ◽  
Teng Li
Keyword(s):  
Liquid Metal ◽  
Heat Dissipation ◽  
Fluid Transport ◽  
Liquid Gallium ◽  
Present System ◽  
High Heat Flux ◽  
Air Cooling ◽  
Cooling Device ◽  
Chip Cooling ◽  
Electromagnetic Pump

Conventional methods for thermal management of computer chips are approaching their practical application limit for recently emerging high integrity and high power processors. There is a strong demand to develop alternative approaches to accommodate to the trend of increasing industrial need. In this paper, a prototype of the newly proposed liquid metal based chip cooling device using electromagnetic pump as the flow driving force was fabricated and demonstrated. The technical routes to build up the new miniaturized system were illustrated. Being flowing based, completely electricity-controllable, and almost entirely made of metal, the new cooling device has a rather strong heat dissipation capability compared with that of the conventional forced liquid or air cooling approaches. A series of experiments successfully showed that the EM pump designed and fabricated in this paper is very flexible in driving the circulation flow of the liquid gallium, and the cooling device thus built up can significantly reduce the temperature of a simulating heating module. Further, promising strategies to optimize the present device were suggested and discussed. A series of new issues concerning the heat and fluid transport, and electromagnetic field effect of liquid metal in developing the micro/nano scale cooling devices were raised by interpreting the theoretical models established for characterizing the running behaviors of the present system. The liquid metal based cooling device would find exciting applications in the heat dissipation area where extremely high heat flux and very small geometry were seriously requested.

Recent Advancement on Liquid Metal Cooling for Thermal Management of Computer Chip

2010 ◽  
Author(s):  
Jing Liu ◽  
Yue-Guang Deng ◽  
Zhong-Shan Deng
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
New Technology ◽  
Air Cooling ◽  
Liquid Metal Coolant ◽  
Cooling Device ◽  
Chip Cooling ◽  
Cooling Method ◽  
Liquid Metal Cooling ◽  
Metal Coolant

Efficient cooling of a high performance computer chip has been an extremely important however becoming more and more tough issue. The recently invented liquid metal cooling method is expected to pave the way for high flux heat dissipation which is hard to tackle otherwise by many existing conventional cooling strategies. However, as a new thermal management method, its application also raised quite a few challenging fundamental and practical issues for solving. To illustrate the development of the new technology, this talk is dedicated to present an overview on the latest advancements made in the author’s lab in developing the new generation chip cooling device based on the liquid metal coolant with melting point around room temperature. The designing and optimization of the cooling device and component will be discussed. Several major barriers to prevent the new method from practical application such as erosion between liquid metal coolant and its substrate material will be outlined with good solutions clarified. Performance comparison between the new chip cooling method with commercially available products with highest quality such as air cooling, water cooling and heat pipe cooling devices were evaluated. Typical examples of using liquid metal cooling for the thermal management of a real PC or even super computer will be demonstrated. Further, miniaturizations on the prototype device by extending it as a MEMS cooling device or mini/micro channel liquid metal cooling device will also be explained. Along with the development of the hardware, some fundamental heat transfer issues in characterizing the liquid metal cooling device will be discussed through numerical or analytical model. Future challenging issues in pushing the new technology into large scale practices will be raised. From all the outputs obtained so far, it can be clearly seen that the new cooling strategy will find very promising and significant applications in a wide variety of engineering situations whenever thermal managements or heat transport are needed.

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Yueguang Deng ◽  
Jing Liu
Keyword(s):  
Heat Flux ◽  
Liquid Metal ◽  
Thermal Resistance ◽  
High Performance ◽  
Heat Dissipation ◽  
High Heat ◽  
High Heat Flux ◽  
Water Cooling ◽  
Cooling Device ◽  
Liquid Metal Cooling

Broad societal needs have focused attention on technologies that can effectively dissipate huge amount of heat from high power density electronic devices. Liquid metal cooling, which has been proposed in recent years, is fast emerging as a novel and promising solution to meet the requirements of high heat flux optoelectronic devices. In this paper, a design and implementation of a practical liquid metal cooling device for heat dissipation of high performance CPUs was demonstrated. GaInSn alloy with the melting point around 10°C was adopted as the coolant and a tower structure was implemented so that the lowest coolant amount was used. In order to better understand the design procedure and cooling capability, several crucial design principles and related fundamental theories were demonstrated and discussed. In the experimental study, two typical prototypes have been fabricated to evaluate the cooling performance of this liquid metal cooling device. The compared results with typical water cooling and commercially available heat pipes show that the present device could achieve excellent cooling capability. The thermal resistance could be as low as 0.13°C/W, which is competitive with most of the latest advanced CPU cooling devices in the market. Although the cost (about 70 dollars) is still relatively high, it could be significantly reduced to less than 30 dollars with the optimization of flow channel. Considering its advantages of low thermal resistance, capability to cope with extremely high heat flux, stability, durability, and energy saving characteristic when compared with heat pipe and water cooling, this liquid metal cooling device is quite practical for future application.

Design of a Self-Driven Liquid Metal Cooling Device for Heat Dissipation of Hot Chips in a Closed Cabinet

2013 ◽  
Vol 6 (1) ◽  
Author(s):  
Peipei Li ◽  
Jing Liu ◽  
Yixin Zhou
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
Horizontal Plane ◽  
Heat Dissipation ◽  
Hot Spot ◽  
Cooling Device ◽  
Large Power ◽  
Convective Thermal ◽  
The One ◽  
Liquid Metal Cooling

Tremendous attentions have been focused on thermal management to control the temperature of many advanced integrated electronic devices. The liquid metal cooling has recently been validated as a highly effective method to dissipate heat from hot chips. In this study, a practical design and implementation of a buoyancy effect driven liquid metal cooling device for the automatic thermal management of hot chips in a closed cabinet were demonstrated. The principles, especially the theory for convective thermal resistance of liquid metal cooling was provided for guiding optimization of the device. A model prototype was then fabricated and tested. Experiments were performed when two simulated hot chips in the closed cabinet worked at different heat loads and different angles with the horizontal plane. It was shown that for the one chip case, the cooling device could maintain the chip temperature to below 85.1 °C at the ambient temperature 20 °C when the heat load was about 122 W. The cooling performance of the device could achieve better when the angle between the cabinet and the horizontal plane varied from 0 °C to 90 °C. With two chips working simultaneously, both chips had close temperature and hot spot did not appear easily when subject to large power, which will help reduce thermal stress and enhance reliability of the system. The practical value of the self-driven liquid metal cooling device is rather evident. Given its reliability, simplicity, and efficiency, such device can possibly be used for heat dissipation of multichip in closed space in the future.

Liquid Metal Based Mini/Micro Channel Cooling Device

2009 ◽  
Author(s):  
Yue-Guang Deng ◽  
Jing Liu ◽  
Yi-Xin Zhou
Keyword(s):  
Heat Transfer ◽  
Liquid Metal ◽  
Heat Dissipation ◽  
Convective Heat Transfer Coefficient ◽  
Volume Flow ◽  
Micro Channel ◽  
Cooling Device ◽  
Heat Transfer Theory ◽  
Cooling Devices ◽  
Cooling Effects

Effective heat dissipation is of great importance in many engineering fields. In this paper, we investigated a newly emerging method to significantly improve the cooling capability of micro channel devices, through implementing liquid metal with low melting point as the powerful coolant. A series of experiments with different working fluids and volume flow were performed, and the different cooling effects between liquid metal and water were compared. In order to better evaluate the cooling capability of liquid metal based micro channel cooling device, the hydrodynamic and heat transfer theory involved was discussed. The results indicated that, when the system operated in a relatively high velocity, micro channel cooling devices with liquid metal as coolant could produce higher convective heat transfer coefficient compared to those with traditional cooling fluids. And under the same pump power, not only the thermal resistance of liquid metal based micro channel could be much smaller, but also the coolant volume flow could be decreased. What is more, the liquid metal can be driven by a highly efficient electromagnetic pump without any noise. Therefore, more compact and energy-saving micro channel cooling devices with better cooling capability may come into reality. This new method is rather practical, and is expected to be important for realizing an extremely high heat dissipation rate.

Simulation Study on a New Type of Cooling Device Used in Heat Dissipation of Server

2012 ◽  
Vol 241-244 ◽  
pp. 1306-1309
Author(s):  
Chao Guo ◽  
Fang Wang ◽  
Yan Qu ◽  
Na Jin
Keyword(s):  
Mathematical Model ◽  
Thermal Analysis ◽  
Temperature Distribution ◽  
Forced Convection ◽  
Heat Dissipation ◽  
Evaporative Cooling ◽  
Air Cooling ◽  
Cooling Device ◽  
Object A ◽  
New Type

A new type of cooling device used for server is designed in this paper. A server is used as a research object. A mathematical model of thermal analysis is established and a temperature distribution is simulated for this case. Then simulated heat dissipation effects of air cooling and evaporative cooling are compared to analyze the feasibility of the plan of forced convection evaporative cooling. The results show that the temperature distribution obtained in the case is more uniform and the temperature of the CPU is more stable when cooled by forced convection evaporative cooling.

Experimental Study on a New Type of Cooling Device Used in High Heat Dissipation of CPU

2012 ◽  
Vol 241-244 ◽  
pp. 156-159
Author(s):  
Meng Liu ◽  
Fang Wang ◽  
Lei Lou ◽  
Sheng Liang Dai ◽  
Wei Feng Da
Keyword(s):  
Experimental Study ◽  
Temperature Distribution ◽  
Heat Dissipation ◽  
Evaporative Cooling ◽  
High Heat ◽  
Air Cooling ◽  
Cooling Device ◽  
New Type ◽  
The Stability ◽  
Temperature Test

A new type of cooling device used for server is designed in this paper. A small type of server is taken as a research object to compare the effect of air cooling and evaporative cooling under different CPU power consumption. The effects of this research are discussed on evaporative cooling for the stability of the CPU heat dissipation and the cooler on other components. The results show that the temperature distribution of the server’s case is more uniform and the temperature test of the CPU is more stable when it is cooled by evaporative cooling.

Heat Spreader Based on Room-Temperature Liquid Metal

2012 ◽  
Vol 4 (2) ◽  
Author(s):  
Yueguang Deng ◽  
Jing Liu
Keyword(s):  
Liquid Metal ◽  
High Performance ◽  
Room Temperature ◽  
High Reliability ◽  
High Heat ◽  
High Heat Flux ◽  
Heat Spreader ◽  
Electromagnetic Pump ◽  
Temperature Liquid ◽  
Heat Spreading

This study reports a high-performance heat spreader based on room-temperature liquid metal coolant. Conceptual cooling experiments show that liquid metal heat spreader owns particularly excellent heat spreading performance. In order to evaluate the driving features of liquid metal, a miniaturized electromagnetic pump with high reliability and low power consumption was fabricated and tested. Extreme experiments were performed and showed that liquid metal heat spreader could overwhelm all the latest typical advanced spreading technologies and serve as an ultimate heat spreading solution under extremely high heat flux density condition.

Numerical Evaluation on the Heat Dissipation Capability of Liquid Metal Based Chip Cooling Device

2005 ◽  
Author(s):  
Zhong-Shan Deng ◽  
Jing Liu
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
Heat Dissipation ◽  
Cooling System ◽  
Three Dimensional ◽  
Heat Transfer Process ◽  
Liquid Cooling ◽  
Chip Cooling ◽  
Cooling Enhancement ◽  
Liquid Cooling System

With the sharp improvement in computational speed of CPU, thermal management becomes a major concern in the current microelectronic industry. Conventional thermal management methods for CPU chip cooling are approaching their limit for quite a few newly emerging high integrity and high power processors. Therefore, liquid metal based chip cooling method has been proposed to accommodate to this request. In order to better understand the mechanisms of the cooling enhancement by the liquid metal based cooling technique, the three-dimensional heat transfer process thus involved in the cooling chip is numerically simulated in this study. A series of calculations with different flow rates and thermal parameters are performed. The cooling capability of the liquid metal is also compared with that of the water-cooling system. The results indicate that the liquid metal has powerful cooling capability, which is much better than that of the conventional liquid-cooling system.

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