Design of a Self-Driven Liquid Metal Cooling Device for Heat Dissipation of Hot Chips in a Closed Cabinet

2013 ◽  
Vol 6 (1) ◽  
Author(s):  
Peipei Li ◽  
Jing Liu ◽  
Yixin Zhou
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
Horizontal Plane ◽  
Heat Dissipation ◽  
Hot Spot ◽  
Cooling Device ◽  
Large Power ◽  
Convective Thermal ◽  
The One ◽  
Liquid Metal Cooling

Tremendous attentions have been focused on thermal management to control the temperature of many advanced integrated electronic devices. The liquid metal cooling has recently been validated as a highly effective method to dissipate heat from hot chips. In this study, a practical design and implementation of a buoyancy effect driven liquid metal cooling device for the automatic thermal management of hot chips in a closed cabinet were demonstrated. The principles, especially the theory for convective thermal resistance of liquid metal cooling was provided for guiding optimization of the device. A model prototype was then fabricated and tested. Experiments were performed when two simulated hot chips in the closed cabinet worked at different heat loads and different angles with the horizontal plane. It was shown that for the one chip case, the cooling device could maintain the chip temperature to below 85.1 °C at the ambient temperature 20 °C when the heat load was about 122 W. The cooling performance of the device could achieve better when the angle between the cabinet and the horizontal plane varied from 0 °C to 90 °C. With two chips working simultaneously, both chips had close temperature and hot spot did not appear easily when subject to large power, which will help reduce thermal stress and enhance reliability of the system. The practical value of the self-driven liquid metal cooling device is rather evident. Given its reliability, simplicity, and efficiency, such device can possibly be used for heat dissipation of multichip in closed space in the future.

Recent Advancement on Liquid Metal Cooling for Thermal Management of Computer Chip

2010 ◽  
Author(s):  
Jing Liu ◽  
Yue-Guang Deng ◽  
Zhong-Shan Deng
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
New Technology ◽  
Air Cooling ◽  
Liquid Metal Coolant ◽  
Cooling Device ◽  
Chip Cooling ◽  
Cooling Method ◽  
Liquid Metal Cooling ◽  
Metal Coolant

Efficient cooling of a high performance computer chip has been an extremely important however becoming more and more tough issue. The recently invented liquid metal cooling method is expected to pave the way for high flux heat dissipation which is hard to tackle otherwise by many existing conventional cooling strategies. However, as a new thermal management method, its application also raised quite a few challenging fundamental and practical issues for solving. To illustrate the development of the new technology, this talk is dedicated to present an overview on the latest advancements made in the author’s lab in developing the new generation chip cooling device based on the liquid metal coolant with melting point around room temperature. The designing and optimization of the cooling device and component will be discussed. Several major barriers to prevent the new method from practical application such as erosion between liquid metal coolant and its substrate material will be outlined with good solutions clarified. Performance comparison between the new chip cooling method with commercially available products with highest quality such as air cooling, water cooling and heat pipe cooling devices were evaluated. Typical examples of using liquid metal cooling for the thermal management of a real PC or even super computer will be demonstrated. Further, miniaturizations on the prototype device by extending it as a MEMS cooling device or mini/micro channel liquid metal cooling device will also be explained. Along with the development of the hardware, some fundamental heat transfer issues in characterizing the liquid metal cooling device will be discussed through numerical or analytical model. Future challenging issues in pushing the new technology into large scale practices will be raised. From all the outputs obtained so far, it can be clearly seen that the new cooling strategy will find very promising and significant applications in a wide variety of engineering situations whenever thermal managements or heat transport are needed.

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Yueguang Deng ◽  
Jing Liu
Keyword(s):  
Heat Flux ◽  
Liquid Metal ◽  
Thermal Resistance ◽  
High Performance ◽  
Heat Dissipation ◽  
High Heat ◽  
High Heat Flux ◽  
Water Cooling ◽  
Cooling Device ◽  
Liquid Metal Cooling

Broad societal needs have focused attention on technologies that can effectively dissipate huge amount of heat from high power density electronic devices. Liquid metal cooling, which has been proposed in recent years, is fast emerging as a novel and promising solution to meet the requirements of high heat flux optoelectronic devices. In this paper, a design and implementation of a practical liquid metal cooling device for heat dissipation of high performance CPUs was demonstrated. GaInSn alloy with the melting point around 10°C was adopted as the coolant and a tower structure was implemented so that the lowest coolant amount was used. In order to better understand the design procedure and cooling capability, several crucial design principles and related fundamental theories were demonstrated and discussed. In the experimental study, two typical prototypes have been fabricated to evaluate the cooling performance of this liquid metal cooling device. The compared results with typical water cooling and commercially available heat pipes show that the present device could achieve excellent cooling capability. The thermal resistance could be as low as 0.13°C/W, which is competitive with most of the latest advanced CPU cooling devices in the market. Although the cost (about 70 dollars) is still relatively high, it could be significantly reduced to less than 30 dollars with the optimization of flow channel. Considering its advantages of low thermal resistance, capability to cope with extremely high heat flux, stability, durability, and energy saving characteristic when compared with heat pipe and water cooling, this liquid metal cooling device is quite practical for future application.

Heat dissipation system based on electromagnetic driven rotational flow of liquid metal coolant

2021 ◽  
pp. 1-14
Author(s):  
Lei Wang ◽  
Xudong Zhang ◽  
Dr. Jing Liu ◽  
Yixin Zhou
Keyword(s):  
Liquid Metal ◽  
Thermal Resistance ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Cooling System ◽  
Electric Heater ◽  
Power Relationship ◽  
Rotational Flow ◽  
Large Power ◽  
Dissipation System

Abstract Liquid metal owns the highest thermal conductivity among all the currently available fluid materials. This property enables it to be a powerful coolant for the thermal management of large power device or high flux chip. In this paper, a high-efficiency heat dissipation system based on the electromagnetic driven rotational flow of liquid metal was demonstrated. The velocity distribution of the liquid metal was theoretically analyzed and numerically simulated. The results showed that the velocity was distributed unevenly along longitudinal section and the maximum velocity appears near the anode. On the temperature distribution profile of the heat dissipation system, the temperature on the electric heater side was much higher than the other regions and the role of the rotated liquid metal was to homogenize the temperature of the system. In addition, the thermal resistance model of the experimental device was established, and several relationships such as thermal resistance-power curve were experimentally measured. The heating power could be determined from the temperature-power relationship graph once the maximum control temperature was given. The heat dissipation method introduced in the paper provides a novel way for fabricating compact chip cooling system.

Numerical Evaluation on the Cooling Capability of MEMS Based Liquid Metal Cooling Device Used in Harsh Environment

2007 ◽  
Author(s):  
Zhong-Shan Deng ◽  
Jing Liu ◽  
Yi-Xin Zhou
Keyword(s):  
Thermal Management ◽  
Numerical Evaluation ◽  
High Capacity ◽  
Small Scale ◽  
Harsh Environment ◽  
Electronic Components ◽  
Cooling Device ◽  
Sensors And Actuators ◽  
Micro Systems ◽  
Liquid Metal Cooling

The thermal management of the increasing fast chips has been a major concern in packaging of micro/nano systems [1]. These chips are squeezing into tighter and tighter spaces with no enough places for heat to dissipate. It is expected that heat flux levels in excess of 100 W/cm2 for commercial electronics and over 1000 W/cm2 for selected military high power electronics will soon become a realistic challenge to overcome. Meanwhile, high-capacity cooling options remain limited for many small-scale applications such as micro-systems, sensors and actuators, and micro/nano electronic components.

Art and Science Towards Noiseless Driving of Liquid Metal for Advanced Thermal Management of High Heat Flux Device

2015 ◽  
Author(s):  
Jing Liu ◽  
Zhong-Shan Deng ◽  
Zhi-Zhu He
Keyword(s):  
Heat Flux ◽  
Liquid Metal ◽  
Thermal Management ◽  
High Heat ◽  
Low Noise ◽  
High Heat Flux ◽  
Art And Science ◽  
Typical Application ◽  
Liquid Metal Cooling ◽  
Metal Coolant

The room temperature liquid metal cooling is quickly emerging as a powerful way for the thermal management in many advanced high heat flux devices, spanning from electronics, optoelectronics, battery, to power system etc. Except for its pretty high conductivity that a metal coolant could offer, the unique merit lying behind this new generation cooling strategy is its drivability of the highly conductive coolant through the electromagnetic effect where no moving elements are involved and thus only very few energy consumption is needed. In addition, even waste heat could be strong enough to generate applicable electricity for such flow driving purpose. More directly, the temperature gradient intrinsically generated between the heat source and the sink has also been managed to drive the flow of the coolant and realize an automatic practical enough cooling in some situations. All these practices lead to a totally noiseless pumping of the heat delivery and a compact and reliable cooling modular can thus be possible. Starting from this basic point, we are dedicated here to present an overview on the art and science in developing the technical strategies for a smart driving of the liquid metal cooling of the target devices. Designing philosophy for an innovated thermal management will be discussed. Particularly, electromagnetic pumping, waste thermoelectricity driving, thermosyphon flow effect, etc. will be comparatively evaluated with each of the working performances interpreted. Power consumption rate and efficiency will be quantitatively digested. Typical application examples in the cooling of a series of device areas will be illustrated. Further improvement on the cooling solution along this category will be suggested. Challenging issues in pushing the new technology into large scale utilization will be raised. It is expected that such silent self-driving of the liquid metal coolant will find unique and important values in a wide variety of thermal management areas where reliability, compactness, low noise and energy saving are urgently requested.

Graphene heat dissipation film for thermal management of hot spot in electronic device

2016 ◽  
Vol 27 (7) ◽  
pp. 7715-7721 ◽  
Author(s):  
Xin Li ◽  
Ming Fang ◽  
Wen Wang ◽  
Shixi Guo ◽  
Weihua Liu ◽  
...  
Keyword(s):  
Thermal Management ◽  
Heat Dissipation ◽  
Electronic Device ◽  
Hot Spot

Application of Micro-Tube Water-Cooling Device for the Improvement of Heat Management in Mixed White Light Emitting Diode Modules

2011 ◽  
Vol 308-310 ◽  
pp. 2422-2427 ◽  
Author(s):  
Maw Tyan Sheen ◽  
Ming Der Jean ◽  
Yu Tsun Lai
Keyword(s):  
Thermal Management ◽  
White Light ◽  
Heat Dissipation ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Thermal Dissipation ◽  
Water Cooling ◽  
Cooling Device ◽  
Heat Management ◽  
Light Emitting

This paper introduces a module using the RGB-based LED design to improve the thermal management of a mixied white light LED and describes a system for heat dissipation in illuminated, high-power LED arrays. Mixed light LEDs can be produced by combining appropriate amounts of light from the red, green and blue LEDs in an array. A LED cooling system, using a micro- tube water-cooling device, was fabricated. Recycling water in the system, gave more efficient convection and the heat created by the LEDs was easily removed, in the experiments. It was shown that micro-tube water-cooling systems rendered an improvement in thermal management that effectively decreases the thermal resistance and provides very good thermal dissipation. Furthermore, the results of experiment and simulation demonstrated that a micro-tube water-cooling system is very effective in heat dissipation in LEDs and the fabrication of practical micro-water tube cooling devices for mixing light LEDs was feasible and useful

Liquid Metal Based Mini/Micro Channel Cooling Device

2009 ◽  
Author(s):  
Yue-Guang Deng ◽  
Jing Liu ◽  
Yi-Xin Zhou
Keyword(s):  
Heat Transfer ◽  
Liquid Metal ◽  
Heat Dissipation ◽  
Convective Heat Transfer Coefficient ◽  
Volume Flow ◽  
Micro Channel ◽  
Cooling Device ◽  
Heat Transfer Theory ◽  
Cooling Devices ◽  
Cooling Effects

Effective heat dissipation is of great importance in many engineering fields. In this paper, we investigated a newly emerging method to significantly improve the cooling capability of micro channel devices, through implementing liquid metal with low melting point as the powerful coolant. A series of experiments with different working fluids and volume flow were performed, and the different cooling effects between liquid metal and water were compared. In order to better evaluate the cooling capability of liquid metal based micro channel cooling device, the hydrodynamic and heat transfer theory involved was discussed. The results indicated that, when the system operated in a relatively high velocity, micro channel cooling devices with liquid metal as coolant could produce higher convective heat transfer coefficient compared to those with traditional cooling fluids. And under the same pump power, not only the thermal resistance of liquid metal based micro channel could be much smaller, but also the coolant volume flow could be decreased. What is more, the liquid metal can be driven by a highly efficient electromagnetic pump without any noise. Therefore, more compact and energy-saving micro channel cooling devices with better cooling capability may come into reality. This new method is rather practical, and is expected to be important for realizing an extremely high heat dissipation rate.

Liquid Metal Based Miniaturized Chip-Cooling Device Driven by Electromagnetic Pump

2005 ◽  
Author(s):  
Jing Liu ◽  
Yi-Xin Zhou ◽  
Yong-Gang Lv ◽  
Teng Li
Keyword(s):  
Liquid Metal ◽  
Heat Dissipation ◽  
Fluid Transport ◽  
Liquid Gallium ◽  
Present System ◽  
High Heat Flux ◽  
Air Cooling ◽  
Cooling Device ◽  
Chip Cooling ◽  
Electromagnetic Pump

Conventional methods for thermal management of computer chips are approaching their practical application limit for recently emerging high integrity and high power processors. There is a strong demand to develop alternative approaches to accommodate to the trend of increasing industrial need. In this paper, a prototype of the newly proposed liquid metal based chip cooling device using electromagnetic pump as the flow driving force was fabricated and demonstrated. The technical routes to build up the new miniaturized system were illustrated. Being flowing based, completely electricity-controllable, and almost entirely made of metal, the new cooling device has a rather strong heat dissipation capability compared with that of the conventional forced liquid or air cooling approaches. A series of experiments successfully showed that the EM pump designed and fabricated in this paper is very flexible in driving the circulation flow of the liquid gallium, and the cooling device thus built up can significantly reduce the temperature of a simulating heating module. Further, promising strategies to optimize the present device were suggested and discussed. A series of new issues concerning the heat and fluid transport, and electromagnetic field effect of liquid metal in developing the micro/nano scale cooling devices were raised by interpreting the theoretical models established for characterizing the running behaviors of the present system. The liquid metal based cooling device would find exciting applications in the heat dissipation area where extremely high heat flux and very small geometry were seriously requested.

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