Microfabrication and Laser Diagnosis of Pressure-Swirl Atomizers

2003 ◽  
Author(s):  
Ker-Jer Huang ◽  
Alex C. Chen ◽  
Jing-Tang Yang
Keyword(s):  
Injection Molding ◽  
Plasma Etching ◽  
Design Parameters ◽  
Channel Diameter ◽  
X Ray ◽  
Swirl Chamber ◽  
Phase Doppler Particle Analyzer ◽  
Pressure Swirl ◽  
Discharge Orifice ◽  
Exit Orifice

In this work we used deep-molding manufacture of three kinds to fabricate micro pressure-swirl atomizers to promote their performance, and a Phase Doppler Particle Analyzer (PDPA) to measure the characteristic distributions of the spray flow field of these atomizers. The deep-molding techniques were X-ray LIGA process, ICP-LIGA process (inductive coupling plasma etching), and injection molding LIGA process. Parameters of atomizers examined here include configuration of flow channel, diameter of exit orifice, the ratio of diameters of swirl chamber and discharge orifice, and the thickness of atomizer. Experimental results showed that the manufacturing process combining injection molding with electroplating had large yields and that the technique is highly reliable; enable manufacture of an atomizer at small cost and great quality. Moreover, these microatomizers are assembled well with other components and be readily applied. The results of PDPA diagnosis further revealed that the spray features are related with the design parameters of atomizer dimensions.

Factors Influencing the Effective Spray Cone Angle of Pressure-Swirl Atomizers

1992 ◽  
Vol 114 (1) ◽  
pp. 97-103 ◽  
Author(s):  
S. K. Chen ◽  
A. H. Lefebvre ◽  
J. Rollbuhler
Keyword(s):  
Cone Angle ◽  
Injection Pressure ◽  
Diameter Ratio ◽  
Liquid Viscosity ◽  
Spray Cone Angle ◽  
Spray Cone ◽  
Swirl Chamber ◽  
Factors Influencing ◽  
Pressure Swirl ◽  
Discharge Orifice

The spray cone angles produced by several simplex pressure-swirl nozzles are examined using three liquids whose viscosities range from 0.001 to 0.012 kg/ms (1 to 12 cp). Measurements of both the visible spray cone angle and the effective spray cone angle are carried out over wide ranges of injection pressure and for five different values of the discharge orifice length/diameter ratio. The influence of the number of swirl chamber feed slots on spray cone angle is also examined. The results show that the spray cone angle widens with increase in injection pressure but is reduced by increases in liquid viscosity and/or discharge orifice length/diameter ratio. Variation in the number of swirl chamber feed slots between one and three has little effect on the effective spray cone angle.

A Numerical Study of the Internal Flow in a Pressure Swirl Atomizer

2017 ◽  
Author(s):  
Weijia Qian ◽  
Xin Hui ◽  
Chi Zhang ◽  
Quanhong Xu ◽  
Yuzhen Lin ◽  
...  
Keyword(s):  
Internal Flow ◽  
Diameter Ratio ◽  
Geometric Parameters ◽  
Swirl Chamber ◽  
Discharge Parameters ◽  
Swirl Atomizer ◽  
Pressure Swirl ◽  
Pressure Swirl Atomizer ◽  
Exit Orifice ◽  
Length To Diameter Ratio

The internal flow and discharge parameters of a pressure swirl atomizer (PSA) are numerically investigated using a coupled Level-Set (LS)/Volume-of-Fluid (VOF) solver that combines the advantages of LS and algebraic VOF methods by maintaining the mass conservation and the interface sharpness simultaneously. Internal flow velocity profile and discharge parameters including discharge coefficient, film thickness, and spray cone angle are compared between simulation results and the experimental data that are available in the literature. A parametrical study is also performed to investigate the effects of the key geometric parameters of the PSA configuration on the discharge parameters. The geometric parameters studied are the length to diameter ratio of the swirl chamber, the length to diameter ratio of the exit orifice, the swirl chamber diameter to exit orifice diameter ratio, and the swirl chamber convergence angle.

Factors Influencing the Circumferential Liquid Distribution From Pressure-Swirl Atomizers

1993 ◽  
Vol 115 (3) ◽  
pp. 447-452 ◽  
Author(s):  
S. K. Chen ◽  
A. H. Lefebvre ◽  
J. Rollbuhler
Keyword(s):  
Beneficial Effect ◽  
Injection Pressure ◽  
Diameter Ratio ◽  
Liquid Viscosity ◽  
Flow Number ◽  
Liquid Distribution ◽  
Swirl Chamber ◽  
Factors Influencing ◽  
Pressure Swirl ◽  
Discharge Orifice

Measurements of circumferential liquid distribution are carried out over ranges of injection pressure from 0.34 to 1.72 MPa (50 to 250 psi) using five different simplex nozzles to achieve variations in the discharge orifice length/diameter ratio from 0.5 to 4.0. Two additional simplex nozzles of the same flow number are also examined in order to ascertain the effect of variations in the number of swirl chamber feed slots on circumferential liquid distribution. Mixtures of water and glycerine are used to provide a twelve to one variation in liquid viscosity. The results obtained show that spray uniformity improves markedly at higher injection pressures. Increase in liquid viscosity also has a beneficial effect on spray uniformity. The most uniform circumferential liquid distributions are obtained with nozzles having a discharge orifice length/diameter ratio of between 1 1/2 and 2.

scholarly journals Optoelectronic properties of highly porous silver oxide thin film

2021 ◽  
Vol 3 (1) ◽  
Author(s):  
Ahmad Al-Sarraj ◽  
Khaled M. Saoud ◽  
Abdelaziz Elmel ◽  
Said Mansour ◽  
Yousef Haik
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Electron Microscope ◽  
Plasma Etching ◽  
Silver Oxide ◽  
Oxidation Time ◽  
Oxide Thin Film ◽  
X Ray ◽  
Porous Silver ◽  
Highly Porous

Abstract In this paper, we report oxidation time effect on highly porous silver oxide nanowires thin films fabricated using ultrasonic spray pyrolysis and oxygen plasma etching method. The NW’s morphological, electrical, and optical properties were investigated under different plasma etching periods and the number of deposition cycles. The increase of plasma etching and oxidation time increases the surface roughness of the Ag NWs until it fused to form a porous thin film of silver oxide. AgNWs based thin films were characterized using X-ray diffraction, scanning electron microscope, transmission electron microscope, X-ray photoemission spectroscopy, and UV–Vis spectroscopy techniques. The obtained results indicate the formation of mixed mesoporous Ag2O and AgO NW thin films. The Ag2O phase of silver oxide appears after 300 s of oxidation under the same conditions, while the optical transparency of the thin film decreases as plasma etching time increases. The sheet resistance of the final film is influenced by the oxidation time and the plasma application periodicity. Graphic abstract

scholarly journals Binary Amplitude Reflection Gratings for X-ray Shearing and Hartmann Wavefront Sensors

Sensors ◽  
2021 ◽  
Vol 21 (2) ◽  
pp. 536
Author(s):  
Kenneth A. Goldberg ◽  
Antoine Wojdyla ◽  
Diane Bryant
Keyword(s):  
Operating Conditions ◽  
Design Parameters ◽  
Wavefront Aberration ◽  
Light Sources ◽  
Wavefront Sensors ◽  
X Ray ◽  
New Class ◽  
Coherent Wave ◽  
Reflection Gratings ◽  
Dynamic Operating

New, high-coherent-flux X-ray beamlines at synchrotron and free-electron laser light sources rely on wavefront sensors to achieve and maintain optimal alignment under dynamic operating conditions. This includes feedback to adaptive X-ray optics. We describe the design and modeling of a new class of binary-amplitude reflective gratings for shearing interferometry and Hartmann wavefront sensing. Compact arrays of deeply etched gratings illuminated at glancing incidence can withstand higher power densities than transmission membranes and can be designed to operate across a broad range of photon energies with a fixed grating-to-detector distance. Coherent wave-propagation is used to study the energy bandwidth of individual elements in an array and to set the design parameters. We observe that shearing operates well over a ±10% bandwidth, while Hartmann can be extended to ±30% or more, in our configuration. We apply this methodology to the design of a wavefront sensor for a soft X-ray beamline operating from 230 eV to 1400 eV and model shearing and Hartmann tests in the presence of varying wavefront aberration types and magnitudes.

Optimization and evaluation of metal injection molding by using X-ray tomography

2015 ◽  
Vol 104 ◽  
pp. 107-115 ◽  
Author(s):  
Shidi Yang ◽  
Ruijie Zhang ◽  
Xuanhui Qu
Keyword(s):  
Injection Molding ◽  
Metal Injection Molding ◽  
X Ray

scholarly journals Structural and Fluorine Plasma Etching Behavior of Sputter-Deposition Yttrium Fluoride Film

Nanomaterials ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 936 ◽  
Author(s):  
Wei-Kai Wang ◽  
Yu-Xiu Lin ◽  
Yi-Jie Xu
Keyword(s):  
Plasma Etching ◽  
Photoelectron Spectroscopy ◽  
Heating Temperature ◽  
Working Pressure ◽  
Etching Depth ◽  
Yttrium Fluoride ◽  
X Ray ◽  
Substrate Heating ◽  
Etching Behavior ◽  
Etched Surface

Yttrium fluoride (YF3) films were grown on sapphire substrate by a radio frequency magnetron using a commercial ceramic target in a vacuum chamber. The structure, composition, and plasma etching behavior of the films were systematically investigated. The YF3 film was deposited at a working pressure of 5 mTorr and an RF power of 150 W. The substrate-heating temperature was increased from 400 to 700 °C in increments of 100 °C. High-resolution transmission electron microscopy (HRTEM) and X-ray diffraction results confirmed an orthorhombic YF3 structure was obtained at a substrate temperature of 700 °C for 2 h. X-ray photoelectron spectroscopy revealed a strongly fluorinated bond (Y–F bond) on the etched surface of the YF3 films. HRTEM analysis also revealed that the YF3 films became yttrium-oxyfluorinated after exposure to fluorocarbon plasma. The etching depth was three times lower on YF3 film than on Al2O3 plate. These results showed that the YF3 films have excellent erosion resistance properties compared to Al2O3 plates.

Segregation of Cu on Etched and Non-Etched Al(Cu) Surface

1998 ◽  
Vol 516 ◽  
Author(s):  
Hua Li ◽  
Karen Maex ◽  
Bert Brijs ◽  
Thierry Conard ◽  
Wilfried Vandervorst ◽  
...  
Keyword(s):  
Plasma Etching ◽  
Photoelectron Spectroscopy ◽  
Rutherford Backscattering Spectrometry ◽  
Native Oxide ◽  
Interface Area ◽  
X Ray ◽  
Origin And Evolution ◽  
Significant Enrichment ◽  
Segregation Phenomenon ◽  
Al Oxide

AbstractIn this paper, we have studied the segregation phenomenon of Cu on the surfaces of patterned lines, dry-etched films and non-etched films, by using X-ray photoelectron spectroscopy and lower energy Rutherford Backscattering Spectrometry. Significant enrichment of Cu is found on the sidewall of the lines. Annealing at 350°C and above cause the disappearance of this enrichment. Origin and evolution of this Cu enrichment have been investigated on films taken out from different steps of the etching process. It has been found that most of the Cu products induced by the plasma etching are CuCl and CuCl2 and they are removed mostly from the top Al oxide layer by the strip process. On the interface area between Al and the native oxide, considerable quantities of etched induced Cu are retained. This Cu is identified to be mainly metallic Cu. Different from the mechanism explained above, thermal annealing can also cause Cu segregation. We have found that Cu atoms diffuse into the native Al oxide where they form Cu2O.

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