Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials

2002 ◽  
Author(s):  
Shashikant Hegde ◽  
Raghuram V. Pucha ◽  
Suresh K. Sitaraman
Keyword(s):  
Flip Chip ◽  
Failure Modes ◽  
Element Model ◽  
Dielectric Materials ◽  
High Density ◽  
Operating Conditions ◽  
High Modulus ◽  
Interlayer Dielectric ◽  
Board Material ◽  
Base Substrate

FR4 has been extensively used as a board material due to its cost effectiveness and overall performance. For high-density wiring (HDW) substrates with microvias and with embedded capacitors, inductors, resistors, RF and optoelectronic waveguides in a single board, there is a need for alternative base substrates to meet the stringent warpage requirements during fabrication. Typically, these base substrate materials should have high modulus, good planarity, in addition to having a CTE that is close to that of silicon so that the flip-chips can be directly attached to the substrate, eliminating the need for an underfill. Although low-CTE, high modulus base substrate materials can eliminate the need for underfill as well as can result in less warpage during fabrication, they can potentially cause delamination and cracking in the interlayer dielectric. This is due to the high CTE mismatch between the base substrate and typical polymer dielectric. This paper aims to explore a combination of base substrate materials and interlayer dielectric materials such that warpage is minimal, dielectric will not crack or delaminate, and flip-chip solder joints, assembled without an underfill, will not crack prematurely during qualification regimes and operating conditions. A non-liner finite element model with Design-of-Simulations approach is used in arriving at optimized thermo-mechanical properties for the base-substrate and dielectric materials to enhance the overall reliability of the integrated substrate with flip chip assembly. The results from the models have been compared with experimental data and a discussion is presented on the various failure modes.

Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards

2003 ◽  
Author(s):  
Saketh Mahalingam ◽  
Shashikant Hegde ◽  
Gnyaneshwar Ramakrishna ◽  
Raghuram V. Pucha ◽  
Suresh K. Sitaraman
Keyword(s):  
Computational Algorithm ◽  
Optimization Technique ◽  
Simulation Models ◽  
Dielectric Materials ◽  
Interaction Effects ◽  
High Density ◽  
Interlayer Dielectric ◽  
Gradient Based ◽  
Material Interaction ◽  
Base Substrate

This paper studies several base substrate materials and interlayer dielectric materials for High Density Interconnect (HDI) boards, addressing reliability issues such as warpage, dielectric cracking and microvia cracking. Design of simulation models with an optimization technique is developed to study material interaction effects on the HDI reliability. A plastic strain gradient-based computational algorithm is developed to study the thermo-mechanical deformation of fine-feature microvia structures.

Combined Manufacture Methods for High Density LTCC Substrates: Thick Film Screen Printing, Ink Jet, Postfiring Thin Film Processes, and Laser-Drilled Fine Vias

2009 ◽  
Vol 6 (1) ◽  
pp. 6-12 ◽  
Author(s):  
Arne Albertsen ◽  
Koji Koiwai ◽  
Kyoji Kobayashi ◽  
Tomonori Oguchi ◽  
Katsumi Aruga
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Screen Printing ◽  
Flip Chip ◽  
High Density ◽  
Uv Laser ◽  
Fine Pitch ◽  
Ink Jet ◽  
Printing Ink ◽  
Base Substrate

This paper highlights the possible combination of technologies such as thick film screen printing, ink jet, and post-firing thin film processes in conjunction with laser-drilled fine vias to produce high-density, miniaturized LTCC substrates. To obtain the silver pattern on the inner layers, both conventional thick film printing and ink jet printing (using nano silver particle dispersed ink) were applied on the ceramic green sheets. The ink jet process made it possible to metallize fine lines with line/space = 30/30 μm. For interlayer connections, fine vias of 30 μm in diameter formed by UV laser were used. Then these sheets were stacked on top of each other and fired to obtain a base substrate. On this base substrate, fine copper patterns for flip chip mounting were formed by a thin film process. The surface finish consisted of a nickel passivation and a gold layer deposited by electroless plating. The combination of the three patterning processes for conducting traces and UV laser drilling of fine vias make it appear possible to realize fine pitch LTCC, for example, for flip chip device mounting.

Failure Prediction of Flip Chip Packages Using Finite Element Technique

2002 ◽  
Author(s):  
Abm Hasan ◽  
H. Mahfuz ◽  
M. Saha ◽  
S. Jeelani
Keyword(s):  
Finite Element ◽  
Flip Chip ◽  
Thermal Loading ◽  
Failure Modes ◽  
Element Model ◽  
Thermally Induced ◽  
Operational Life ◽  
Flip Chip Assembly ◽  
The Individual ◽  
Element Technique

Flip-chip electronic package undergoes thermal loading during its curing process and operational life. Due to the thermal expansion coefficient (CTE) mismatch of various components, the flip-chip assembly experiences various types of thermally induced stresses and strains. Experimental measurement of these stresses and strains is extremely tedious and rigorous due to the physical limitations in the dimensions of the flip-chip assembly. While experiments provide accurate assessment of stresses and strains at certain locations, a parallel finite element (FE) analysis and analytical study can complementarily determine the displacement, strain and stress fields over the entire region of the flip-chip assembly. Such combination of experimental, finite element and analytical studies are ideal to yield a successful stress analysis of the flip-chip assembly under the various loading conditions. In this study, a two-dimensional finite element model of the flip-chip consisting of the silicon chip, underfill, solder ball, copper pad, solder mask and substrate has been developed. Various stress components under thermal loading condition ranging from −40°C to 150°C have been determined using both the finite element and analytical methods. Stresses such as (σ11, σ12, ε12 etc. are extracted and analyzed for the individual components as well as the entire assembly, and the weakest positions of the flip-chip have been discovered. Detailed description of FE modeling is presented and the different failure modes of chip assembly are discussed.

scholarly journals Core Stress Analysis of Amorphous Alloy Transformer for Rail Transit under Different Working Conditions

Energies ◽  
2020 ◽  
Vol 14 (1) ◽  
pp. 164
Author(s):  
Jianwei Shao ◽  
Cuidong Xu ◽  
Ka Wai Eric Cheng
Keyword(s):  
Amorphous Alloy ◽  
Working Conditions ◽  
Short Circuit ◽  
Element Model ◽  
Operating Conditions ◽  
Iron Core ◽  
Rail Transit ◽  
Transit System ◽  
The Core ◽  
Distribution Transformers

The rail transit system is a large electric vehicle system that is strongly dependent on the energy technologies of the power system. The use of new energy-saving amorphous alloy transformers can not only reduce the loss of rail transit power, but also help alleviate the power shortage situation and electromagnetic emissions. The application of the transformer in the field of rail transit is limited by the problem that amorphous alloy is prone to debris. this paper studied the stress conditions of amorphous alloy transformer cores under different working conditions and determined that the location where the core is prone to fragmentation, which is the key problem of smoothly integrating amorphous alloy distribution transformers on rail transit power supply systems. In this study, we investigate the changes in the electromagnetic field and stress of the amorphous alloy transformer core under different operating conditions. The finite element model of an amorphous alloy transformer is established and verified. The simulation results of the magnetic field and stress of the core under different working conditions are given. The no-load current and no-load loss are simulated and compared with the actual experimental data to verify practicability of amorphous alloy transformers. The biggest influence on the iron core is the overload state and the maximum value is higher than the core stress during short circuit. The core strain caused by the side-phase short circuit is larger than the middle-phase short circuit.

scholarly journals A theoretical and numerical approach for selecting miniaturized antenna topologies on magneto-dielectric substrates

2015 ◽  
Vol 7 (3-4) ◽  
pp. 369-377 ◽  
Author(s):  
Alex Pacini ◽  
Alessandra Costanzo ◽  
Diego Masotti
Keyword(s):  
Near Field ◽  
Dielectric Materials ◽  
Numerical Approach ◽  
Operating Conditions ◽  
Microwave Range ◽  
Dielectric Substrates ◽  
Full Wave ◽  
Miniaturized Antenna ◽  
Wavelength Radiation ◽  
Definition Of

An increasing interest is arising in developing miniaturized antennas in the microwave range. However, even when the adopted antennas dimensions are small compared with the wavelength, radiation performances have to be preserved to keep the system-operating conditions. For this purpose, magneto-dielectric materials are currently exploited as promising substrates, which allows us to reduce antenna dimensions by exploiting both relative permittivity and permeability. In this paper, we address generic antennas in resonant conditions and we develop a general theoretical approach, not based on simplified equivalent models, to establish topologies most suitable for exploiting high permeability and/or high-permittivity substrates, for miniaturization purposes. A novel definition of the region pertaining to the antenna near-field and of the associated field strength is proposed. It is then showed that radiation efficiency and bandwidth can be preserved only by a selected combinations of antenna topologies and substrate characteristics. Indeed, by the proposed independent approach, we confirm that non-dispersive magneto-dielectric materials with relative permeability greater than unit, can be efficiently adopted only by antennas that are mainly represented by equivalent magnetic sources. Conversely, if equivalent electric sources are involved, the antenna performances are significantly degraded. The theoretical results are validated by full-wave numerical simulations of reference topologies.

Research on seismic behavior of special-shaped CFST column to H-section steel beam joint

2021 ◽  
pp. 136943322110073
Author(s):  
Yu Cheng ◽  
Yuanlong Yang ◽  
Binyang Li ◽  
Jiepeng Liu
Keyword(s):  
Finite Element ◽  
Finite Element Model ◽  
Seismic Behavior ◽  
Failure Modes ◽  
Joint Stiffness ◽  
Load Ratio ◽  
Element Model ◽  
Steel Tube ◽  
Steel Beam ◽  
Static Test

To investigate the seismic behavior of joint between special-shaped concrete-filled steel tubular (CFST) column and H-section steel beam, a pseudo-static test was carried out on five specimens with scale ratio of 1:2. The investigated factors include stiffening types of steel tube (multi-cell and tensile bar) and connection types (exterior diaphragm and vertical rib). The failure modes, hysteresis curves, skeleton curves, stress distribution, and joint shear deformation of specimens were analyzed to investigate the seismic behaviors of joints. The test results showed the connections of exterior diaphragm and vertical rib have good seismic behavior and can be identified as rigid joint in the frames with bracing system according to Eurocode 3. The joint of special-shaped column with tensile bars have better seismic performance by using through vertical rib connection. Furthermore, a finite element model was established and a parametric analysis with the finite element model was conducted to investigate the influences of following parameters on the joint stiffness: width-to-thickness ratio of column steel tube, beam-to-column linear stiffness ratio, vertical rib dimensions, and axial load ratio of column. Lastly, preliminary design suggestions were proposed.

scholarly journals Experimental and Numerical Investigation on the Steel Reinforced Grout (SRG) Composite-to-Concrete Bond

2020 ◽  
Vol 4 (4) ◽  
pp. 182
Author(s):  
Luciano Ombres ◽  
Salvatore Verre
Keyword(s):  
Bond Length ◽  
Failure Modes ◽  
Peak Load ◽  
Element Model ◽  
Test Results ◽  
Shear Tests ◽  
Bond Slip ◽  
Bond Behavior ◽  
Direct Shear Tests ◽  
Inorganic Matrix

In the paper, the bond between a composite strengthening system consisting of steel textiles embedded into an inorganic matrix (steel reinforced grout, SRG) and the concrete substrate, is investigated. An experimental investigation was carried out on medium density SRG specimens; direct shear tests were conducted on 20 specimens to analyze the effect of the bond length, and the age of the composite strip on the SRG-to-concrete bond behavior. In particular, the tests were conducted considering five bond length (100, 200, 250, 330, and 450 mm), and the composite strip’s age 14th, 21st, and 28th day after the bonding. Test results in the form of peak load, failure modes and, bond-slip diagrams were presented and discussed. A finite element model developed through commercial software to replicate the behavior of SRG strips, is also proposed. The effectiveness of the proposed numerical model was validated by the comparison between its predictions and experimental results.

The Role of Offshore Monitoring in an Effective Deepwater Riser Integrity Management Program

2007 ◽  
Author(s):  
Brittany Goldsmith ◽  
Elizabeth Foyt ◽  
Madhu Hariharan
Keyword(s):  
Failure Modes ◽  
Human Life ◽  
Management Program ◽  
Measured Data ◽  
Operating Conditions ◽  
Environmental Damage ◽  
Positioning Systems ◽  
Integrity Management ◽  
Deepwater Riser

As offshore field developments move into deeper water, one of the greatest challenges is in designing riser systems capable of overcoming the added risks of more severe environments, complicated well requirements and uncertainty of operating conditions. The failure of a primary riser component could lead to unacceptable consequences, including environmental damage, lost production and possible injury or loss of human life. Identification of the risks facing riser systems and management of these risks are essential to ensure that riser systems operate without failure. Operators have recognized the importance of installing instrumentation such as global positioning systems (GPS), vessel motion measurement packages, wind and wave sensors and Acoustic Doppler Current Profiler (ADCP) units to monitor vessel motions and environmental conditions. Additionally, high precision monitoring equipment has been developed for capturing riser response. Measured data from these instruments allow an operator to determine when the limits of acceptable response, predicted by analysis or determined by physical limitations of the riser components, have been exceeded. Regular processing of measured data through automated routines ensures that integrity can be quickly assessed. This is particularly important following extreme events, such as a hurricane or loop current. High and medium alert levels are set for each parameter, based on design analysis and operating data. Measured data is compared with these alert levels, and when an alert level is reached, further response evaluation or inspection of the components in question is recommended. This paper will describe the role of offshore monitoring in an integrity management program and discuss the development of alert levels based on potential failure modes of the riser systems. The paper will further demonstrate how this process is key for an effective integrity management program for deepwater riser systems.

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